LCMXO3LF-2100C-6BG256C

The LCMXO3LF-2100C-6BG256C is a MachXO3 family FPGA IC offering 2,112 logic elements, 75,776 bits of on-chip RAM, and 206 programmable I/O. It implements the MachXO3 architecture and feature set, including non-volatile multi-time programmability, flexible on-chip clocking, and embedded system-level functions.

Engineered for commercial-temperature applications, this device suits designs that require moderate logic density, a high I/O count, and integrated configuration and peripheral capabilities in a compact 256-CABGA (14×14) package.

Key Features

• Logic Capacity — 2,112 logic elements suitable for mid-density glue logic, control and interface tasks.
• Embedded Memory — Approximately 0.076 Mbits (75,776 bits) of on-chip RAM for buffering, small FIFOs, or state storage.
• I/O and Interface Flexibility — 206 programmable I/O pins with MachXO3 family I/O architecture and pre‑engineered source synchronous I/O support as described in the family datasheet.
• Non-volatile, Multi-time Programmable Configuration — On-chip non-volatile configuration and TransFR reconfiguration capability referenced in the MachXO3 documentation.
• Embedded System IP — Hardened peripheral IP blocks included in the MachXO3 family (examples listed in the family datasheet: I²C, SPI, and timer/counter functions).
• Clocking and Oscillator — Flexible on-chip clocking with PLLs and an on-chip oscillator described in the family datasheet.
• Power and Packaging — Operates from 2.375 V to 3.465 V and is supplied in a 256‑CABGA (14×14) surface-mount package.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature.
• RoHS Compliant — Device meets RoHS requirements.

Typical Applications

• Interface bridging and glue logic — Use the 206 I/O and 2,112 logic elements to consolidate and translate between multiple digital interfaces.
• Control and state machines — Embedded RAM and hardened timer/counter IP support compact control logic and sequencing functions.
• Peripheral aggregation — Hardened I²C and SPI IP blocks along with configurable I/O make the device suitable for aggregating sensors and peripheral devices.

Unique Advantages

• High I/O density: 206 programmable I/Os enable complex interfacing without external expander chips.
• Non‑volatile configuration: Multi-time programmable on-chip configuration simplifies system boot and eliminates external configuration flash in many designs.
• Integrated peripherals: Hardened I²C, SPI and timer/counter functions reduce HDL development and save board-level components.
• Compact package: 256‑CABGA (14×14) footprint offers a high-pin-count solution in a small surface-mount package.
• Flexible power range: 2.375 V to 3.465 V supply range supports a variety of system power rails.
• Commercial temperature rating: Qualified for 0 °C to 85 °C operation for mainstream commercial applications.

Why Choose LCMXO3LF-2100C-6BG256C?

The LCMXO3LF-2100C-6BG256C positions itself as a mid-density, feature-rich MachXO3 FPGA option for designs that require substantial I/O, on-chip non-volatile configuration, embedded memory, and integrated peripheral IP. Its combination of 2,112 logic elements, approximately 0.076 Mbits of embedded RAM, and 206 I/Os provides a balance of integration and flexibility for control, interface, and aggregation tasks.

For teams seeking a compact, RoHS-compliant FPGA in a 256‑CABGA package with a commercial temperature rating and the MachXO3 family feature set (including on-chip clocking, PLl, and hardened IP), this device delivers a clear, verifiable specification set to support procurement and design decisions.

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