LCMXO3LF-9400E-6BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 442368 9400 256-LFBGA

Quantity 899 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3LF-9400E-6BG256C – MachXO3 Field Programmable Gate Array (FPGA) IC 206 442368 9400 256-LFBGA

The LCMXO3LF-9400E-6BG256C is a MachXO3 family FPGA from Lattice Semiconductor designed for flexible system integration. It combines reconfigurable logic with embedded memory and a wide set of on-chip system features described in the MachXO3 family datasheet.

With 9,400 logic elements, approximately 0.44 Mbits of embedded RAM and 206 I/O, this device targets applications that require configurable I/O, compact package integration and non‑volatile, multi‑time programmable configuration options.

Key Features

  • Logic Capacity — 9,400 logic elements to implement glue logic, protocol bridging and moderate-density FPGA functions.
  • Embedded Memory — Approximately 0.44 Mbits (442,368 bits) of on‑chip RAM suitable for FIFOs, small buffers and local data storage.
  • I/O Density — 206 I/O pins for flexible interfacing and signal routing across a variety of external peripherals and buses.
  • Non‑volatile, Multi‑time Programmable Configuration — MachXO3 family configuration features include non‑volatile storage and multi‑time programmability as described in the datasheet.
  • Clocking and Timing — Family-level features include sysCLOCK PLLs and flexible on‑chip clocking infrastructure to support system timing needs.
  • Embedded IP and Peripherals — The MachXO3 family includes hardened IP such as I²C and SPI cores plus timers/counters, enabling offloaded peripheral functions.
  • Programmable I/O and Source‑Synchronous Support — Flexible I/O buffer architecture and pre‑engineered source‑synchronous I/O support for diverse interface requirements (per family datasheet).
  • Power and Configuration Options — On‑chip oscillator, TransFR reconfiguration and standby/power saving modes are included at the family level to support system power management.
  • Package and Mounting — 256‑LFBGA (supplier package listed as 256‑CABGA, 14×14 mm) in a surface‑mount package for compact board designs.
  • Electrical and Environmental — Supply voltage range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C. RoHS compliant.

Typical Applications

  • Interface Bridging and Glue Logic — Use the device’s 206 I/O and programmable logic to consolidate and translate signals between subsystems.
  • System Control and Configuration — Non‑volatile, multi‑time programmable configuration and embedded peripherals support control, sequencing and configuration tasks.
  • On‑board Data Buffering — Approximately 0.44 Mbits of embedded RAM can be used for FIFOs, small buffers and timing domain crossing logic.
  • Compact Embedded Designs — The 256‑LFBGA package and surface‑mount form factor suit space‑constrained PCBs requiring moderate FPGA resources.

Unique Advantages

  • Compact, Moderate‑Density Logic — 9,400 logic elements provide a balance between capability and BOM cost for mid‑level FPGA tasks.
  • High I/O Count — 206 I/O pins enable multi‑peripheral connectivity without external I/O expanders, reducing board complexity.
  • Non‑volatile Configuration — Multi‑time programmable, non‑volatile configuration reduces the need for external configuration flash in many designs.
  • Embedded System IO and IP — Hardened I²C/SPI and timer resources offload common peripheral functions from the fabric, simplifying design.
  • Family‑level Clocking and Power Features — PLLs, on‑chip oscillator and power saving modes provide flexible timing and power management options described in the MachXO3 datasheet.
  • Commercial‑Grade Thermal Range — Rated for 0 °C to 85 °C operation to match mainstream consumer and industrial‑light applications.

Why Choose LCMXO3LF-9400E-6BG256C?

The LCMXO3LF-9400E-6BG256C positions itself as a versatile, mid‑density MachXO3 family FPGA that brings together reconfigurable logic, on‑chip RAM and a high I/O count in a compact 256‑LFBGA package. Its non‑volatile, multi‑time programmable configuration and embedded peripheral IP make it suitable for designers who need reliable configuration, flexible interfacing and moderate logic capacity without adding external configuration components.

This device is appropriate for embedded systems, interface consolidation and control logic where a commercial temperature grade, RoHS compliance and a concise supply voltage specification (1.14–1.26 V) are required. Designers can leverage the MachXO3 family features documented in the datasheet to integrate clocking, power saving and hardened peripheral functions into their system architecture.

If you would like pricing, availability or to request a quote for the LCMXO3LF-9400E-6BG256C, please submit a quote request or contact sales for assistance.

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