LCMXO3L-9400E-5MG256I

The LCMXO3L-9400E-5MG256I is a MachXO3 family field programmable gate array (FPGA) supplied in a 256‑VFBGA (CSPBGA) package. It provides 9,400 logic elements with embedded on-chip RAM and up to 206 user I/Os, built for surface-mount board assembly and industrial operating conditions.

Designed to deliver integration and system-level flexibility, this device addresses applications that require reliable I/O density, embedded memory, and low-voltage core operation across a wide operating temperature range.

Key Features

• Core Logic — 9,400 logic elements to implement glue logic, control functions, and moderate-complexity programmable logic tasks.
• Embedded Memory — 442,368 bits of on-chip RAM (approximately 0.44 Mbits) for FIFOs, frame buffers, or small data stores.
• I/O Density — 206 user I/Os to support wide parallel interfaces, multiple peripheral connections, or mixed-signal companion devices.
• Power Supply — Core supply range from 1.14 V to 1.26 V to match low-voltage system rails.
• Clocking and Timing — Family-level features include programmable PLLs and on-chip clocking primitives for flexible clock management and source-synchronous I/O support.
• Embedded System IP — Family datasheet documents hardened IP for common system functions such as I2C, SPI, and timer/counter blocks to simplify integration.
• Non-volatile, Multi-time Programmable — MachXO3 family devices include non-volatile configuration and multi-time programmability for in-field updates (as documented for the family).
• Package & Mounting — 256‑VFBGA (CSPBGA) package, supplier device package 256‑CSFBGA (9×9), intended for surface-mount assembly.
• Industrial Temperature Range — Specified for operation from −40 °C to 100 °C for deployment in industrial environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Deploy where a wide operating temperature range (−40 °C to 100 °C) and up to 206 I/Os are required for machine control, sensor interfaces, or supervisory logic.
• Interface Bridging & Glue Logic — Use the 9,400 logic elements and abundant I/O to consolidate bus adapters, level translation logic, and protocol bridging on a single device.
• System Management & Peripherals — Leverage embedded RAM (~0.44 Mbits) and hardened system IP blocks for device configuration, small data buffering, and peripheral control.

Unique Advantages

• High I/O Count in a Compact BGA — 206 I/Os in a 256‑VFBGA package enables dense connectivity without a larger footprint.
• Integrated Memory for Local Data Handling — Approximately 0.44 Mbits of on-chip RAM supports FIFOs and small buffers, reducing external memory needs.
• Low-Voltage Core Compatibility — Core supply of 1.14–1.26 V aligns with modern low-voltage system rails to simplify power supply design.
• Industrial-Grade Operation — Specified operation from −40 °C to 100 °C for use in demanding environments.
• System-Level IP and Clocking — Family-level PLLs, on-chip oscillators, and hardened I2C/SPI/timer functions reduce design time and component count.
• RoHS Compliant — Conforms to RoHS requirements for environmental and supply-chain compatibility.

Why Choose LCMXO3L-9400E-5MG256I?

This MachXO3 device combines a substantial logic element count with a high I/O complement and embedded RAM in a 256‑VFBGA surface-mount package, making it well-suited for industrial designs that require reliable digital integration and flexible interfacing. The low-voltage core, family-provided clocking and hardened IP blocks, and non-volatile configuration support provide a practical balance of integration and system-level capability.

Choose this part when your design needs moderate programmable logic capacity, significant I/O density, and industrial temperature support while minimizing external components and preserving board area.

Request a quote or submit an inquiry to get pricing and availability for the LCMXO3L-9400E-5MG256I. Our team will respond with product lead times and ordering options tailored to your project needs.