LCMXO3L-9400E-6BG256I

The LCMXO3L-9400E-6BG256I is a MachXO3 family FPGA offering a mid-range programmable logic fabric with 9,400 logic elements and a high I/O count. Designed for system control, I/O consolidation and embedded logic functions, the device delivers on-chip memory, flexible I/O and family-level configuration and clocking features.

This surface-mount, industrial-grade device is supplied in a 256-ball LFBGA package and supports a core voltage range of 1.14 V to 1.26 V and an operating temperature range of -40 °C to 100 °C.

Key Features

• Core Logic  Approximately 9,400 logic elements for implementing control, glue logic and custom state machines.
• On-chip Memory  Approximately 0.42 Mbits (442,368 bits) of embedded RAM for buffering, small FIFOs and register storage.
• I/O Capacity  206 user I/Os to support peripheral interfacing, bus bridging and signal aggregation.
• Power and Temperature  Low-voltage core operation with a recommended supply range of 1.14 V to 1.26 V and an industrial operating temperature range of -40 °C to 100 °C.
• Packaging and Mounting  256-LFBGA (supplier package: 256-CABGA 14×14) in a surface-mount form factor for compact board designs.
• Non-volatile Configuration and Reconfiguration  MachXO3 family features include non-volatile, multi-time programmable configuration and TransFR reconfiguration capabilities described in the family datasheet.
• Integrated System IP and Clocking  Family-level documentation highlights embedded hardened IP (I2C, SPI, timer/counter), on-chip oscillator and flexible on-chip clocking including PLLs.
• Regulatory  RoHS-compliant manufacturing status.

Typical Applications

• Industrial Control  Industrial-grade temperature range and robust I/O count make the device suitable for control logic, I/O expansion and interface management in industrial systems.
• Embedded System Glue Logic  Use as a central glue-logic device to consolidate peripheral interfaces and implement custom finite-state machines with on-chip RAM for small buffers and FIFOs.
• Peripheral Bridging and I/O Aggregation  High I/O density enables aggregation and protocol bridging between multiple low- to mid-speed peripherals and system buses.

Unique Advantages

• High I/O density in a compact package: 206 user I/Os in a 256-LFBGA package allow significant interfacing capability without large board area.
• Balanced logic and memory resources: Roughly 9,400 logic elements paired with ~0.42 Mbits of embedded RAM for common control and buffering functions.
• Industrial-grade operation: Specified for -40 °C to 100 °C operation to meet industrial environment needs.
• Low-voltage core: Operates within a narrow 1.14 V–1.26 V supply window for designs targeting low-voltage logic domains.
• Family-level system features: MachXO3 family capabilities such as non-volatile configuration, on-chip oscillator, PLLs and embedded IP simplify system integration.
• RoHS compliant: Manufactured to RoHS standards for environmental compliance.

Why Choose LCMXO3L-9400E-6BG256I?

The LCMXO3L-9400E-6BG256I positions itself as a versatile, mid-density MachXO3 FPGA tailored for applications that require ample I/O, reliable industrial temperature operation and integrated memory for small buffering tasks. Its combination of approximately 9,400 logic elements, 206 I/Os and family-level features such as non-volatile configuration and embedded IP makes it a practical choice for system designers consolidating interfaces or implementing custom control logic.

This device is suited to teams seeking a compact, surface-mount solution in a 256-LFBGA package with clear electrical and environmental specifications (1.14 V–1.26 V supply, -40 °C to 100 °C). The MachXO3 family documentation further supports integration with on-chip clocking, PLLs and hardened peripheral IP blocks, providing a path for scalable, maintainable designs.

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