LCMXO3LF-9400C-6BG484C

IC FPGA 384 I/O 484CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 384 442368 9400 484-LFBGA

Quantity 1,045 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-CABGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-LFBGANumber of I/O384Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3LF-9400C-6BG484C – MachXO3 FPGA, 9,400 Logic Elements, 384 I/Os, 484-LFBGA

The LCMXO3LF-9400C-6BG484C is a MachXO3 family field programmable gate array (FPGA) IC offering 9,400 logic elements and 384 general-purpose I/O pins in a 484‑LFBGA package. It provides non-volatile, multi-time programmable logic with on-chip clocking, flexible I/O and embedded system features suited to control, interfacing and glue‑logic roles in commercial electronic designs.

Built with a combination of abundant I/O, programmable logic fabric and embedded resources, the device targets system-level integration where configurable I/O, memory and hardened peripherals simplify board-level design and reduce component count.

Key Features

  • Logic Fabric — Approximately 9,400 logic elements and 1,175 CLBs for mid-density programmable logic and combinational/sequential logic implementation.
  • Embedded Memory — Approximately 0.44 Mbits (442,368 bits) of on-chip RAM with support for single/dual/pseudo-dual port and FIFO configurations as described in the MachXO3 family architecture.
  • High‑Density I/O — 384 user I/O pins with high-performance, flexible I/O buffers and pre‑engineered source‑synchronous I/O support for interface and timing flexibility.
  • Clocking — Flexible on‑chip clocking architecture with sysCLOCK phase-locked loops (PLLs) for clock distribution and jitter management.
  • Embedded Hardened IP — Includes hardened I²C and SPI IP cores, timers/counters and an on‑chip oscillator to accelerate common system functions and reduce external components.
  • Non‑volatile Configuration & Reconfiguration — Multi‑time programmable non‑volatile architecture with TransFR reconfiguration options and user flash memory (UFM) for stored data and configuration features.
  • System Reliability & Testability — IEEE 1149.1‑compliant boundary scan testability and power‑on reset features to aid system bring‑up and manufacturing test.
  • Power & Operating Range — Single supply operation from 2.375 V to 3.465 V with standby and power‑saving options; commercial operating temperature 0 °C to 85 °C.
  • Package & Mounting — 484‑LFBGA (supplier package 484‑CABGA, 19 × 19 mm) surface mount package; RoHS compliant.

Typical Applications

  • Interface Bridging and I/O Expansion — Use the large I/O count and flexible I/O buffers to implement protocol translators, bus bridges or parallel/serial interface expansion on commercial products.
  • System Control and Glue Logic — Deploy as board‑level control logic to consolidate discrete glue components, implement sequencers, reset/state machines and peripheral control.
  • Embedded Peripherals Integration — Leverage hardened I²C/SPI cores, timers and on‑chip oscillator to integrate peripheral handling and reduce external parts.

Unique Advantages

  • Highly Integrated I/O and Logic: 384 I/Os combined with 9,400 logic elements enables consolidation of multiple discrete devices into a single FPGA footprint.
  • Flexible On‑Chip Memory Modes: The embedded memory supports RAM, ROM and FIFO configurations to address diverse buffering and storage needs without added external memory.
  • Built‑in Hardened IP: Hardened I²C and SPI cores plus timers reduce development time and board‑level component count for common system tasks.
  • Non‑volatile, Reconfigurable: Multi‑time programmable non‑volatile configuration and user flash memory support in-system updates and stored configuration data.
  • Commercial‑Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial electronics applications.
  • Advanced Packaging: 484‑LFBGA (19 × 19 mm) surface mount package provides a compact, high‑pin‑count footprint for dense designs.

Why Choose LCMXO3LF-9400C-6BG484C?

This MachXO3 device balances mid-range logic density with a high I/O count and integrated system features, making it well suited for commercial designs that require flexible interfacing, on‑board control and reduced BOM complexity. Its combination of approximately 9,400 logic elements, roughly 0.44 Mbits of embedded memory and hardened peripheral IP supports rapid integration of common system functions.

Designers building interface bridges, control logic or embedded peripherals will find the LCMXO3LF-9400C-6BG484C a practical option for consolidating functionality, enabling in‑system reconfiguration and simplifying board-level design with a commercial temperature rating and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO3LF-9400C-6BG484C.

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