LCMXO3LF-4300C-6BG256I

The LCMXO3LF-4300C-6BG256I is a MachXO3 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It provides an integrated, non-volatile FPGA architecture with on-chip embedded memory, hardened peripheral IP and flexible I/O for industrial embedded designs.

With 4,320 logic elements, approximately 94,208 bits of embedded RAM, and 206 general-purpose I/Os in a 256‑LFBGA package, this device is targeted at industrial applications that require reprogrammable logic, robust I/O counts, and extended operating temperature range.

Key Features

• Core Logic  4,320 logic elements (cells) supporting user-configurable logic functions and small to mid-density programmable designs.
• Embedded Memory  Approximately 94,208 bits of on-chip RAM (sysMEM) for local storage, FIFOs and small data buffers.
• I/O and Interfaces  206 programmable I/Os with pre‑engineered source-synchronous I/O and flexible I/O buffer options as described in the MachXO3 family data sheet.
• Non-volatile, Multi-time Programmable Configuration  MachXO3 family features include non-volatile, multi-time programmable configuration and TransFR reconfiguration for field updates.
• Clocking and Timing  Flexible on-chip clocking including PLLs and internal oscillators to support a variety of timing architectures.
• Hardened Peripheral IP  Embedded hardened IP blocks such as I²C, SPI and timer/counter primitives are available in the MachXO3 family.
• Package and Mounting  256‑LFBGA (supplier package listed as 256‑CABGA 14×14) surface-mount package for compact board-level integration.
• Power and Temperature  Supported supply voltage range from 2.375 V to 3.465 V and industrial operating temperature range of −40 °C to 100 °C.
• System-Level Support  Family-level data sheet describes configuration, boundary-scan testability and power-saving options useful for system integration and validation.
• RoHS Compliant  Device conforms to RoHS requirements for lead-free assembly and regulatory alignment.

Typical Applications

• Industrial Control  Glue logic, protocol bridging and control tasks that benefit from 4,320 logic elements, 206 I/Os and an industrial temperature range.
• Embedded System Integration  Local bus interfaces, peripheral aggregation and configuration management using on-chip RAM and hardened IP like I²C/SPI.
• Sensor and I/O Aggregation  High pin-count I/O and programmable logic for consolidating sensor inputs, front-end conditioning and interface translation.
• Configuration and System Supervisory Functions  Non-volatile, multi-time programmable configuration and on-chip oscillator/clocking features for field-updatable system control.

Unique Advantages

• Highly configurable logic  4,320 logic elements give designers the flexibility to implement custom glue logic, state machines and small to medium FPGA functions without external CPLDs.
• Generous I/O capacity  206 I/Os simplify board-level integration by reducing the need for external I/O expanders and enabling direct connections to multiple peripherals.
• Embedded memory for buffering  Approximately 94 kbits of on-chip RAM supports FIFOs, small data storage and memory-mapped functions close to the logic.
• Industrial-ready thermal range  Rated for −40 °C to 100 °C operation to match industrial deployment requirements and extended-temperature system designs.
• Compact, surface-mount package  The 256‑LFBGA (14×14) package delivers a small footprint for space-constrained PCBs while providing high I/O density.
• Documented family features  MachXO3 family data sheet details on-chip clocking, hardened IP blocks and configuration options to accelerate integration and validation.

Why Choose LCMXO3LF-4300C-6BG256I?

The LCMXO3LF-4300C-6BG256I combines a mid-range logic capacity with substantial I/O, embedded memory and family-level features such as non-volatile configuration and hardened peripheral IP. Its industrial temperature rating and surface-mount 256-LFBGA package make it a practical choice for embedded and industrial systems that require reprogrammable logic, flexible interfacing and compact board integration.

Designed within the MachXO3 family, this device is appropriate for designers seeking a documented, reprogrammable solution with on-chip resources for control, interface bridging and system-level configuration tasks.

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