LCMXO3LF-9400E-5MG256C

The LCMXO3LF-9400E-5MG256C is a member of the MachXO3 family of Field Programmable Gate Arrays (FPGAs) from Lattice Semiconductor. It combines reconfigurable logic, embedded block memory and flexible on-chip clocking with hardened system functions and programmable I/O to support a wide range of control and interface tasks.

With 9,400 logic elements, approximately 0.44 Mbits of embedded RAM, 206 I/Os and non-volatile, multi-time programmable configuration, this device is targeted at designs that require reconfigurable logic, moderate embedded memory and a high count of I/O in a compact 256‑VFBGA surface-mount package.

Key Features

• Logic Capacity — 9,400 logic elements for implementing combinational and sequential logic functions.
• Embedded Memory — 442,368 total RAM bits (approximately 0.44 Mbits) with support for single, dual, pseudo-dual port and FIFO modes for buffering and storage.
• I/O and Packaging — 206 programmable I/Os in a 256‑VFBGA / CSPBGA (256‑CSFBGA, 9×9) surface-mount package to support dense interfacing requirements.
• Power and Operating Range — Core voltage supply range 1.14 V to 1.26 V; commercial-grade operating temperature 0 °C to 85 °C.
• Non‑volatile, Multi‑time Programmable Configuration — MachXO3 family capability for non-volatile configuration and TransFR reconfiguration options for field updates.
• Clocking and Timing — Flexible on-chip clocking including sysCLOCK PLLs and an on-chip oscillator for clock generation and conditioning.
• Embedded Hardened IP — Includes hardened IP building blocks such as I²C and SPI cores and timer/counter functions to simplify system integration.
• Programmable I/O and High-speed I/O Support — Programmable I/O cells and gearbox logic to adapt data widths and support source-synchronous I/O use cases described in the MachXO3 family data sheet.
• System and Configuration Features — User Flash Memory (UFM), boundary-scan testability, and configuration/testing features documented in the MachXO3 family data sheet.
• Compliance — RoHS compliant.

Typical Applications

• Programmable glue logic and control — Reconfigurable logic and plentiful I/O make the device suitable for implementing board-level control, protocol bridging and system glue functions.
• Interface buffering and timing — Embedded RAM and programmable I/O support buffering, FIFO implementations and source-synchronous interface adaptation.
• Integrated peripheral offload — Hardened I²C, SPI and timer/counter IP reduce external component count for peripheral control and monitoring tasks.

Unique Advantages

• Compact, high‑I/O package: 206 I/Os in a 256‑VFBGA (9×9) package provide dense connection options while maintaining a small board footprint.
• Non‑volatile configuration: Multi-time programmable, non-volatile configuration removes the need for separate configuration memory in many system designs.
• Embedded memory versatility: Approximately 0.44 Mbits of RAM with multiple port and FIFO modes enables local buffering and memory-intensive control functions without external RAM.
• Built-in system IP: Hardened I²C, SPI and timer/counter blocks accelerate development and reduce BOM by integrating common interfaces on-chip.
• Flexible clocking: On-chip oscillator and PLLs provide configurable clocking options for diverse timing architectures and source-synchronous I/O.
• Commercial‑grade reliability: Designed for 0 °C to 85 °C operation and RoHS compliance for standard commercial applications.

Why Choose LCMXO3LF-9400E-5MG256C?

The LCMXO3LF-9400E-5MG256C offers a balanced combination of logic capacity, embedded memory and high I/O count in a compact 256‑VFBGA surface-mount package. As part of the MachXO3 family, it provides non-volatile configuration, flexible on‑chip clocking and hardened IP blocks that simplify system design and reduce external component requirements.

This device is well suited for teams needing reconfigurable logic with integrated memory and peripheral interfaces in commercial temperature environments. Its feature set supports scalable designs where field reconfiguration, interface integration and on-chip buffering are important considerations.

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