LCMXO3LF-1300E-5MG256I

The LCMXO3LF-1300E-5MG256I is a MachXO3 family field programmable gate array (FPGA) packaged in a 256‑VFBGA (CSPBGA) form factor. It provides 1,280 logic elements, approximately 0.0625 Mbits (65,536 bits) of embedded RAM, and 206 general-purpose I/O pins in a surface-mount industrial-grade package. Designed for flexible system logic, the device combines non-volatile configuration, embedded IP blocks, and a compact BGA package to address control, interface and glue-logic requirements in industrial and embedded applications.

Key Features

• Logic Capacity — 1,280 logic elements to implement combinational and sequential logic, finite state machines, and small-scale glue logic.
• Embedded Memory — 65,536 bits of on-chip RAM (approximately 0.0625 Mbits) for FIFOs, small buffers, and state storage.
• I/O Density — 206 I/O pins with flexible programmable I/O cells for interfacing to peripherals and system buses.
• On‑chip Clocking & Timing — Includes flexible on-chip clocking resources such as PLLs and oscillator features referenced in the MachXO3 family architecture for system clock management.
• Hardened IP and System Functions — Family-level embedded hardened IP blocks (for example: I²C, SPI, timer/counter and other system-level functions) and User Flash Memory (UFM) for configuration or small data storage.
• Configuration & Testability — Features family-supported configuration and testing capabilities including IEEE 1149.1-compliant boundary-scan testability and TransFR reconfiguration.
• Power & Supply — Operates from a core voltage range of 1.14 V to 1.26 V with standby and power-saving options described for the MachXO3 family.
• Packaging & Mounting — Surface-mount 256‑VFBGA (CSPBGA) package; supplier package listed as 256‑CSFBGA (9x9) for compact board footprint.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• RoHS Compliant — Conforms to RoHS requirements.

Typical Applications

• Embedded control and glue logic — Use the device’s logic elements and I/O density to implement board-level interface bridging, protocol adaptation, and control-state machines.
• Peripheral interface consolidation — Leverage the 206 I/O pins and programmable I/O cells to consolidate multiple peripheral interfaces into a single FPGA-based bridge.
• Compact industrial instrumentation — Industrial temperature rating and a small 256‑VFBGA package allow the FPGA to be integrated into compact, rugged instrumentation and control modules.

Unique Advantages

• Non‑volatile, multi‑time programmable configuration — Retains configuration without external memory, simplifying power-up behavior and reducing BOM.
• High I/O count in a compact package — 206 I/Os in a 256‑VFBGA enable dense connectivity while preserving PCB area.
• Embedded system IP — Hardened I²C, SPI and timer/counter blocks (MachXO3 family features) reduce logic utilization and accelerate development.
• Industrial-grade operating range — −40 °C to 100 °C rating supports deployment in harsher environments where temperature resilience matters.
• Integrated power and clock resources — On-chip PLLs, oscillator and power-saving modes enable flexible clocking and lower power operation consistent with MachXO3 family architecture.
• Testability and reconfiguration — Boundary-scan support and TransFR reconfiguration options improve board-level testability and in-field update capability.

Why Choose LCMXO3LF-1300E-5MG256I?

This MachXO3 FPGA balances compact packaging with a practical mix of logic, memory, and I/O to address board-level control, interface bridging, and embedded system tasks. Its non-volatile configuration, hardened system IP, and family-level clocking and power features make it suitable for designs that require reliable configuration retention, flexible I/O, and straightforward integration into industrial systems.

Engineers seeking a small-footprint, industrial-temperature FPGA with modest logic and embedded memory resources will find the LCMXO3LF-1300E-5MG256I appropriate for reducing external components, improving system testability, and simplifying firmware-driven reconfiguration workflows.

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