LCMXO3LF-9400E-6MG256C

The LCMXO3LF-9400E-6MG256C is a MachXO3 family field-programmable gate array (FPGA) from Lattice Semiconductor. It delivers 9,400 logic elements with approximately 0.44 Mbits of embedded RAM and up to 206 programmable I/Os in a 256‑VFBGA (9×9) surface-mount package.

Built for commercial-grade designs, this device combines non‑volatile, multi-time programmable configuration with family-level system features such as flexible on‑chip clocking, programmable I/O, and embedded peripheral IP to support a variety of control, interface and glue-logic applications where integration and I/O density matter.

Key Features

• Logic Capacity: 9,400 logic elements for implementing control, glue logic, and moderate-complexity FPGA functions.
• Embedded Memory: Approximately 0.44 Mbits of on-chip RAM for buffering, state storage, and small FIFOs.
• I/O Density: 206 programmable I/Os to support complex board-level interfacing and signal routing.
• Package & Mounting: 256‑VFBGA (256‑CSFBGA, 9×9) surface-mount package suitable for compact PCB designs.
• Power Supply Range: Supported core voltage from 1.14 V to 1.26 V.
• Operating Conditions: Commercial temperature grade with an operating range of 0 °C to 85 °C; RoHS compliant.
• Non-volatile Configuration: Family-level capability for non‑volatile, multi‑time programmable configuration for persistent designs and easy field updates.
• Flexible On-chip Clocking: Family architecture includes clocking resources such as PLLs and distribution networks for system timing requirements.
• Programmable I/O and I/O Buffering: Pre‑engineered source‑synchronous I/O, programmable I/O cells and multiple I/O buffer banks for flexible interface standards and signal conditioning.
• Embedded System IP: Family-level hardened IP blocks cited in the datasheet include I²C, SPI and timer/counter primitives, plus user flash memory (UFM) and configuration/test features (including IEEE 1149.1 boundary scan).

Typical Applications

• System Glue Logic: Board-level protocol bridging, signal conditioning and control logic using the device's 9,400 logic elements and 206 I/Os.
• Interface and I/O Expansion: High-density I/O support for adding or consolidating interfaces on compact PCBs thanks to the 256‑VFBGA package and large I/O count.
• Embedded Control Functions: Implement timers, SPI/I²C peripherals and state machines using embedded hardened IP and on‑chip memory for small control tasks.

Unique Advantages

• High I/O integration: 206 programmable I/Os let you implement complex interfacing without extensive external logic, simplifying board routing and reducing BOM.
• Non‑volatile configuration: Multi‑time programmable configuration retains design state across power cycles and supports field reprogramming scenarios.
• Compact package: 256‑VFBGA (9×9) surface-mount footprint enables space-constrained designs while preserving routing and thermal characteristics expected for a VFBGA package.
• Embedded memory for on-chip buffering: Approximately 0.44 Mbits of embedded RAM supports FIFO, buffering and small local data storage without external memory.
• Family-level system features: On-chip PLLs, programmable I/O cells, hardened peripheral IP and configuration/test support in the MachXO3 family help accelerate integration and validation.

Why Choose LCMXO3LF-9400E-6MG256C?

This MachXO3 FPGA part balances moderate logic capacity with high I/O density and embedded memory in a compact 256‑VFBGA surface-mount package, making it well suited for commercial designs that require on‑board programmability, interface consolidation and persistent configuration. With a defined core voltage range (1.14 V–1.26 V), commercial operating temperature range (0 °C–85 °C) and RoHS compliance, the device provides a clear specification set for procurement and system integration.

Choose this device when you need a non‑volatile, multi‑time programmable FPGA with abundant I/O and embedded system features from the MachXO3 family to simplify board-level logic, accelerate prototyping and support field updates without relying on external configuration storage.

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