LCMXO3LF-4300E-5MG121C

The LCMXO3LF-4300E-5MG121C is a MachXO3 family FPGA in a 121-VFBGA (121-CSFBGA, 6×6) surface-mount package optimized for low-voltage, commercial applications. It integrates 4,320 logic elements with on-chip embedded memory and a flexible I/O fabric to support system control, interface bridging, and compact programmable logic needs.

Designed for compact boards and constrained power domains, this device provides non-volatile, multi-time programmable configuration and a range of on-chip system functions described in the MachXO3 family data sheet.

Key Features

• Core Logic — 4,320 logic elements providing programmable logic capacity for control, glue logic, and interface tasks.
• Embedded Memory — Approximately 0.094 Mbits (94,208 bits) of on-chip RAM for FIFOs, register files, and small data buffers.
• Programmable I/O — 100 I/O pins in a flexible I/O buffer architecture; includes source-synchronous and high-performance I/O options documented in the MachXO3 family data sheet.
• On-Chip System IP — Family-level features include hardened I2C and SPI IP cores, timers/counters, user flash memory (UFM), on-chip oscillator, and TransFR reconfiguration support.
• Clocking and Timing — Integrated clocking resources such as PLLs and a flexible clock distribution network for system-level clock management (as described in the datasheet).
• Power and Configuration — Non-volatile, multi-time programmable configuration; supported power-on-reset and standby/power-saving options are provided in the family documentation.
• Power Supply — Supported core supply range from 1.14 V to 1.26 V, enabling low-voltage system integration.
• Package & Mounting — 121-VFBGA (121-CSFBGA, 6×6) package, surface-mount mounting type suitable for compact board layouts.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Interface Bridging and Protocol Conversion — Flexible I/O and embedded SPI/I2C IP cores enable compact bridge designs between disparate peripherals and subsystems.
• System Control and Glue Logic — Programmable logic and on-chip memory are suitable for device control, state machines, and board-level sequencing.
• Embedded Peripherals and Sensor Aggregation — Hardened interfaces and on-chip timers let the device handle peripheral aggregation and simple real-time control tasks without external MCU overhead.
• Compact, Low-Voltage Designs — Small BGA package and 1.14–1.26 V core support integration into space-constrained, low-voltage systems.

Unique Advantages

• Non-volatile, Multi-time Programmability: Retains configuration without external configuration memory and supports multiple reconfigurations for iterative development.
• Integrated System IP: Hardened I2C/SPI cores, timers, and user flash reduce external component count and simplify board design.
• Compact Package: 121-VFBGA (6×6) surface-mount package enables high-density board integration and small form-factor designs.
• Flexible I/O Count: 100 I/O pins with family-level pre-engineered source-synchronous and flexible buffer options for diverse interface requirements.
• Low-Voltage Core: Narrow core supply range (1.14–1.26 V) for compatibility with low-voltage system architectures.
• Commercial Temperature Range: Rated 0 °C to 85 °C for mainstream electronic applications and controlled-environment deployments.

Why Choose LCMXO3LF-4300E-5MG121C?

This MachXO3 FPGA delivers a balanced combination of programmable logic, embedded memory, and system IP in a compact 121-VFBGA package. It is well suited for designers needing non-volatile configuration, flexible I/O, and integrated peripheral IP while maintaining a small PCB footprint and low-voltage core operation.

Choose this device for compact control, interface, and glue-logic roles where integration, low-voltage operation, and commercial-temperature reliability are primary design considerations. The MachXO3 family documentation provides architectural details—clocking, memory modes, I/O behavior, and on-chip peripherals—to support engineering evaluation and implementation.

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