LCMXO3LF-4300C-6BG256C

The LCMXO3LF-4300C-6BG256C is a MachXO3 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. This non-volatile, multi-time programmable FPGA combines a flexible logic fabric with embedded memory and a rich set of I/O to address glue logic, interface bridging, and control tasks in commercial embedded systems.

With 540 CLBs (4,320 logic elements), approximately 94,208 bits of embedded RAM, and 206 I/Os in a 256-LFBGA (14×14) package, the device targets space- and power-conscious designs that require reconfigurable logic, on-chip memories, and versatile I/O at a commercial temperature grade (0 °C to 85 °C).

Key Features

• Logic Capacity — 540 CLBs providing 4,320 logic elements to implement glue logic, state machines, and custom control functions.
• Embedded Memory — Approximately 94,208 bits of on-chip RAM for FIFOs, small buffers, and data storage close to the logic.
• I/O Density — 206 programmable I/O pins to support wide interface requirements and mixed-signal board routing flexibility.
• Non-volatile, Multi-time Programmable — On-chip non-volatile configuration storage enables multiple reprogramming cycles without external configuration flash.
• Flexible I/O and Clocking — Pre-engineered source-synchronous I/O, flexible on-chip clocking and PLLs (as described in the MachXO3 family datasheet) for timing-critical interfaces.
• Embedded Hardened IP — Family-level hardened functions such as I²C and SPI controllers and timer/counter blocks are available per the MachXO3 datasheet to accelerate common system functions.
• Power and Supply — Operates from a supply range of 2.375 V to 3.465 V, suitable for 2.5 V and 3.3 V system domains within specified limits.
• Package and Mounting — 256-LFBGA (supplier package 256-CABGA, 14×14) in a surface-mount format for compact board designs.
• Commercial Grade — Rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

• Consumer and Commercial Embedded Systems — Implement custom control logic, interface adaptation, and peripheral glue without external CPLDs or large FPGAs.
• User Interface Control — Drive and manage buttons, LEDs, displays and touch interfaces using the device’s programmable I/O and embedded logic.
• Interface Bridging and Protocol Conversion — Use the abundant I/O and on-chip IP blocks to bridge between disparate buses or to offload protocol handling from a host MCU.
• Peripheral and Sensor Aggregation — Aggregate sensor data, implement preprocessing, and supply deterministic control paths using embedded RAM and logic elements.

Unique Advantages

• Integrated Non-volatile Configuration — Eliminates the need for external configuration memory, simplifying BOM and board layout.
• Balanced Logic and Memory — 540 CLBs and ~94 kbits of embedded RAM enable compact implementations of control and buffering functions without external SRAM.
• High I/O Count in a Compact Package — 206 I/Os in a 256-LFBGA (14×14) package provide extensive board-level interfacing while preserving PCB area.
• Flexible Supply Support — Accepts supplies from 2.375 V to 3.465 V, allowing integration into mixed-voltage designs with appropriate domain handling.
• Vendor-backed Architecture — MachXO3 family features such as programmable I/O, PLLs, and hardened peripheral IP (per the datasheet) accelerate development and integration.
• RoHS Compliant — Meets lead-free and hazardous-substance requirements for contemporary commercial production.

Why Choose LCMXO3LF-4300C-6BG256C?

The LCMXO3LF-4300C-6BG256C positions itself as a practical, commercially graded FPGA for designs that need on-chip non-volatile configuration, moderate logic capacity, and a high pin count in a compact BGA package. Its combination of CLBs, embedded RAM, and extensive I/O makes it suitable for replacing discrete glue logic, consolidating interface functions, and implementing control tasks within consumer and commercial products.

Design teams will find value in the MachXO3 family architecture and the device’s embedded features for accelerating time-to-market, reducing BOM complexity, and enabling field reconfiguration where multi-time programmable behavior is required.

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