LCMXO3LF-9400E-6BG256I

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 442368 9400 256-LFBGA

Quantity 1,508 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3LF-9400E-6BG256I – MachXO3 Field Programmable Gate Array (FPGA) IC

The LCMXO3LF-9400E-6BG256I is a MachXO3 family FPGA offering a flexible, non-volatile programmable fabric targeted at industrial embedded applications. It integrates approximately 9,400 logic elements with on-chip embedded memory and a broad I/O complement to support glue-logic, control, and interface consolidation tasks.

Designed for surface-mount assembly in a 256-LFBGA package (256-CABGA, 14×14), this device operates from a 1.14 V to 1.26 V supply and across an industrial temperature range (−40 °C to 100 °C), delivering a compact, reconfigurable building block for system designers.

Key Features

  • Programmable Logic Capacity — Approximately 9,400 logic elements to implement control, glue logic, and custom state machines.
  • Embedded Memory — Approximately 0.42 Mbits of on-chip RAM (442,368 bits) for FIFOs, buffers, and small data arrays.
  • High I/O Count — 206 user I/O pins suitable for broad sensor, peripheral, and interface connectivity.
  • Non-volatile, Multi-time Programmable — MachXO3 family supports non-volatile configuration and multiple reprogram cycles for field updates and design iteration.
  • Flexible I/O and Clocking — Family-level features include flexible on-chip clocking and pre-engineered source-synchronous I/O options to support a range of interface needs.
  • Advanced Packaging & Mounting — 256-LFBGA (256-CABGA, 14×14) surface-mount package for compact PCB integration.
  • Industrial Temperature Grade — Rated for −40 °C to 100 °C operation for deployment in industrial environments.
  • Low-Voltage Core — Operates from a 1.14 V to 1.26 V supply rail for the core power domain.
  • RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

  • Industrial Control — Implement custom state machines, interlocks, and interface bridging for PLCs, motor drives, and factory automation modules.
  • Communications & Networking — Use as protocol glue, I/O aggregation, and timing control between transceivers and baseband processing units.
  • Consumer & IoT Devices — Integrate user-interface control, sensor aggregation, and peripheral conditioning in compact product designs.
  • Embedded Systems — Replace multiple discrete logic devices with a single programmable device for BOM reduction and faster design iterations.

Unique Advantages

  • Highly integrated solution: Combines ~9,400 logic elements, ~0.42 Mbits of embedded RAM, and 206 I/Os to reduce component count and simplify board-level design.
  • Non-volatile configuration: Retains programmed functionality without external configuration memory, simplifying power-up sequencing and system architecture.
  • Industrial temperature range: Rated from −40 °C to 100 °C to meet demanding environmental requirements in industrial deployments.
  • Compact, board-friendly package: 256-LFBGA (14×14) enables dense layouts while supporting surface-mount assembly processes.
  • Flexible clocking and I/O: Family-level features for on-chip PLLs and configurable I/O buffers provide adaptable interface timing and signaling options.
  • RoHS compliance: Facilitates lead-free manufacturing and environmental regulatory alignment.

Why Choose LCMXO3LF-9400E-6BG256I?

The LCMXO3LF-9400E-6BG256I positions itself as a flexible, industrial-grade FPGA option for designers who need moderate logic capacity, substantial I/O density, and embedded memory in a compact package. Its non-volatile programmability and family-level features such as flexible I/O buffering and on-chip clocking make it well suited for system control, interface bridging, and integration tasks where reducing BOM and improving system flexibility are priorities.

Choose this device when you need a reprogrammable, board-level building block that supports industrial temperature operation and a compact LFBGA footprint—offering a balance of performance, integration, and durability backed by the MachXO3 family architecture.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for LCMXO3LF-9400E-6BG256I. Our team can provide the details needed to evaluate this device for your next design.

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