LCMXO3LF-4300E-5MG256I

The LCMXO3LF-4300E-5MG256I is a MachXO3 family FPGA IC offering a compact, surface-mount VFBGA package and industrial temperature grading. It combines a flexible programmable fabric with embedded memory and hardened peripheral IP to address embedded control, I/O orchestration, and system-level glue logic in industrial applications.

Built on the MachXO3 architecture, the device provides non-volatile, multi-time programmable configuration and on-chip features such as PLLs, on-chip oscillator, and hardened I2C/SPI IP, delivering a ready platform for system control and interface functions where reliability and integration matter.

Key Features

• Programmable Logic — 4,320 logic elements (cells) and 540 logic blocks provide a flexible fabric for custom digital functions and glue logic.
• Embedded Memory — 94,208 total RAM bits (approximately 0.094 Mbits) of on-chip RAM for FIFOs, small buffers, and local storage.
• High I/O Count — 206 I/O pins to support multiple interfaces and board-level connectivity.
• Non-volatile Multi-time Programmable Configuration — MachXO3 family non-volatile configuration supports field reprogramming and persistent device configuration.
• Hardened Peripheral IP — Built-in hardened I2C and SPI cores plus timers/counters and user flash memory (UFM) for configuration and system tasks.
• Clocking and Timing — Flexible on-chip clocking including sysCLOCK PLLs and on-chip oscillator for system clock generation and management.
• Package and Mounting — 256‑VFBGA (CSPBGA) in a 256‑CSFBGA (9×9) supplier package; surface-mount mounting type for compact board designs.
• Power and Temperature — Low-voltage supply range of 1.14 V to 1.26 V and industrial operating temperature range of −40 °C to 100 °C.

Typical Applications

• Industrial control — Use the device for board-level control, I/O aggregation, and protocol bridging in industrial automation hardware where industrial temperature operation is required.
• Interface bridging — Leverage 206 I/Os and hardened I2C/SPI IP to implement interface translation, signal conditioning, and peripheral aggregation on compact PCBs.
• Embedded configuration and system glue — Non-volatile, multi-time programmable configuration and UFM enable field-updatable control logic and persistent system settings.

Unique Advantages

• Highly integrated solution: Combines thousands of logic elements, embedded RAM, and hardened IP to reduce external components and simplify board design.
• Non-volatile, field-updatable configuration: Multi-time programmable configuration supports in-field updates and flexible lifecycle management.
• Wide I/O capacity: 206 I/Os accommodate multiple peripherals and interfaces without additional FPGAs or CPLDs.
• Industrial-grade operation: Rated for −40 °C to 100 °C to meet rugged environmental requirements in industrial systems.
• Low-voltage operation: Narrow supply range (1.14 V to 1.26 V) supports modern low-voltage board designs and power domains.
• Compact packaging: 256‑VFBGA/CSPBGA package provides high-density integration for space-constrained applications.

Why Choose LCMXO3LF-4300E-5MG256I?

The LCMXO3LF-4300E-5MG256I positions itself as an industrially graded, compact FPGA solution that blends programmable logic, embedded memory, and hardened peripheral IP in a single surface-mount package. Its combination of 4,320 logic elements, approximately 0.094 Mbits of on-chip RAM, and 206 I/Os makes it suitable for embedded control, interface bridging, and system glue where integration and field reprogrammability are required.

Designed for engineers who need a reliable, reprogrammable building block, this MachXO3 device offers practical on-chip resources (PLLs, oscillator, UFM, hardened I2C/SPI) and a narrow low-voltage supply window that align with modern board architectures and industrial deployment needs.

Request a quote or submit a procurement inquiry to receive pricing and availability for the LCMXO3LF-4300E-5MG256I.