LCMXO3L-9400E-6MG256I

IC FPGA 206 I/O 256CSFBGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 442368 9400 256-VFBGA, CSPBGA

Quantity 806 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CSFBGA (9x9)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-VFBGA, CSPBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3L-9400E-6MG256I – MachXO3 FPGA, 9,400 logic elements, 206 I/O, 256-VFBGA

The LCMXO3L-9400E-6MG256I is a MachXO3 family Field Programmable Gate Array (FPGA) offered in a 256-VFBGA (CSPBGA) package. It provides 9,400 logic elements, 206 user I/O pins and approximately 0.44 Mbits of embedded RAM (442,368 bits), targeting designs that require flexible on-chip logic, memory and dense I/O in a compact surface-mount package.

Designed for industrial applications, this device combines the MachXO3 family architecture and system-level features with a low-voltage supply range and extended temperature capability to address programmable glue logic, interface consolidation and control functions where non-volatile, multi-time programmable configuration and system integration are important.

Key Features

  • Core Logic: 9,400 logic elements for implementing custom logic, state machines and glue functions.
  • Embedded Memory: Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for FIFOs, small buffers and local data storage.
  • I/O Capacity: 206 user I/O pins to support dense external peripheral, sensor and bus interfacing requirements.
  • Low-Voltage Supply: Operates from 1.14 V to 1.26 V, suitable for designs targeting low-voltage core domains.
  • Industrial Temperature Range: Specified for −40 °C to 100 °C operation to meet demanding environmental requirements.
  • Package and Mounting: 256-VFBGA (supplier package: 256-CSFBGA 9×9), surface-mount for compact PCB implementations.
  • Non-volatile, Multi-time Programmable Configuration: MachXO3 family features include non-volatile configuration and multi-time programmability for in-field updates and persistent system logic.
  • On-chip System Features: Family-level documentation lists programmable I/O cells, on-chip oscillators, sysCLOCK PLLs, embedded block RAM, and hardened IP cores (I²C, SPI, timers) for streamlined system integration.
  • System Reliability and Test: Family data sheet includes IEEE 1149.1-compliant boundary scan support and power-on-reset behavior for production testability and controlled startup.
  • RoHS Compliant: Device is RoHS compliant.

Typical Applications

  • Industrial Automation: Use the industrial temperature rating, broad I/O count and non-volatile configuration for control logic, signal aggregation and deterministic interfacing in automation equipment.
  • Interface Bridging and Glue Logic: Dense I/O and embedded memory make the device well suited for consolidating multiple interfaces, translating signals and implementing board-level control functions.
  • Embedded System Control: On-chip timers, hardened I²C/SPI cores and programmable I/O support system supervision, peripheral management and local control tasks.

Unique Advantages

  • Highly Integrated I/O and Logic: 206 I/O pins paired with 9,400 logic elements reduce external components and simplify board-level design for complex interface requirements.
  • Persistent, Updatable Configuration: Non-volatile, multi-time programmable configuration enables in-field updates and persistent logic without external configuration memory.
  • System-Level IP and Peripherals: Embedded hardened IP blocks (I²C, SPI, timers) and on-chip oscillator support faster time-to-market by reducing IP integration effort.
  • Industrial-ready Operation: Specified −40 °C to 100 °C operation and surface-mount 256-VFBGA packaging meet demanding environmental and form-factor constraints.
  • Deterministic Clocking and Memory: Family-level PLLs and embedded block RAM provide predictable clocking and local buffering for timing-sensitive designs.
  • Compliance and Testability: RoHS compliance plus IEEE 1149.1 boundary-scan support (as documented for the MachXO3 family) aid manufacturing and environmental requirements.

Why Choose LCMXO3L-9400E-6MG256I?

The LCMXO3L-9400E-6MG256I is positioned for designs that need a balance of moderate logic capacity, significant I/O density and on-chip memory within a compact, industrial-grade package. Its MachXO3 family architecture provides system-oriented features—programmable I/O cells, embedded block RAM, PLL-based clocking and hardened peripheral IP—that simplify integration of interface, control and glue logic functions.

This part is well suited to engineering teams building industrial control, interface consolidation or embedded system functions that require persistent configuration, predictable clocking and production testability while maintaining a small board footprint and RoHS compliance.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the LCMXO3L-9400E-6MG256I.

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