LCMXO3LF-1300E-6MG256C

The LCMXO3LF-1300E-6MG256C is a MachXO3 family Field Programmable Gate Array (FPGA) IC in a 256-VFBGA / CSPBGA package. It provides a compact, non-volatile, multi-time programmable architecture with flexible on-chip resources for control, glue-logic and interface functions across commercial embedded designs.

With 160 logic blocks (1,280 logic elements), 206 user I/Os and embedded memory, this device targets applications that require integrated I/O, on-chip programmable logic and system-level IP in a surface-mount VFBGA footprint.

Key Features

• Core Logic — 160 logic blocks delivering 1,280 logic elements/cells for implementing glue logic, control state machines and small to medium combinational/sequential functions.
• Embedded Memory — Approximately 0.0625 Mbits (65,536 bits) of on-chip RAM for small data buffering, FIFOs and lookup tables.
• I/O Capacity — 206 programmable I/O pins with flexible I/O buffer options and pre‑engineered source-synchronous I/O support as described in the MachXO3 family documentation.
• Clocking and Timing — Flexible on-chip clocking features including sysCLOCK PLLs for clock generation and distribution (as specified for the MachXO3 family).
• Embedded IP and Peripherals — Hardened on-chip IP functions referenced in the datasheet such as I²C and SPI cores and timer/counter primitives to simplify common interface tasks and timing functions.
• Configuration & Reliability — Non-volatile, multi-time programmable device architecture with TransFR reconfiguration and enhanced system-level support features documented for the MachXO3 family.
• Package & Mounting — 256‑VFBGA / CSPBGA (256‑CSFBGA 9×9) surface-mount package for compact board implementations.
• Power & Operating Range — Single supply operating window of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C. RoHS compliant.

Typical Applications

• System Control & Glue Logic — Implement board-level control, reset sequencing and glue logic where integrated non-volatile programmable logic and modest on-chip memory are required.
• Peripheral & Sensor Interface — Use hardened I²C/SPI IP and flexible I/O to consolidate sensor interfaces, protocol bridging and peripheral management.
• Embedded Timing and Sequencing — Leverage on-chip timers/counters, PLL clocking and small RAM blocks for deterministic sequencing and buffering tasks.
• Interface Conditioning — Implement signal conditioning, level translation logic and source-synchronous I/O support for mid-density interface requirements.

Unique Advantages

• Highly Integrated, Non‑Volatile FPGA: Combines programmable logic with non‑volatile, multi‑time programmability to remove the need for external configuration memory.
• Compact High‑I/O Package: 256‑VFBGA footprint delivers 206 I/Os in a surface‑mount form factor for dense board designs.
• Embedded Peripheral IP: On‑chip hardened I²C, SPI and timer functions simplify common interface tasks and reduce external component count.
• Flexible Clocking & Memory: On‑chip PLLs and approximately 0.0625 Mbits of RAM enable local buffering and precise clock control for embedded functions.
• Commercial Grade, RoHS Compliant: Designed for commercial temperature ranges (0 °C to 85 °C) and compliant with RoHS requirements for global manufacturing.

Why Choose LCMXO3LF-1300E-6MG256C?

The LCMXO3LF-1300E-6MG256C positions itself as a compact, non-volatile FPGA option for designs that need integrated I/O capacity, embedded peripherals and modest logic and memory resources. Its MachXO3 family architecture provides documented system-level features such as flexible clocking, hardened IP blocks and reconfiguration options appropriate for control, interface and glue-logic roles.

This device is well suited to engineers building commercial embedded systems who require a surface-mount VFBGA package, a 1.14–1.26 V supply window, and a verified set of on-chip functions to reduce BOM and simplify board-level integration.

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