LCMXO3LF-1300E-5UWG36ITR
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 28 65536 1280 36-UFBGA, WLCSP |
|---|---|
| Quantity | 785 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 36-WLCSP (2.54x2.59) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 36-UFBGA, WLCSP | Number of I/O | 28 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 1 (Unlimited) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO3LF-1300E-5UWG36ITR – MachXO3 Field Programmable Gate Array (FPGA), 36-WLCSP
The LCMXO3LF-1300E-5UWG36ITR is a MachXO3 FPGA from Lattice Semiconductor Corporation. It delivers a compact, non-volatile programmable fabric with 1,280 logic elements, approximately 65,536 bits of embedded RAM, and 28 general-purpose I/O in a 36-WLCSP (2.54 × 2.59 mm) package.
Designed for industrial-grade embedded designs, this surface-mount device operates from a 1.14 V to 1.26 V supply and across an operating temperature range of −40 °C to 100 °C, enabling compact system control, interface, and glue-logic implementations where low pin-count, small footprint, and non-volatile configuration are required.
Key Features
- Core Logic 1,280 logic elements provide the programmable fabric for glue logic, simple state machines, and control tasks.
- Embedded Memory Approximately 65,536 bits of on-chip RAM for small FIFOs, buffering, and state storage.
- I/O and Packaging 28 I/O pins in a 36-WLCSP (2.54 × 2.59 mm) package, optimized for space-constrained surface-mount designs.
- Power Narrow core supply range of 1.14 V to 1.26 V to match system-level power rails and optimize integration.
- Industrial Grade Temperature Qualified for operation from −40 °C to 100 °C for deployments in industrial environments.
- Non-volatile, Multi-time Programmable Architecture On-chip non-volatile configuration enables field reprogramming and persistent configuration without external configuration memory.
- System IP and Clocking (per family datasheet) Family-level features include flexible on-chip clocking, phase-locked loops (PLLs), an on-chip oscillator, and embedded hardened IP such as I²C and SPI cores, timers/counters, and user flash memory (UFM) to simplify system integration.
- Surface Mount Package Small-footprint WLCSP package for integration into compact PCBs and modules.
- Compliance RoHS compliant for environmental compliance in manufactured products.
Typical Applications
- Embedded System Control Use the FPGA’s logic and on-chip memory for control sequencing, state machines, and small supervisory tasks in industrial controllers.
- Interface Bridging Implement protocol conversion and signal conditioning with 28 I/O lines and the family’s flexible I/O capabilities.
- Boot and Configuration Management Employ the non-volatile, multi-time programmable architecture and UFM (family feature) for secure configuration storage and field updates.
- Compact Module Integration The 36-WLCSP package supports space-constrained designs such as compact modules and embedded boards.
Unique Advantages
- Compact, Low-Profile Package: 36-WLCSP (2.54 × 2.59 mm) enables high-density board layouts and module-level integration.
- Industrial Temperature Support: Rated from −40 °C to 100 °C to meet demanding environmental requirements.
- Non-volatile Configuration: Multi-time programmable on-chip configuration removes the need for external configuration memory.
- Integrated System IP (family-level): Hardened IP blocks and flexible on-chip clocking (PLLs, oscillator) reduce external component count and simplify system design.
- Right-sized Resources: 1,280 logic elements and ~65,536 bits of RAM provide a balanced resource set for control, interfacing, and small compute tasks without excess cost or area.
- RoHS Compliant: Supports environmental compliance requirements for manufactured products.
Why Choose LCMXO3LF-1300E-5UWG36ITR?
The LCMXO3LF-1300E-5UWG36ITR positions itself as a compact, industrial-grade MachXO3 FPGA suitable for designers needing a small, non-volatile programmable device with modest logic and embedded memory. Its combination of 1,280 logic elements, ~65,536 bits of RAM, 28 I/O, and a tiny 36-WLCSP package makes it well suited to space- and power-constrained boards while providing family-level system features such as flexible clocking and hardened IP to simplify design integration.
This device is appropriate for engineers developing embedded controllers, interface bridges, and compact modules where a low-footprint, reprogrammable solution with industrial temperature range and RoHS compliance is required. The MachXO3 family datasheet describes additional architecture and system-level features that support integration, configuration flexibility, and embedded peripherals.
Request a quote or submit a product inquiry to get pricing and availability for the LCMXO3LF-1300E-5UWG36ITR. Our team will respond with lead time and ordering details tailored to your design needs.