LCMXO3LF-4300E-5MG324C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 268 94208 4320 324-VFBGA |
|---|---|
| Quantity | 442 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-CSFBGA (10x10) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-VFBGA | Number of I/O | 268 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO3LF-4300E-5MG324C – MachXO3 Field Programmable Gate Array (FPGA) IC, 324‑VFBGA
The LCMXO3LF-4300E-5MG324C is a MachXO3 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It provides a mid-density, non-volatile FPGA architecture with 4,320 logic elements and approximately 94,208 bits of embedded RAM for control, glue-logic, and interface functions.
Designed for commercial-grade applications, the device offers flexible on-chip clocking, pre-engineered source-synchronous I/O and hardened peripheral IP blocks to accelerate system integration while reducing external component count.
Key Features
- Core Logic — 4,320 logic elements (cells) suitable for mid-density programmable logic and glue logic integration.
- Embedded Memory — Approximately 0.094 Mbits of on-chip RAM (94,208 bits) for FIFOs, buffering and small data stores.
- I/O — 268 general-purpose I/O pins to support diverse interfacing and peripheral connections.
- Non-volatile, Multi-time Programmable — Family features include non-volatile configuration and multi-time programmability for in-system updates and reliable boot behavior.
- Flexible On-chip Clocking — MachXO3 family architecture includes flexible clock distribution and PLL support to manage system timing requirements.
- Hardened Peripheral IP — Family includes embedded hardened IP such as I²C and SPI controllers and a timer/counter to simplify common interface tasks.
- On‑chip Oscillator — Integrated oscillator options are available within the MachXO3 family for clock generation without external crystals.
- Package & Mounting — 324‑VFBGA package; supplier device package listed as 324‑CSFBGA (10×10). Surface mount mounting type.
- Power — Core supply voltage range: 1.14 V to 1.26 V.
- Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
- Regulatory — RoHS compliant.
Typical Applications
- System Glue Logic — Use the device to consolidate discrete logic and interface translation tasks using 4,320 logic elements and abundant I/O.
- Peripheral and Sensor Aggregation — 268 I/O and embedded RAM support aggregation and buffering of sensor data and peripheral signals.
- Interface Bridging — Flexible on-chip clocking, source-synchronous I/O and hardened I²C/SPI IP simplify bridging between subsystems and serial buses.
- Control and Timing Functions — Built-in timers/counters and PLLs address local control, timing and synchronization requirements without external logic.
Unique Advantages
- Compact, mid-density programmability: 4,320 logic elements provide a balance of capacity and integration for control and interface designs.
- Substantial on-chip memory: Approximately 94,208 bits of embedded RAM reduce the need for external buffering in many applications.
- High I/O count: 268 I/O pins enable extensive peripheral connectivity and signal routing from a single device.
- Non-volatile configuration: Multi-time programmable, non-volatile family architecture simplifies in-field updates and ensures deterministic boot behavior.
- Compact surface-mount package: 324‑VFBGA / 324‑CSFBGA (10×10) package supports high-density PCB designs while keeping component footprint low.
- Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream embedded and consumer applications.
Why Choose LCMXO3LF-4300E-5MG324C?
The LCMXO3LF-4300E-5MG324C positions itself as a practical, mid-density MachXO3 family FPGA for designers needing a non-volatile, reprogrammable logic device with significant I/O and embedded memory. Its blend of 4,320 logic elements, approximately 94,208 bits of RAM, and 268 I/O pins makes it well suited to consolidating glue logic, managing interfaces and buffering data without extensive external components.
Backed by Lattice Semiconductor’s MachXO3 family documentation and hardened peripheral IP features, this device is a viable choice for teams seeking predictable integration, in-system programmability and commercial-grade operation in a compact 324‑VFBGA package.
If you’d like pricing, availability or to request a quote for LCMXO3LF-4300E-5MG324C, please submit a quote request or contact sales to get details and lead-time information.

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