LCMXO3LF-1300E-5UWG36ITR

IC FPGA 28 I/O 36WLCSP
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 28 65536 1280 36-UFBGA, WLCSP

Quantity 785 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package36-WLCSP (2.54x2.59)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case36-UFBGA, WLCSPNumber of I/O28Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO3LF-1300E-5UWG36ITR – MachXO3 Field Programmable Gate Array (FPGA), 36-WLCSP

The LCMXO3LF-1300E-5UWG36ITR is a MachXO3 FPGA from Lattice Semiconductor Corporation. It delivers a compact, non-volatile programmable fabric with 1,280 logic elements, approximately 65,536 bits of embedded RAM, and 28 general-purpose I/O in a 36-WLCSP (2.54 × 2.59 mm) package.

Designed for industrial-grade embedded designs, this surface-mount device operates from a 1.14 V to 1.26 V supply and across an operating temperature range of −40 °C to 100 °C, enabling compact system control, interface, and glue-logic implementations where low pin-count, small footprint, and non-volatile configuration are required.

Key Features

  • Core Logic  1,280 logic elements provide the programmable fabric for glue logic, simple state machines, and control tasks.
  • Embedded Memory  Approximately 65,536 bits of on-chip RAM for small FIFOs, buffering, and state storage.
  • I/O and Packaging  28 I/O pins in a 36-WLCSP (2.54 × 2.59 mm) package, optimized for space-constrained surface-mount designs.
  • Power  Narrow core supply range of 1.14 V to 1.26 V to match system-level power rails and optimize integration.
  • Industrial Grade Temperature  Qualified for operation from −40 °C to 100 °C for deployments in industrial environments.
  • Non-volatile, Multi-time Programmable Architecture  On-chip non-volatile configuration enables field reprogramming and persistent configuration without external configuration memory.
  • System IP and Clocking (per family datasheet)  Family-level features include flexible on-chip clocking, phase-locked loops (PLLs), an on-chip oscillator, and embedded hardened IP such as I²C and SPI cores, timers/counters, and user flash memory (UFM) to simplify system integration.
  • Surface Mount Package  Small-footprint WLCSP package for integration into compact PCBs and modules.
  • Compliance  RoHS compliant for environmental compliance in manufactured products.

Typical Applications

  • Embedded System Control  Use the FPGA’s logic and on-chip memory for control sequencing, state machines, and small supervisory tasks in industrial controllers.
  • Interface Bridging  Implement protocol conversion and signal conditioning with 28 I/O lines and the family’s flexible I/O capabilities.
  • Boot and Configuration Management  Employ the non-volatile, multi-time programmable architecture and UFM (family feature) for secure configuration storage and field updates.
  • Compact Module Integration  The 36-WLCSP package supports space-constrained designs such as compact modules and embedded boards.

Unique Advantages

  • Compact, Low-Profile Package: 36-WLCSP (2.54 × 2.59 mm) enables high-density board layouts and module-level integration.
  • Industrial Temperature Support: Rated from −40 °C to 100 °C to meet demanding environmental requirements.
  • Non-volatile Configuration: Multi-time programmable on-chip configuration removes the need for external configuration memory.
  • Integrated System IP (family-level): Hardened IP blocks and flexible on-chip clocking (PLLs, oscillator) reduce external component count and simplify system design.
  • Right-sized Resources: 1,280 logic elements and ~65,536 bits of RAM provide a balanced resource set for control, interfacing, and small compute tasks without excess cost or area.
  • RoHS Compliant: Supports environmental compliance requirements for manufactured products.

Why Choose LCMXO3LF-1300E-5UWG36ITR?

The LCMXO3LF-1300E-5UWG36ITR positions itself as a compact, industrial-grade MachXO3 FPGA suitable for designers needing a small, non-volatile programmable device with modest logic and embedded memory. Its combination of 1,280 logic elements, ~65,536 bits of RAM, 28 I/O, and a tiny 36-WLCSP package makes it well suited to space- and power-constrained boards while providing family-level system features such as flexible clocking and hardened IP to simplify design integration.

This device is appropriate for engineers developing embedded controllers, interface bridges, and compact modules where a low-footprint, reprogrammable solution with industrial temperature range and RoHS compliance is required. The MachXO3 family datasheet describes additional architecture and system-level features that support integration, configuration flexibility, and embedded peripherals.

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