LCMXO3L-9400E-6BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 206 442368 9400 256-LFBGA

Quantity 1,374 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3L-9400E-6BG256C – MachXO3 Field Programmable Gate Array (FPGA), 9,400 logic elements, 206 I/Os, 256-LFBGA

The LCMXO3L-9400E-6BG256C is a MachXO3 family Field Programmable Gate Array (FPGA) IC providing a non-volatile, multi-time programmable logic fabric optimized for system-level support and configurable I/O. It combines 9,400 logic elements with embedded memory and a wide array of on-chip system features to address board-level control, interface glue logic, and I/O expansion tasks.

Packaged in a 256-LFBGA (supplier package: 256-CABGA, 14×14) and designed for commercial-grade applications, this device operates from a 1.14 V to 1.26 V core supply and across an ambient range of 0 °C to 85 °C.

Key Features

  • Logic Capacity  Approximately 9,400 logic elements for implementation of custom glue logic, finite-state machines, and control functions.
  • Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 total RAM bits) for FIFOs, buffers, and small data storage.
  • Flexible I/O  206 I/O pins provide broad external connectivity and support pre‑engineered source‑synchronous I/O and flexible I/O buffer configurations as described for the MachXO3 family.
  • Non‑volatile, Multi‑time Programmable  Built-in non‑volatile configuration capability enables multi-time programming and persistent device configuration without external flash.
  • On‑chip System IP  Family-level features include hardened IP functions such as I²C and SPI cores, timers/counters, an on‑chip oscillator, and user flash memory (UFM) for system tasks.
  • Clocking and Timing  Integrated PLLs and flexible on‑chip clocking resources support common clocking requirements for synchronized interfaces.
  • Packaging and Mounting  256-LFBGA surface mount package (supplier device package 256-CABGA, 14×14) for compact board-level integration.
  • Commercial Grade and Compliance  Commercial grade device with operating temperature 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Interface Bridging and Glue Logic  Use the 9,400 logic elements and flexible I/O to implement protocol conversion, bus bridging, and board-level glue functions.
  • System Control and Configuration  Non-volatile multi-time programmable configuration and on-chip user flash memory enable control and initialization tasks without external configuration devices.
  • I/O Expansion and Buffering  206 I/Os and embedded RAM support I/O buffering, small FIFOs, and sensor/actuator aggregation at the board level.
  • Embedded Peripherals Integration  On-chip hardened I²C/SPI cores and timers simplify integration of common peripheral interfaces and timing functions.

Unique Advantages

  • Non‑volatile configuration: Enables persistent device configuration and repeated in-field programming without an external configuration flash device.
  • Balanced logic and memory: Combines ~9,400 logic elements with ~0.44 Mbits of embedded RAM to support both control logic and small buffering/queueing needs on a single device.
  • Extensive I/O count: 206 I/Os provide flexibility for interfacing multiple peripherals and buses, reducing the need for additional I/O expander ICs.
  • Built‑in system IP: Hardened I²C, SPI, timers/counters, and on‑chip oscillator reduce design effort and conserve logic resources for application functions.
  • Compact surface-mount package: 256-LFBGA (256-CABGA, 14×14) enables dense board layouts while keeping the device surface‑mount compatible.
  • Commercial temperature rating and RoHS compliance: Suitable for standard commercial applications with documented operating range and environmental compliance.

Why Choose LCMXO3L-9400E-6BG256C?

The LCMXO3L-9400E-6BG256C positions itself as a versatile MachXO3 family device for designers needing non‑volatile FPGA capability, significant I/O density, and on‑chip system IP in a compact, surface‑mount package. Its combination of approximately 9,400 logic elements, ~0.44 Mbits of embedded RAM, and 206 I/Os makes it suitable for board-level control, interface adaptation, and embedded system support within commercial temperature envelopes.

Choose this device when you need a single-chip solution that integrates programmable logic, memory, and peripheral interfaces to reduce BOM complexity, simplify board-level design, and retain the ability to reprogram device behavior multiple times in the field.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO3L-9400E-6BG256C and to discuss how it can fit into your next design.

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