LCMXO3LF-4300E-5MG121I

The LCMXO3LF-4300E-5MG121I is a MachXO3 family FPGA offered in a 121-VFBGA (121-CSFBGA, 6×6) surface-mount package and specified for industrial use. It combines reprogrammable logic, on-chip block memory and flexible I/O to address embedded control, interface and system integration requirements where non‑volatile, multi‑time programmable logic and compact packaging are needed.

Architected for system-level flexibility, the device provides on-chip memory, hardened peripheral IP functions and configurable clocking and I/O resources to simplify board-level design and support a range of industrial embedded applications.

Key Features

• Core logic — 540 logic elements with 4,320 logic cells to implement control, glue logic and custom finite-state machines.
• Embedded memory — approximately 0.094 Mbits (94,208 bits) of on-chip RAM and support for sysMEM embedded block RAM modes, including single/dual/pseudo‑dual port and FIFO configurations.
• I/O and interfaces — 100 general-purpose I/Os with high-performance, flexible I/O buffers and pre‑engineered source‑synchronous I/O capabilities for reliable board-level interfacing.
• Non‑volatile configuration — multi‑time programmable, non‑volatile configuration and TransFR reconfiguration support for field updates and flexible deployment.
• Embedded hardened IP — includes hardened I²C and SPI cores, timer/counter functions and user flash memory (UFM) for common peripheral and control tasks.
• Clocking and timing — flexible on‑chip clocking with sysCLOCK phase‑locked loops (PLLs) and an on‑chip oscillator to support varied timing requirements.
• Power and modes — supported standby mode and power‑saving options; recommended supply range from 1.14 V to 1.26 V.
• Packaging and reliability — 121‑VFBGA / 121‑CSFBGA (6×6) surface‑mount package, RoHS‑compliant and rated for industrial temperature operation from −40 °C to 100 °C.
• Design for test and trace — IEEE 1149.1‑compliant boundary scan testability and TraceID support for manufacturing test and traceability.

Typical Applications

• Industrial automation — Implement control logic, sensor interfacing and protocol adaptation in systems requiring industrial temperature operation and reprogrammable logic.
• Interface bridging and board glue — Consolidate discrete logic and interface translation using flexible I/O, hardened SPI/I²C cores and on‑chip memory.
• Embedded system control — Use as a compact, non‑volatile programmable controller for peripheral management, timing and system configuration.
• Field‑updateable designs — Leverage multi‑time programmable configuration and TransFR reconfiguration for products that require in‑place firmware or logic updates.

Unique Advantages

• Highly integrated programmable solution: Combines logic, embedded RAM and hardened peripheral IP to reduce BOM and simplify board-level design.
• Non‑volatile, reprogrammable configuration: Multi‑time programmable storage and TransFR reconfiguration enable field updates without external configuration memory.
• Industrial temperature rating: Specified for −40 °C to 100 °C to support deployment in industrial environments.
• Compact advanced packaging: 121‑pin VFBGA/CSFBGA (6×6) surface‑mount package saves PCB area while providing up to 100 I/Os.
• Flexible I/O and clocking: High‑performance I/O buffers, source‑synchronous support and on‑chip PLLs simplify timing and interface design.
• Manufacturing and test support: Boundary scan (IEEE 1149.1) and TraceID capabilities assist board test and traceability workflows.

Why Choose LCMXO3LF-4300E-5MG121I?

The LCMXO3LF-4300E-5MG121I positions itself as a compact, industrial‑rated MachXO3 family FPGA that balances reprogrammability, embedded memory and hardened peripheral IP in a small surface‑mount package. Its combination of non‑volatile configuration, flexible I/O and on‑chip clocking makes it well suited to designs that require in‑field updates, reliable interface control and a reduced component count.

This device is appropriate for engineers and product teams developing industrial embedded systems, board‑level interface solutions and applications where compact packaging, industrial temperature range and on‑device configurability deliver long‑term design flexibility and reduced system complexity.

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