LCMXO3L-9400E-6MG256C

The LCMXO3L-9400E-6MG256C is a MachXO3 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It provides 9,400 logic elements, approximately 0.44 Mbits of embedded RAM, and up to 206 programmable I/Os in a 256‑VFBGA (CSPBGA) surface-mount package.

Designed for commercial temperature operation (0 °C to 85 °C) and low-voltage systems (1.14 V to 1.26 V supply), this device combines non-volatile, multi-time programmability and MachXO3 family system functions to enable flexible glue logic, I/O expansion and embedded-control applications.

Key Features

• Core Capacity  9,400 logic elements provide a scalable fabric for glue logic, control functions and mid-density FPGA tasks.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM for buffering, small FIFOs and local data storage.
• High I/O Count  206 programmable I/Os support broad peripheral interfacing and system-level signal routing.
• Non-Volatile, Multi-Time Programmable  MachXO3 family non-volatile configuration enables reprogramming and persistent configuration without external flash.
• On-Chip System Functions  Datasheet-listed hardened functions and system features in the MachXO3 family include on-chip oscillators, PLLs, embedded IP cores (I²C, SPI, timer/counter) and user flash memory (UFM) to simplify system design.
• Configuration and Test  IEEE 1149.1-compliant boundary scan testability and family configuration features support manufacturing test and in-system configuration.
• Packaging and Mounting  256‑VFBGA (CSPBGA) 9×9 supplier package in a surface-mount form factor for compact board designs.
• Power and Temperature  Operates from a 1.14 V to 1.26 V supply and across a commercial temperature range of 0 °C to 85 °C.
• RoHS Compliant  Device is RoHS compliant for environmental and regulatory alignment.

Typical Applications

• I/O Expansion and Glue Logic  Use the 206 I/Os and 9,400 logic elements to implement board-level interfacing, protocol translation and signal conditioning between system components.
• Embedded Control and State Machines  Leverage on-chip memory and hardened system functions to build embedded control, sequencing and timing functions without external processors.
• Peripheral Bridging and Protocol Interfaces  Hardened I²C/SPI cores and flexible I/O support make the device suitable for bridging between sensors, displays and host interfaces.

Unique Advantages

• Highly Integrated Mid-Range FPGA:  Combines 9,400 logic elements with substantial embedded RAM and 206 I/Os to reduce the need for external glue logic and discrete components.
• Non-Volatile Configuration:  Multi-time programmable, non-volatile configuration removes dependency on external configuration memory and simplifies system power-up behavior.
• System-Level Building Blocks:  On-chip oscillators, PLLs, hardened IP (I²C, SPI, timer/counter) and UFM accelerate development and reduce integration effort.
• Compact, Surface-Mount Package:  256‑VFBGA (CSPBGA) package supports dense PCB layouts while delivering a high I/O count for complex board designs.
• Manufacturing and Test Support:  IEEE 1149.1 boundary scan and family configuration/test features aid production testability and in-system verification.

Why Choose LCMXO3L-9400E-6MG256C?

The LCMXO3L-9400E-6MG256C positions itself as a mid-density, system-friendly FPGA solution within the MachXO3 family. With 9,400 logic elements, approximately 0.44 Mbits of embedded RAM and 206 I/Os in a compact 256‑VFBGA package, it is well suited for commercial applications that require flexible I/O, non-volatile configuration and integrated system functions.

Engineers designing board-level control, interface bridging or embedded sequencing can rely on the MachXO3 family features—such as on-chip clocking, hardened peripheral IP, configuration flexibility and boundary-scan support—to streamline development, reduce BOM complexity and improve time-to-market.

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