LCMXO3LF-4300C-5BG400I

IC FPGA 335 I/O 400CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 335 94208 4320 400-LFBGA

Quantity 372 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package400-CABGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case400-LFBGANumber of I/O335Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3LF-4300C-5BG400I – MachXO3 Field Programmable Gate Array (FPGA) 400-LFBGA

The LCMXO3LF-4300C-5BG400I is a MachXO3 family FPGA device in a 400-LFBGA (400-CABGA, 17×17) package, offered in an industrial grade configuration. It provides 4,320 logic elements, approximately 94,208 bits of on-chip RAM, and 335 I/O pins, delivering a flexible, non-volatile FPGA building block for embedded system control, interface bridging, and programmable I/O applications.

Designed for surface-mount applications, this device supports a supply voltage range of 2.375 V to 3.465 V and an operating temperature range of –40 °C to 100 °C, making it suitable for industrial temperature environments while providing integrated clocking, memory, and hardened IP functionality as described in the MachXO3 family documentation.

Key Features

  • Logic Capacity — 4,320 logic elements (logic cells) for implementing glue logic, control state machines, and moderate-density programmable logic functions.
  • Embedded Memory — Total RAM: 94,208 bits of on-chip memory (sysMEM block RAM) for small FIFOs, buffering and local data storage.
  • High Pin Count I/O — 335 I/O pins to support multiple interfaces and parallel/serial connectivity in a single device package.
  • Non-volatile, Multi-time Programmable Configuration — MachXO3 family capability for non-volatile configuration and in-field reprogramming (as documented in the MachXO3 family data sheet).
  • Embedded Hardened IP — Family-level documentation lists hardened IP including I2C, SPI and timer/counter blocks that simplify common peripheral integration.
  • Flexible Clocking — On-chip clocking resources such as PLLs (sysCLOCK) to support diverse timing and clock-domain requirements.
  • Package & Mounting — 400-LFBGA (supplier device package 400-CABGA, 17×17) in a surface-mount form factor for compact board integration.
  • Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C to meet industrial-environment requirements.
  • Voltage Range — Operates from 2.375 V to 3.465 V, enabling use with common board power rails.
  • RoHS Compliant — Device conforms to RoHS requirements.

Typical Applications

  • Sensor and Peripheral Interfaces — Use the device’s hardened I2C and SPI IP blocks and multiple I/Os for robust sensor interfacing and peripheral control.
  • Protocol Bridging and I/O Expansion — High I/O count and programmable I/O cells support protocol translation, bus bridging, and expansion of microcontroller I/O without major PCB redesign.
  • Embedded System Control — On-chip clocking, timers/counters and logic elements enable implementation of control state machines and timing-critical functions.
  • Configuration and Local Storage — Non-volatile configuration and on-chip RAM (sysMEM) support local storage of configuration data, small FIFOs, and buffering needs.

Unique Advantages

  • Highly Integrated Functionality: Combines logic elements, embedded RAM, PLL-based clocking and hardened IP to reduce external components and BOM complexity.
  • Industrial-ready Thermal Range: Specified operation from –40 °C to 100 °C for deployments in industrial temperature environments.
  • Wide Supply Voltage Window: 2.375 V to 3.465 V operation accommodates common board power architectures and eases integration.
  • Large I/O Availability: 335 I/O pins enable multiple interfaces and parallel connectivity without additional multiplexers or bridges.
  • Non-volatile, Reprogrammable: Multi-time programmable non-volatile configuration enables field updates and design iteration without external configuration devices.
  • Compact, Surface-Mount Package: 400-LFBGA (17×17) provides a high-pin-count solution in a compact footprint for space-constrained designs.

Why Choose LCMXO3LF-4300C-5BG400I?

The LCMXO3LF-4300C-5BG400I positions MachXO3 family capabilities—non-volatile configuration, embedded memory, hardened peripheral IP and flexible clocking—in a compact 400-LFBGA industrial-grade package. It is suited to designers who need a moderate-density FPGA with substantial I/O, integrated memory resources, and the ability to operate across industrial temperature ranges.

This device is a practical choice for embedded system designers and hardware engineers who require a stable, reprogrammable platform with on-chip peripheral support and sufficient logic and I/O to consolidate interface functions and local control logic, while keeping board-level component count low.

If you would like pricing, availability, or a formal quote for the LCMXO3LF-4300C-5BG400I, submit a request and our team will respond with details promptly.

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