LCMXO3L-9400C-6BG400I

IC FPGA 335 I/O 400CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA

Quantity 292 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package400-CABGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case400-LFBGANumber of I/O335Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs1175Number of Logic Elements/Cells9400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LCMXO3L-9400C-6BG400I – MachXO3 Field Programmable Gate Array (FPGA) IC 335 442368 9400 400-LFBGA

The LCMXO3L-9400C-6BG400I is an industrial‑grade MachXO3 family FPGA from Lattice Semiconductor designed for flexible system control and high I/O integration. It offers a non‑volatile, multi‑time programmable architecture with on‑chip resources that support interface bridging, embedded control, and system‑level functions.

With 9,400 logic elements, 335 user I/O pins, and embedded memory, this device targets designs that require dense I/O, integrated peripheral support, and robust operating conditions between −40 °C and 100 °C.

Key Features

  • Logic Capacity — 9,400 logic elements deliver programmable fabric for glue‑logic, control sequencing, and peripheral management.
  • Embedded Memory — Approximately 0.44 Mbits of on‑chip RAM (442,368 bits) for FIFOs, small buffers, and local data storage.
  • High I/O Density — 335 user I/O pins to support multi‑lane interfaces, parallel peripherals, and board‑level signal consolidation.
  • Non‑volatile, Multi‑time Programmable — MachXO3 family non‑volatile configuration enables field reprogramming and persistent logic without external configuration memory.
  • Advanced I/O and Clocking — Includes pre‑engineered source synchronous I/O and flexible on‑chip clocking (PLLs and internal oscillator) for synchronized data transfers and timing control.
  • Embedded Hardened IP — Datasheet references hardened I²C and SPI IP cores and a timer/counter block to simplify peripheral interfacing and reduce HDL development effort.
  • System and Power Management — Features such as standby mode, TransFR reconfiguration support, and on‑chip User Flash Memory (UFM) are included for system‑level flexibility and power saving.
  • Package and Mounting — 400‑LFBGA (400‑CABGA, 17 × 17 mm) surface‑mount package suitable for compact board designs.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Supply Voltage — Operates from 2.375 V to 3.465 V to accommodate common I/O and core supply schemes.
  • Testability and Reliability — Includes IEEE 1149.1‑compliant boundary scan testability as documented in the datasheet.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • Interface Bridging and Glue Logic — High I/O count and flexible I/O buffering make the device well suited for consolidating multiple peripheral buses and translating between interfaces.
  • Peripheral and Sensor Control — Hardened I²C and SPI IP cores plus timer/counter resources support direct peripheral management and sensor interfacing without extensive custom IP.
  • Embedded System Control — Non‑volatile configuration, UFM and standby features enable reliable boot behavior and field reconfiguration for embedded controllers and system supervisors.

Unique Advantages

  • Highly Integrated I/O and Memory: 335 I/Os combined with approximately 0.44 Mbits of embedded RAM reduce external component count and simplify board routing.
  • Non‑volatile, Reprogrammable: Multi‑time programmable configuration removes the need for external configuration flash while enabling field updates.
  • Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
  • Ready‑to‑Use Peripheral Blocks: Hardened I²C, SPI, and timer/counter blocks accelerate integration of common interfaces and functions.
  • Compact Packaging: 400‑LFBGA (17 × 17 mm) provides a small board footprint while delivering high I/O density.
  • System Test Support: Built‑in boundary scan (IEEE 1149.1) simplifies manufacturing test and board‑level diagnostics.

Why Choose LCMXO3L-9400C-6BG400I?

The LCMXO3L-9400C-6BG400I positions itself as a flexible, industrial‑rated FPGA option for designs that need substantial I/O, on‑chip memory, and non‑volatile programmability. Its MachXO3 family feature set—embedded hardened IP, source synchronous I/O, flexible clocking, and power management—helps reduce BOM and accelerate time to market for control, interface, and embedded applications.

This device is well suited for engineers and procurement teams who require a compact, surface‑mount FPGA with robust temperature ratings and strong system integration features. The combination of programmable fabric, embedded peripherals, and testability provides long‑term value through easier design integration and field reconfiguration capabilities.

Request a quote or submit an inquiry to get pricing and availability for the LCMXO3L-9400C-6BG400I for your next design.

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