LCMXO3LF-4300E-5MG324I

The LCMXO3LF-4300E-5MG324I is a MachXO3 family FPGA IC offered in a 324-VFBGA package for surface-mount assembly. It provides a compact, non-volatile programmable logic option with on-chip embedded memory and a broad I/O count for industrial embedded control and interface applications.

As a member of the MachXO3 family, this device implements the architecture and system-level features described in the MachXO3 data sheet, including flexible I/O, on-chip clocking and embedded hardened IP functions suitable for control, glue-logic and system integration tasks.

Key Features

• Logic Capacity — 4,320 logic elements for implementing glue logic, control finite state machines, and moderate-density programmable logic functions.
• Embedded Memory — 94,208 total RAM bits (approximately 0.094 Mbits) of on-chip RAM for FIFOs, buffers and small lookup tables.
• I/O Density — 268 user I/O pins to support broad peripheral interfacing and board-level signal routing.
• Packaging — 324-VFBGA (supplier package: 324-CSFBGA 10×10) supporting compact, surface-mount designs.
• Supply Voltage — Core supply range 1.14 V to 1.26 V for compatibility with specified system power rails.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation for industrial environments.
• Non-volatile, Multi-time Programmable — MachXO3 family characteristics include non-volatile configuration and multi-time programmability for in-field updates and secure boot/initialization scenarios.
• On-chip System Features — Family-level features documented in the MachXO3 data sheet include flexible on-chip clocking (PLLs), an on-chip oscillator, programmable I/O cells, embedded block RAM modes, and hardened peripheral IP (I²C, SPI, timers/counters).
• Mounting and Compliance — Surface-mount device with RoHS compliance.

Typical Applications

• Industrial Control — Implement system glue logic, protocol bridging, and control-state machines within industrial equipment using the device’s logic elements and on-chip memory.
• Interface and I/O Expansion — Use the 268 I/O pins to aggregate and buffer signals between microcontrollers, sensors and peripheral modules.
• Embedded System Integration — Integrate PLL-based clocking, on-chip oscillator, and hardened IP functions for small system functions and peripheral management.
• Configuration and Security — Leverage the MachXO3 family’s non-volatile, multi-time programmable configuration for field updates and system initialization tasks.

Unique Advantages

• Compact, high-density package: The 324-VFBGA package enables a small board footprint while providing a large number of I/Os for dense designs.
• Balanced logic and memory: 4,320 logic elements paired with 94,208 bits of embedded RAM supports a wide range of glue-logic and buffering functions without external memory.
• Industrial-ready temperature range: Rated from −40 °C to 100 °C to meet many industrial application thermal requirements.
• Family-level system features: MachXO3 architecture provides on-chip clocking (PLLs), programmable I/O cells, UFM and hardened IP blocks to simplify system-level design.
• RoHS compliant and surface-mount packaging: Simplifies manufacturing and meets regulatory requirements for lead-free assembly.

Why Choose LCMXO3LF-4300E-5MG324I?

The LCMXO3LF-4300E-5MG324I positions itself as a compact, industrial-grade MachXO3 family FPGA that combines a practical logic element count with embedded RAM and a high I/O count. It is suitable for designers who need non-volatile programmability, system integration features and a dense I/O footprint in a small surface-mount package.

This device is appropriate for engineers building control logic, interface bridges or system glue functions where modest programmable logic, on-chip memory and family-level features such as PLLs, on-chip oscillator and hardened peripheral IP reduce BOM complexity and speed integration.

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