LCMXO640C-3BN256C

The LCMXO640C-3BN256C is a MachXO family FPGA IC designed for single‑chip, non‑volatile logic integration. It combines a dense array of logic elements with a high I/O count and flexible power rails to address common glue logic, bus bridging, interfacing, power‑up control and system control requirements.

Built for instant-on operation and in‑field reconfiguration, this surface‑mount 256‑LFBGA (256‑CABGA, 14×14) device delivers 640 logic elements and up to 159 I/Os while operating across a wide supply range and commercial temperature window.

Key Features

• Non‑volatile, instant‑on architecture – Single‑chip solution with no external configuration memory required; device powers up in microseconds for fast system start.
• Reconfigurable logic – Supports SRAM‑based logic reconfiguration in milliseconds and non‑volatile memory programming through JTAG; TransFR™ Reconfiguration enables in‑field logic updates while the system operates.
• Logic density – 640 logic elements provide mid‑range capacity for glue logic and control functions.
• High I/O count – Up to 159 I/Os in the 256‑ball BGA package to support multi‑bus and peripheral interfacing.
• Flexible I/O signaling – sysIO™ buffer support for multiple interfaces and voltage standards, including LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS (family feature).
• Power and low‑power modes – Operates across a wide supply range (1.71 V to 3.465 V) and includes a Sleep Mode for substantial static current reduction (family feature).
• Package and mounting – Surface‑mount 256‑LFBGA / 256‑CABGA (14×14 mm) package for compact board integration; RoHS compliant.
• Commercial temperature grade – Rated for 0 °C to 85 °C operation to match a broad set of commercial applications.

Typical Applications

• Glue Logic and System Control – Implement board‑level control, reset sequencing and finite state machines using on‑chip logic elements for simplified system design.
• Bus Bridging and Interfacing – Bridge and translate between different bus standards using the device’s high I/O count and flexible I/O buffer support.
• Power‑up and Sequencing Control – Fast, deterministic startup behavior with single‑chip non‑volatile configuration for reliable power‑on control.
• Peripheral and Interface Management – Manage multiple peripheral interfaces and I/O expansions where compact packaging and many I/Os are required.

Unique Advantages

• Single‑chip, non‑volatile solution: Eliminates external configuration memory and shortens system BOM while providing instant‑on capability.
• In‑field reconfiguration (TFR): Update logic while the system is running to enable field upgrades and iterative design improvements with minimal downtime.
• Flexible voltage support: Wide supply range (1.71 V to 3.465 V) accommodates mixed‑voltage systems and simplifies power rail design.
• High I/O count in a compact package: 159 I/Os in a 256‑ball BGA allow dense interfacing in space‑constrained designs.
• Low‑power options: Sleep Mode provides significant static current reduction for power‑sensitive applications.
• Design tool and ecosystem support: MachXO family design flows are supported by Lattice development tools (family feature) to streamline synthesis, place-and-route and timing closure.

Why Choose LCMXO640C-3BN256C?

LCMXO640C-3BN256C positions as a mid‑density, commercially graded MachXO device that balances logic capacity, I/O richness and compact packaging. Its non‑volatile instant‑on behavior and in‑field reconfiguration capability make it suitable for designs that require rapid startup, flexible updates and reduced system complexity.

Choose this device when you need a compact, RoHS‑compliant FPGA with 640 logic elements, up to 159 I/Os, wide supply support and a commercial temperature rating—especially for glue logic, bus interfacing and control tasks where single‑chip integration reduces BOM and simplifies board design.

Request a quote or submit a purchasing inquiry to evaluate LCMXO640C-3BN256C for your next design.