LCMXO3LF-9400E-6BG256I
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 206 442368 9400 256-LFBGA |
|---|---|
| Quantity | 1,508 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1175 | Number of Logic Elements/Cells | 9400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of LCMXO3LF-9400E-6BG256I – MachXO3 Field Programmable Gate Array (FPGA) IC
The LCMXO3LF-9400E-6BG256I is a MachXO3 family FPGA offering a flexible, non-volatile programmable fabric targeted at industrial embedded applications. It integrates approximately 9,400 logic elements with on-chip embedded memory and a broad I/O complement to support glue-logic, control, and interface consolidation tasks.
Designed for surface-mount assembly in a 256-LFBGA package (256-CABGA, 14×14), this device operates from a 1.14 V to 1.26 V supply and across an industrial temperature range (−40 °C to 100 °C), delivering a compact, reconfigurable building block for system designers.
Key Features
- Programmable Logic Capacity — Approximately 9,400 logic elements to implement control, glue logic, and custom state machines.
- Embedded Memory — Approximately 0.42 Mbits of on-chip RAM (442,368 bits) for FIFOs, buffers, and small data arrays.
- High I/O Count — 206 user I/O pins suitable for broad sensor, peripheral, and interface connectivity.
- Non-volatile, Multi-time Programmable — MachXO3 family supports non-volatile configuration and multiple reprogram cycles for field updates and design iteration.
- Flexible I/O and Clocking — Family-level features include flexible on-chip clocking and pre-engineered source-synchronous I/O options to support a range of interface needs.
- Advanced Packaging & Mounting — 256-LFBGA (256-CABGA, 14×14) surface-mount package for compact PCB integration.
- Industrial Temperature Grade — Rated for −40 °C to 100 °C operation for deployment in industrial environments.
- Low-Voltage Core — Operates from a 1.14 V to 1.26 V supply rail for the core power domain.
- RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.
Typical Applications
- Industrial Control — Implement custom state machines, interlocks, and interface bridging for PLCs, motor drives, and factory automation modules.
- Communications & Networking — Use as protocol glue, I/O aggregation, and timing control between transceivers and baseband processing units.
- Consumer & IoT Devices — Integrate user-interface control, sensor aggregation, and peripheral conditioning in compact product designs.
- Embedded Systems — Replace multiple discrete logic devices with a single programmable device for BOM reduction and faster design iterations.
Unique Advantages
- Highly integrated solution: Combines ~9,400 logic elements, ~0.42 Mbits of embedded RAM, and 206 I/Os to reduce component count and simplify board-level design.
- Non-volatile configuration: Retains programmed functionality without external configuration memory, simplifying power-up sequencing and system architecture.
- Industrial temperature range: Rated from −40 °C to 100 °C to meet demanding environmental requirements in industrial deployments.
- Compact, board-friendly package: 256-LFBGA (14×14) enables dense layouts while supporting surface-mount assembly processes.
- Flexible clocking and I/O: Family-level features for on-chip PLLs and configurable I/O buffers provide adaptable interface timing and signaling options.
- RoHS compliance: Facilitates lead-free manufacturing and environmental regulatory alignment.
Why Choose LCMXO3LF-9400E-6BG256I?
The LCMXO3LF-9400E-6BG256I positions itself as a flexible, industrial-grade FPGA option for designers who need moderate logic capacity, substantial I/O density, and embedded memory in a compact package. Its non-volatile programmability and family-level features such as flexible I/O buffering and on-chip clocking make it well suited for system control, interface bridging, and integration tasks where reducing BOM and improving system flexibility are priorities.
Choose this device when you need a reprogrammable, board-level building block that supports industrial temperature operation and a compact LFBGA footprint—offering a balance of performance, integration, and durability backed by the MachXO3 family architecture.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for LCMXO3LF-9400E-6BG256I. Our team can provide the details needed to evaluate this device for your next design.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016