LCMXO3LF-4300C-6BG400C

The LCMXO3LF-4300C-6BG400C is a MachXO3 family field programmable gate array (FPGA) IC designed for commercial-grade embedded applications. It provides approximately 4,320 logic elements, on-chip embedded RAM, and a high I/O count in a compact 400-LFBGA footprint.

Built for flexible board-level integration, this device combines non-volatile, multi-time programmable configuration with on-chip clocking, hardened peripheral IP and extensive I/O resources—making it suitable for interface bridging, system control and peripheral aggregation where a high pin-count, reprogrammable logic solution is required.

Key Features

• MachXO3 family architecture — Non-volatile, multi-time programmable FPGA architecture with features listed in the MachXO3 family data sheet.
• Logic capacity — Approximately 4,320 logic elements for implementing glue logic, finite-state machines and custom peripherals.
• Embedded memory — 94,208 bits of on-chip RAM for data buffering, FIFOs and small embedded storage; supports RAM/ROM/FIFO modes described in the MachXO3 datasheet.
• High I/O count — 335 general-purpose I/O pins with flexible on-chip I/O buffer options and support for pre-engineered source-synchronous interfaces.
• Clocking and timing — Flexible on-chip clocking including sysCLOCK PLLs for phase-locked clock generation and distribution.
• Hardened peripheral IP — Embedded hardened functions referenced in the family datasheet, including I²C and SPI cores and timers/counters for common peripheral tasks.
• Configuration and reconfiguration — Non-volatile configuration with TransFR reconfiguration and User Flash Memory (UFM) support as documented in the MachXO3 family material.
• Package and mounting — 400-LFBGA package (supplier package: 400-CABGA, 17×17) with surface-mount mounting type for compact board designs.
• Electrical and environmental — Voltage supply range 2.375 V to 3.465 V, commercial operating temperature 0 °C to 85 °C, and RoHS compliant.

Typical Applications

• Interface bridging and glue logic — Leverage 335 I/Os and 4,320 logic elements to aggregate signals and implement protocol translation or board-level glue between multiple subsystems.
• Embedded control and sequencing — Use on-chip logic, timers and embedded RAM for deterministic control, state machines and sequencing tasks in commercial products.
• Sensor and peripheral aggregation — Hardened I²C/SPI IP and abundant I/O simplify integration of multiple sensors and peripherals onto a single programmable device.
• Configuration and system management — Non-volatile, multi-time programmable configuration and UFM enable on-board configuration storage and field reprogramming for system updates.

Unique Advantages

• Highly integrated I/O capacity: 335 I/Os reduce external multiplexing and simplify board routing for I/O-dense designs.
• Balanced logic and memory: The combination of ~4,320 logic elements and 94,208 bits of embedded RAM supports control logic with local buffering without external memory in many designs.
• Non-volatile field programmability: Multi-time programmable, non-volatile configuration supports in-field updates and design iterations without external configuration memory.
• On-chip hardened IP: Built-in I²C, SPI and timer/counter blocks accelerate peripheral interfacing and reduce development effort.
• Compact, surface-mount package: 400-LFBGA (17×17) provides a high-pin-count solution in a compact footprint for space-constrained PCBs.
• Commercial-grade and RoHS compliant: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.

Why Choose LCMXO3LF-4300C-6BG400C?

This MachXO3 FPGA offers a practical balance of logic capacity, embedded memory and one of the highest I/O counts available in a compact 400-LFBGA package. Its non-volatile, multi-time programmable configuration and embedded hardened IP cores make it well suited for designers needing reprogrammable logic alongside integrated peripheral support in commercial products.

Choose the LCMXO3LF-4300C-6BG400C for designs that require flexible board-level integration, abundant I/O and on-chip resources while maintaining a commercial temperature rating and RoHS compliance—enabling efficient system-level implementations with reduced external BOM.

Request a quote or submit a pricing inquiry to learn about availability and lead times for the LCMXO3LF-4300C-6BG400C.