LCMXO3L-9400E-5BG400C

The LCMXO3L-9400E-5BG400C is a MachXO3 family FPGA from Lattice Semiconductor Corporation. It combines a dense logic fabric with embedded memory and rich I/O capability in a compact 400‑LFBGA (400‑CABGA, 17×17) surface‑mount package, targeting commercial‑grade embedded applications that require flexible system control, interfacing and on‑chip peripheral integration.

Designed for designs that need non‑volatile, reprogrammable logic with integrated peripherals and clocking, this device offers 9,400 logic elements, approximately 0.44 Mbits of on‑chip RAM, and up to 335 I/Os, while operating across a core supply range of 1.14 V to 1.26 V and a commercial temperature window of 0 °C to 85 °C.

Key Features

• Logic Capacity — 9,400 logic elements provide the programmable fabric for glue logic, glue-less bridging, state machines and control functions.
• Embedded Memory — 442,368 total RAM bits (approximately 0.44 Mbits) for FIFOs, buffers and on‑chip data storage.
• High I/O Count — Up to 335 I/Os to support dense peripheral connectivity and multi‑bus interfacing.
• Advanced On‑Chip IP — Family-level features include hardened IP such as I²C and SPI cores, timers/counters and user flash memory (UFM) for configuration data and system parameters.
• Flexible Clocking & Oscillator — Built‑in on‑chip oscillator and flexible clocking resources (including PLLs) for system timing and source‑synchronous interfaces.
• Reconfiguration & Non‑Volatile Storage — Non‑volatile, multi‑time programmable configuration and TransFR reconfiguration support for field updates and system flexibility.
• Packaging & Mounting — 400‑LFBGA (supplier device package: 400‑CABGA, 17×17), surface mount for compact board footprint.
• Power & Operating Range — Core voltage supply range of 1.14 V to 1.26 V; commercial grade operation from 0 °C to 85 °C.
• Standards & Compliance — RoHS compliant.

Typical Applications

• System Control & Glue Logic — Implement control-state machines, protocol bridging and system supervisory functions using the device's logic fabric and embedded memory.
• Peripheral Interface & Bus Bridging — Use the 335 I/Os and hardened serial IP (I²C/SPI) to interface sensors, displays, and external controllers without large external glue ICs.
• Embedded Memory Functions — Leverage the ~0.44 Mbits of on‑chip RAM for buffering, FIFOs or frame storage in data path applications.

Unique Advantages

• Compact, high‑density implementation: 9,400 logic elements and a high I/O count in a 400‑LFBGA package reduce board area and component count.
• Integrated on‑chip peripherals: Hardened I²C, SPI, timers and UFM simplify system design and reduce dependence on discrete peripherals.
• Non‑volatile, field‑update capable: Multi‑time programmable configuration and TransFR reconfiguration enable in‑field updates and flexible product iterations.
• Flexible clocking and I/O: On‑chip oscillator, PLLs and programmable I/O cells support diverse timing and interface requirements without extra components.
• Commercial‑grade reliability: Rated for 0 °C to 85 °C and RoHS compliant for standard embedded deployments.

Why Choose LCMXO3L-9400E-5BG400C?

The LCMXO3L-9400E-5BG400C positions itself as a versatile, reprogrammable logic device for commercial embedded systems that need a balance of logic density, embedded memory and extensive I/O in a compact surface‑mount package. Its built‑in peripherals, non‑volatile configuration capability and flexible clocking make it suitable for designs that require in‑field reprogrammability and integrated interface support while keeping board BOM and complexity down.

Engineers and procurement teams can rely on the device's clear electrical and environmental ratings — including a defined core voltage range and operating temperature window — for confident integration into product designs that require robust, reconfigurable system logic with on‑chip memory and peripheral support.

If you would like pricing or availability, request a quote or submit an inquiry to our sales team for the LCMXO3L-9400E-5BG400C.