LCMXO3LF-9400E-5BG400I
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA |
|---|---|
| Quantity | 160 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 400-CABGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-LFBGA | Number of I/O | 335 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1175 | Number of Logic Elements/Cells | 9400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of LCMXO3LF-9400E-5BG400I – MachXO3 Field Programmable Gate Array (FPGA), 9,400 logic elements, 335 I/O, 400-LFBGA
The LCMXO3LF-9400E-5BG400I is a MachXO3 family FPGA in a compact 400‑LFBGA package targeted for mid-density programmable logic applications. It combines 9,400 logic elements with a high I/O count and embedded RAM, delivered in an industrial-grade device designed for robust operation across -40 °C to 100 °C.
Built on MachXO3 family architecture, the device emphasizes non-volatile, multi-time programmable configuration, flexible on‑chip clocking and I/O, and a range of embedded system features to simplify integration in control, interface and glue-logic functions.
Key Features
- Programmable Logic Capacity 9,400 logic elements provide mid-density programmable resources suitable for glue logic, state machines and control functions.
- Embedded Memory Approximately 0.44 Mbits (442,368 bits) of on-chip RAM with support for single, dual, pseudo-dual port and FIFO modes as described in family documentation.
- High I/O Count & Flexible I/O 335 I/O pins with pre-engineered source synchronous I/O and flexible on-chip I/O buffer options to support a variety of interface requirements.
- Non-volatile, Multi-time Programmable Configuration MachXO3 family non-volatile configuration and TransFR reconfiguration capabilities enable in-system programmability without external configuration ROM.
- Embedded Hardened IP and Peripherals On-chip hardened functions referenced in the family data include I²C, SPI, timer/counter, on-chip oscillator and User Flash Memory (UFM) to reduce external component count.
- Clocking and Performance Flexible on-chip clocking, including PLLs and system clock distribution features provided by the MachXO3 family architecture for synchronized designs.
- Power and Standby Options Standby mode and power saving options described in the family documentation help manage system power use.
- Package & Mounting Surface-mount 400‑LFBGA package (supplier device package: 400‑CABGA, 17 × 17 mm) for compact board implementations.
- Operating Conditions Defined core voltage supply range of 1.14 V to 1.26 V and industrial operating temperature range of -40 °C to 100 °C.
- Testability and Configuration Support IEEE 1149.1-compatible boundary scan testability and enhanced system-level support features as part of the MachXO3 family.
Typical Applications
- Industrial Control & Automation Industrial temperature rating and 335 I/O make this device suitable for control logic, I/O aggregation and interface tasks in factory and process automation systems.
- I/O Bridging and Protocol Conversion Flexible I/O buffers and source-synchronous I/O support enable bridging between disparate interfaces and implementing protocol adaptation logic.
- User Interface and Embedded Control 9,400 logic elements plus embedded peripherals and UFM can implement touch/button controllers, display interfaces and local control state machines.
- System Glue Logic and Configuration Management Non-volatile, multi-time programmable configuration and embedded hardened IP reduce external components for board-level glue and system configuration tasks.
Unique Advantages
- High I/O density: 335 I/O pins enable broad connectivity for complex board-level interfacing without multiple discrete translators.
- Integrated non-volatile configuration: Multi-time programmable, non-volatile configuration removes the need for external configuration memory in many designs.
- Embedded peripherals reduce BOM: Hardened I²C, SPI, timers and on-chip oscillator reduce external components and simplify firmware integration.
- Industrial-grade operation: Rated for -40 °C to 100 °C, suitable for systems requiring extended temperature capability.
- Compact surface-mount package: 400‑LFBGA (400‑CABGA, 17×17 mm) provides a small footprint for space-constrained applications.
- Defined core supply range: Operates from 1.14 V to 1.26 V core voltage, enabling predictable power system design.
Why Choose LCMXO3LF-9400E-5BG400I?
LCMXO3LF-9400E-5BG400I delivers a balanced combination of mid-density logic, substantial I/O resources and embedded memory in a compact industrial-grade package. As part of the MachXO3 family, it brings non-volatile configuration, flexible on-chip clocking and hardened peripheral IP that simplify board design and reduce bill-of-materials for control, interface and glue-logic tasks.
This device is well suited for embedded systems and OEM designs that require reliable operation across extended temperatures, high I/O flexibility and integrated configuration capabilities. Designers benefit from MachXO3 family features such as reconfiguration options, embedded memory modes and system-level support to scale or migrate designs within the family.
Request a quote or submit an inquiry for pricing and availability of LCMXO3LF-9400E-5BG400I to discuss how this MachXO3 FPGA can fit into your next design.

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