LCMXO3LF-1300C-5BG256C

The LCMXO3LF-1300C-5BG256C is a MachXO3 family FPGA from Lattice Semiconductor that delivers non-volatile, multi-time programmable logic in a compact 256-LFBGA package. This device integrates 1,280 logic elements, 65,536 bits of embedded RAM and 206 user I/O pins to support flexible on-chip logic, memory and interface functions.

Designed for commercial-temperature systems, the device supports a supply voltage range of 2.375 V to 3.465 V, RoHS compliance, and surface-mount assembly for board-level integration.

Key Features

• Logic Capacity  1,280 logic elements provide mid-range programmable logic for control, glue logic and interface tasks.
• Embedded Memory  65,536 bits of on-chip RAM (sysMEM) for data buffering, FIFOs and small lookup tables.
• I/O and Interfaces  206 user I/O pins with family support for pre‑engineered source-synchronous I/O and a high-performance, flexible I/O buffer architecture.
• Clocking  Flexible on-chip clocking with sysCLOCK phase-locked loops (PLLs) and an on-chip oscillator provide programmable clock management.
• Embedded Hardened IP  Hardened peripheral IP blocks on the MachXO3 family include I²C, SPI and timer/counter functions that reduce external component needs.
• Non-volatile Configuration  Multi-time programmable, non-volatile configuration enables persistent designs without external configuration memory and supports TransFR reconfiguration.
• Configuration & Memory  User Flash Memory (UFM) and support for RAM/ROM modes and memory cascading allow flexible data and code storage options.
• Package & Mounting  256-LFBGA (supplier device package: 256-CABGA (14×14)) in a surface-mount form factor for compact board-level integration.
• Electrical & Environmental  Recommended supply range 2.375 V to 3.465 V; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Interface Bridging and I/O Expansion  Use the device’s 206 I/O pins and source-synchronous I/O support to implement custom protocol bridging and expand board-level interfaces.
• Clock and Timing Management  Flexible on-chip clocking and sysCLOCK PLLs enable local clock generation and distribution for timing-critical subsystems.
• Embedded Control and Glue Logic  1,280 logic elements with non-volatile configuration provide reliable programmable control and glue logic for system orchestration.
• Peripheral Offload  Hardened I²C, SPI and timer/counter IP reduce external component count by handling common peripheral tasks on-chip.

Unique Advantages

• Non-volatile, reprogrammable configuration: Multi-time programmable non-volatile configuration simplifies system design by removing the need for external configuration memory.
• Balanced logic and memory: The combination of 1,280 logic elements and 65,536 bits of embedded RAM supports a variety of mid-density logic and buffering tasks on a single device.
• Comprehensive on-chip peripherals: Embedded hardened IP (I²C, SPI, timer/counter) and UFM reduce BOM and speed development by providing common functions in silicon.
• Flexible clocking and I/O: PLLs, an on-chip oscillator and flexible I/O buffer architecture enable adaptable clocking and high-performance interfacing without external IP cores.
• Compact, board-ready package: 256-LFBGA surface-mount package (256-CABGA (14×14)) enables a small PCB footprint for space-constrained designs.
• Commercial-grade temperature support: Rated for 0 °C to 85 °C operation to suit a wide range of commercial electronic applications.

Why Choose LCMXO3LF-1300C-5BG256C?

The LCMXO3LF-1300C-5BG256C delivers a practical balance of programmable logic, embedded memory and abundant I/O in a non-volatile MachXO3 family device. Its combination of 1,280 logic elements, 65,536 bits of on-chip RAM, hardened peripheral IP and flexible clocking makes it suitable for designers needing integrated control, interface and timing functions without external configuration memory.

With RoHS compliance, surface-mount packaging and a standard commercial operating range, this device is positioned for board-level systems where compact integration, persistent configuration and on-chip peripherals reduce BOM and streamline development.

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