LCMXO3LF-9400E-5BG256C

The LCMXO3LF-9400E-5BG256C is a MachXO3 family FPGA from Lattice Semiconductor Corporation. It delivers a non-volatile, multi-time programmable FPGA architecture with flexible on-chip clocking and embedded system-level features suitable for a wide range of embedded control and interface designs.

With 9,400 logic elements, approximately 0.42 Mbits of embedded RAM, and 206 user I/O, this 256-LFBGA surface-mount device targets applications requiring moderate logic density, substantial I/O capacity, and integrated configuration and peripheral functions while operating on a low-voltage supply.

Key Features

• Core Capacity — 9,400 logic elements to implement moderate-density digital logic and control functions.
• Embedded Memory — Approximately 0.42 Mbits of on-chip RAM (442,368 total RAM bits) for data buffering, FIFOs, and small local memories.
• I/O Density — 206 user I/O pins to support multiple interfaces, parallel buses, and broad signal connectivity.
• Non-volatile Configuration — Multi-time programmable, non-volatile configuration and TransFR reconfiguration support for in-system updates and persistent designs.
• On-chip Clocking and PLLs — Flexible on-chip clocking and phase-locked loops (PLLs) for multiple clock domains and timing management.
• Embedded Hardened IP — Hardened I²C, SPI, timer/counter blocks and user flash memory (UFM) to simplify common peripheral tasks and system control.
• System-level Features — IEEE 1149.1-compliant boundary scan, hot-socketing support, and on-chip oscillator options for board-level test and basic timing needs.
• Package and Mounting — 256-LFBGA (supplier package 256-CABGA, 14×14 mm), surface-mount mounting for compact board designs.
• Power and Temperature — Low-voltage operation (1.14 V to 1.26 V) and commercial temperature grade (0 °C to 85 °C).
• RoHS Compliance — Conforms to RoHS environmental requirements.

Typical Applications

• Embedded Control and Glue Logic — Implement custom control sequences, protocol bridging, and board-level glue logic where non-volatile configuration is required.
• Consumer Electronics — Use for device control, I/O aggregation, and peripheral management in consumer devices within the commercial temperature range.
• Instrumentation and Test Equipment — Leverage on-chip RAM, multiple I/O, and boundary-scan for flexible measurement, data buffering, and test functions.
• Communications and Connectivity — Manage parallel and serial interfaces with the device’s 206 I/O and programmable I/O cell features.

Unique Advantages

• Integrated Non-Volatile FPGA — Retains configuration without external memory, simplifying system boot and reducing BOM complexity.
• Balanced Logic and Memory — 9,400 logic elements paired with ~0.42 Mbits of embedded RAM provide an effective balance for control-oriented and interface designs.
• High I/O Count — 206 I/O pins allow consolidation of multiple signals and interfaces onto a single device, reducing board-level routing and component count.
• Compact, Surface-Mount Package — 256-LFBGA (14×14 mm) enables a small PCB footprint for space-constrained applications.
• System-Level Test and Update Support — Boundary-scan and TransFR reconfiguration simplify manufacturing test and in-field updates.
• Commercial Temperature and Low-Voltage Operation — Designed for standard commercial environments with a 1.14 V–1.26 V supply range, supporting modern low-voltage system rails.

Why Choose LCMXO3LF-9400E-5BG256C?

The LCMXO3LF-9400E-5BG256C positions itself as a flexible, non-volatile FPGA solution for designs that need moderate logic capacity, substantial I/O, and integrated system features without relying on external configuration memory. Its MachXO3 family heritage provides on-chip clocking, hardened peripheral IP, and configuration mechanisms that simplify board integration and support iterative development.

This device is appropriate for engineers and procurement teams developing commercial-temperature embedded systems, consumer products, instruments, and communication interfaces that benefit from a compact 256-LFBGA package, RoHS compliance, and Lattice Semiconductor’s MachXO3 architecture capabilities.

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