LCMXO3LF-9400E-5BG400I

IC FPGA 335 I/O 400CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA

Quantity 160 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package400-CABGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case400-LFBGANumber of I/O335Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3LF-9400E-5BG400I – MachXO3 Field Programmable Gate Array (FPGA), 9,400 logic elements, 335 I/O, 400-LFBGA

The LCMXO3LF-9400E-5BG400I is a MachXO3 family FPGA in a compact 400‑LFBGA package targeted for mid-density programmable logic applications. It combines 9,400 logic elements with a high I/O count and embedded RAM, delivered in an industrial-grade device designed for robust operation across -40 °C to 100 °C.

Built on MachXO3 family architecture, the device emphasizes non-volatile, multi-time programmable configuration, flexible on‑chip clocking and I/O, and a range of embedded system features to simplify integration in control, interface and glue-logic functions.

Key Features

  • Programmable Logic Capacity  9,400 logic elements provide mid-density programmable resources suitable for glue logic, state machines and control functions.
  • Embedded Memory  Approximately 0.44 Mbits (442,368 bits) of on-chip RAM with support for single, dual, pseudo-dual port and FIFO modes as described in family documentation.
  • High I/O Count & Flexible I/O  335 I/O pins with pre-engineered source synchronous I/O and flexible on-chip I/O buffer options to support a variety of interface requirements.
  • Non-volatile, Multi-time Programmable Configuration  MachXO3 family non-volatile configuration and TransFR reconfiguration capabilities enable in-system programmability without external configuration ROM.
  • Embedded Hardened IP and Peripherals  On-chip hardened functions referenced in the family data include I²C, SPI, timer/counter, on-chip oscillator and User Flash Memory (UFM) to reduce external component count.
  • Clocking and Performance  Flexible on-chip clocking, including PLLs and system clock distribution features provided by the MachXO3 family architecture for synchronized designs.
  • Power and Standby Options  Standby mode and power saving options described in the family documentation help manage system power use.
  • Package & Mounting  Surface-mount 400‑LFBGA package (supplier device package: 400‑CABGA, 17 × 17 mm) for compact board implementations.
  • Operating Conditions  Defined core voltage supply range of 1.14 V to 1.26 V and industrial operating temperature range of -40 °C to 100 °C.
  • Testability and Configuration Support  IEEE 1149.1-compatible boundary scan testability and enhanced system-level support features as part of the MachXO3 family.

Typical Applications

  • Industrial Control & Automation  Industrial temperature rating and 335 I/O make this device suitable for control logic, I/O aggregation and interface tasks in factory and process automation systems.
  • I/O Bridging and Protocol Conversion  Flexible I/O buffers and source-synchronous I/O support enable bridging between disparate interfaces and implementing protocol adaptation logic.
  • User Interface and Embedded Control  9,400 logic elements plus embedded peripherals and UFM can implement touch/button controllers, display interfaces and local control state machines.
  • System Glue Logic and Configuration Management  Non-volatile, multi-time programmable configuration and embedded hardened IP reduce external components for board-level glue and system configuration tasks.

Unique Advantages

  • High I/O density: 335 I/O pins enable broad connectivity for complex board-level interfacing without multiple discrete translators.
  • Integrated non-volatile configuration: Multi-time programmable, non-volatile configuration removes the need for external configuration memory in many designs.
  • Embedded peripherals reduce BOM: Hardened I²C, SPI, timers and on-chip oscillator reduce external components and simplify firmware integration.
  • Industrial-grade operation: Rated for -40 °C to 100 °C, suitable for systems requiring extended temperature capability.
  • Compact surface-mount package: 400‑LFBGA (400‑CABGA, 17×17 mm) provides a small footprint for space-constrained applications.
  • Defined core supply range: Operates from 1.14 V to 1.26 V core voltage, enabling predictable power system design.

Why Choose LCMXO3LF-9400E-5BG400I?

LCMXO3LF-9400E-5BG400I delivers a balanced combination of mid-density logic, substantial I/O resources and embedded memory in a compact industrial-grade package. As part of the MachXO3 family, it brings non-volatile configuration, flexible on-chip clocking and hardened peripheral IP that simplify board design and reduce bill-of-materials for control, interface and glue-logic tasks.

This device is well suited for embedded systems and OEM designs that require reliable operation across extended temperatures, high I/O flexibility and integrated configuration capabilities. Designers benefit from MachXO3 family features such as reconfiguration options, embedded memory modes and system-level support to scale or migrate designs within the family.

Request a quote or submit an inquiry for pricing and availability of LCMXO3LF-9400E-5BG400I to discuss how this MachXO3 FPGA can fit into your next design.

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