LCMXO3L-9400E-6BG400I

The LCMXO3L-9400E-6BG400I is a MachXO3 family field programmable gate array (FPGA) from Lattice Semiconductor. It provides 9,400 logic elements, approximately 0.42 Mbits of embedded RAM, and a high-density I/O complement for system-level integration in industrial-grade applications.

Built around a flexible, non-volatile FPGA architecture, this device combines on-chip memory, programmable I/O, clocking resources and hardened peripheral IP to address control, glue-logic and interface tasks where integration, reconfigurability and extended temperature operation matter.

Key Features

• Core Logic — 9,400 logic elements providing the programmable fabric required for glue logic, state machines and interface handling.
• Embedded Memory — Approximately 0.42 Mbits (442,368 bits) of on-chip RAM suitable for FIFOs, buffers and small data storage.
• I/O Density — 335 user I/Os to support dense peripheral and bus interfacing without extensive external logic.
• Non-volatile, Multi-time Programmable Configuration — On-chip non-volatile configuration enables single-chip deployment with the ability to reprogram multiple times.
• Clocking and Timing — Flexible on-chip clocking resources including sysCLOCK PLLs and an on-chip oscillator for system clock generation and distribution.
• Hardened IP — Embedded hardened IP functions such as I²C, SPI and timer/counter blocks for common peripheral control and system tasks.
• Programmable I/O and Buffering — Comprehensive programmable I/O cell architecture and sysI/O buffer options to support a range of signaling requirements.
• Power and Voltage — Core supply range specified at 1.14 V to 1.26 V for predictable low-voltage operation.
• Package and Mounting — 400-LFBGA package (supplier device package: 400-CABGA, 17×17), surface-mount device for compact board-level integration.
• Industrial Temperature Grade — Specified operating range from −40 °C to 100 °C for extended-environment applications.
• Standards and Compliance — RoHS compliant.

Unique Advantages

• High integration density: 9,400 logic elements and 335 I/Os reduce external glue logic and simplify board-level design.
• On-chip memory and peripherals: Approximately 0.42 Mbits of embedded RAM plus hardened I²C, SPI and timer/counter IP accelerate development of control and interface functions.
• Non-volatile, reprogrammable configuration: Multi-time programmable configuration enables field updates and flexible system tuning without external configuration memory.
• Flexible clocking: Integrated PLLs and an on-chip oscillator provide versatile clocking options for synchronous designs.
• Industrial temperature support: Rated from −40 °C to 100 °C to match demanding thermal environments.
• Compact, manufacturable package: 400-LFBGA (400-CABGA, 17×17) surface-mount package supports high-density PCBs and automated assembly.

Why Choose LCMXO3L-9400E-6BG400I?

The LCMXO3L-9400E-6BG400I positions itself as a flexible, industrial-grade FPGA suited to system integration tasks that require substantial I/O, embedded memory and non-volatile configurability. Its combination of programmable logic, hardened peripheral IP and on-chip clocking resources makes it appropriate for designs that prioritize integration and long-term reconfigurability.

Backed by Lattice Semiconductor documentation for the MachXO3 family, this device is a practical choice for engineers and procurement teams seeking a compact, RoHS-compliant FPGA solution with an industrial operating range and comprehensive on-chip resources.

Request a quote or contact sales to discuss pricing, availability and sample requests for the LCMXO3L-9400E-6BG400I.