LCMXO3LF-1300E-6MG256I

The LCMXO3LF-1300E-6MG256I is a MachXO3-family FPGA optimized for industrial embedded applications. It provides a configured logic fabric with 1,280 logic elements and 160 CLBs, together with 65,536 bits of embedded RAM and up to 206 user I/Os, enabling board-level glue logic, interface aggregation and flexible peripheral orchestration.

Designed for systems requiring reprogrammable, non-volatile logic in a compact surface-mount package, this device combines the MachXO3 family’s on-chip configuration and embedded IP capabilities with an industrial operating temperature range and a 256-ball VFBGA (CSPBGA) package.

Key Features

• Logic Capacity — 1,280 logic elements and 160 CLBs provide deterministic programmable logic for control, glue and interface functions.
• Embedded Memory — 65,536 bits of on-chip RAM (approx. 64 Kbits) for state storage, buffering and small packet FIFOs.
• I/O Density — Up to 206 user I/Os to support multiple peripherals, buses and board-level interfaces.
• Package & Mounting — 256-VFBGA / CSPBGA (256-CSFBGA, 9×9) surface-mount package for compact board designs.
• Supply Voltage — Narrow core supply range of 1.14 V to 1.26 V for the programmable fabric.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for industrial environments.
• Non-volatile Configuration — MachXO3 family features such as non-volatile, multi-time programmable configuration enable persistent operation without external configuration memory.
• On-chip System Functions — Family-level capabilities described in the datasheet include embedded hardened IP (I²C, SPI, timers), on-chip oscillator, PLLs and flexible clocking and I/O options.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Industrial Control — Use as reprogrammable logic for I/O aggregation, protocol bridging and custom control functions within industrial equipment, supported by the −40 °C to 100 °C rating.
• Interface Bridging — Implement board-level protocol translation and multi-bus interfacing leveraging 206 I/Os and embedded RAM for buffering.
• Embedded System Glue Logic — Replace fixed glue ICs with programmable logic to consolidate components and simplify revision-driven design changes using the MachXO3 non-volatile configuration.
• User Interface and Peripheral Control — Manage displays, buttons, LEDs and peripheral timing with flexible I/O and on-chip timers/IP described in the MachXO3 family documentation.

Unique Advantages

• Highly integrated I/O and logic: 206 I/Os paired with 1,280 logic elements and 65,536 bits of RAM reduce board-level components and simplify routing for complex connectivity tasks.
• Industrial-ready thermal range: −40 °C to 100 °C operation supports deployment in harsh and temperature-variable environments.
• Non-volatile, multi-time programmable configuration: Persistent on-chip configuration removes the need for external configuration memory and supports in-field updates.
• Compact, surface-mount packaging: 256-ball VFBGA (CSPBGA) 9×9 format enables high-density PCB implementation while maintaining significant I/O capacity.
• Family-level system features: MachXO3 family capabilities (embedded IP blocks, PLLs, on-chip oscillator, flexible clocking) provide system-level building blocks that accelerate design integration.
• Controlled core supply range: 1.14–1.26 V core supply window for consistent FPGA fabric operation across production units.

Why Choose LCMXO3LF-1300E-6MG256I?

The LCMXO3LF-1300E-6MG256I positions itself as a compact, industrial-grade reprogrammable logic device that balances logic capacity, I/O density and embedded memory for board-level system control and interface tasks. Its MachXO3-family capabilities—non-volatile configuration, embedded IP and flexible I/O/clocking—make it suitable for designs that require persistent configuration and adaptable functionality without external configuration peripherals.

This device is well suited to teams building industrial equipment, embedded controllers and complex interface assemblies that need a reliable, reprogrammable logic element with an established family migration path and a compact BGA footprint to simplify BOM and PCB integration.

Request a quote or submit a pricing inquiry to evaluate LCMXO3LF-1300E-6MG256I for your next embedded or industrial design project.