LCMXO3L-6900E-6MG324I

The LCMXO3L-6900E-6MG324I is a MachXO3 family Field Programmable Gate Array (FPGA) IC designed for industrial embedded designs. It provides a non-volatile, multi-time programmable architecture with 6,864 logic elements and approximately 0.246 Mbits of embedded RAM to implement glue logic, I/O consolidation, and mid-density programmable functions.

With 281 I/Os, support for on-chip clocking and PLLs, and a compact 324-VFBGA surface-mount package, this device targets industrial applications that require reliable I/O flexibility, reconfiguration options, and operation across a wide temperature range.

Key Features

• Logic Capacity — 6,864 logic elements and 858 LABs provide mid-density programmable logic resources for control, interfacing, and custom logic implementation.
• Embedded Memory — Approximately 0.246 Mbits (245,760 bits) of on-chip RAM (sysMEM) supporting single, dual, pseudo-dual port and FIFO modes for buffering and local storage.
• I/O Resources — 281 programmable I/O pins with pre-engineered source-synchronous I/O and high-performance, flexible I/O buffer options to support a variety of interface requirements.
• Clocking and Timing — Flexible on-chip clocking including sysCLOCK PLLs for system clock generation and distribution.
• Embedded Hardened IP — Family-level support for hardened I2C and SPI IP cores, timers/counters, and other embedded functions to reduce logic resource usage.
• Non-volatile Configuration — Multi-time programmable non-volatile configuration with TransFR reconfiguration and User Flash Memory (UFM) for in-system updates and configuration storage.
• Power and Supply — Low-voltage core supply range of 1.14 V to 1.26 V for the device core.
• Package and Mounting — 324-VFBGA package (supplier device package: 324-CSFBGA, 10×10) in a surface-mount form factor suited to space-constrained boards.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Testability and Reliability — Features include IEEE 1149.1-compliant boundary scan and family-level support for hot socketing, power-on-reset, and standby/power-saving modes.
• Standards and Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Consolidate I/O, implement custom control logic and protocol bridging while meeting industrial temperature requirements (−40 °C to 100 °C).
• Interface Bridging — Use the device’s 281 I/Os and pre-engineered source-synchronous I/O to translate or aggregate multiple peripheral interfaces.
• Embedded System Glue Logic — Replace discrete logic with programmable functions using 6,864 logic elements and embedded RAM for buffering and state machines.
• Configuration-Managed Systems — Employ non-volatile, multi-time programmable configuration and UFM for field updates and in-system reconfiguration.

Unique Advantages

• Mid-density programmability: 6,864 logic elements and 858 LABs deliver sufficient capacity for glue logic, peripheral control, and protocol handling without over-provisioning.
• Embedded memory flexibility: Approximately 0.246 Mbits of sysMEM supports multiple memory modes (single/dual port, pseudo-dual, FIFO), enabling local storage and buffering strategies.
• Extensive I/O count: 281 I/Os allow high pin-count interfacing and integration of multiple signals and buses on a single device.
• Industrial-ready thermal range: Rated −40 °C to 100 °C to suit harsh or temperature-variable installations.
• Compact, board-friendly package: 324-VFBGA (324-CSFBGA 10×10) surface-mount package saves PCB space while providing robust I/O connectivity.
• Configurable system features: On-chip PLLs, programmable I/O cells, hardened IP (I2C, SPI, timers), and UFM support system-level integration and simplified BOM.

Why Choose LCMXO3L-6900E-6MG324I?

The LCMXO3L-6900E-6MG324I positions itself as a practical mid-density FPGA choice for industrial embedded designs that need reliable I/O, on-chip memory, and flexible configuration options. Its combination of 6,864 logic elements, extensive I/O, non-volatile multi-time programmability, and family-level features such as hardened IP, PLLs, and on-chip oscillator enable compact, integrated solutions without external configuration memory.

This device is appropriate for engineers and system designers seeking a compact, industrial-grade FPGA to consolidate logic, implement interface bridging, and support in-field reconfiguration while maintaining a small PCB footprint and predictable power supply requirements.

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