LCMXO3L-4300E-6MG256I

The LCMXO3L-4300E-6MG256I is a MachXO3 family Field Programmable Gate Array (FPGA) offered in a 256-ball VFBGA/CSPBGA package. Built around a flexible, non-volatile architecture, the device integrates on-chip memory, hardened IP blocks and a rich I/O complement to address system glue, interface and control functions in industrial environments.

With 4,320 logic elements, 94,208 bits of embedded RAM and up to 206 I/Os, this industrial-grade FPGA delivers integration and configuration flexibility while supporting a 1.14 V–1.26 V core supply and an extended operating range of −40 °C to 100 °C.

Key Features

• Core Logic 4,320 logic elements and 540 logic blocks (as specified) for implementing custom control, glue logic and interface functions.
• Embedded Memory 94,208 bits of on-chip RAM supporting single/dual/pseudo-dual port and FIFO modes for local buffering and state storage.
• I/O Density & Flexibility Up to 206 I/Os with pre‑engineered source‑synchronous I/O and a high‑performance, flexible I/O buffer architecture for diverse board-level interfaces.
• Non-volatile, Multi-time Programmable Configuration On-device non-volatile configuration and TransFR reconfiguration capability enable in-system updates and persistent designs without external Flash.
• Hardened IP & System Functions Embedded hardened functions include I²C and SPI IP cores, timer/counter blocks, on-chip oscillator and user flash memory (UFM) for system management and peripheral control.
• Clocking & Timing Flexible on-chip clocking with sysCLOCK phase-locked loops (PLLs) and a distributed clock/control network for synchronized designs.
• Configuration & Testability IEEE 1149.1-compliant boundary scan support and comprehensive configuration/testing options simplify board-level validation and manufacturing test.
• Packaging & Environmental 256-VFBGA / CSPBGA (supplier package: 256-CSFBGA 9×9), surface-mount, RoHS compliant and rated for industrial temperature operation (−40 °C to 100 °C).
• Power Core supply range defined at 1.14 V to 1.26 V for predictable power planning and system integration.

Typical Applications

• Industrial Control — Use the industrial-grade temperature range and on-chip resources for board-level control, I/O aggregation and real-time signal handling.
• Interface Bridging and Glue Logic — High I/O count and flexible I/O buffers enable protocol adaptation and signal conditioning between system components.
• Embedded System Management — Non-volatile configuration, user flash memory and hardened IP (I²C, SPI, timers) support system housekeeping and in-field updates.
• Prototyping and Low- to Mid-density FPGA Designs — The combination of logic elements, embedded RAM and PLLs accommodates custom logic, buffering and timing needs for a variety of designs.

Unique Advantages

• Highly integrated, non-volatile solution: On-device non-volatile configuration and UFM reduce external component count and simplify board design.
• Industrial operability: Rated for −40 °C to 100 °C and supplied in a compact 256-ball VFBGA/CSPBGA package for use in rugged environments.
• Flexible I/O and clocking: Pre‑engineered source-synchronous I/O, flexible I/O buffers and on-chip PLLs make timing-critical interfacing and synchronization straightforward.
• Embedded system IP: Hardened I²C, SPI and timer/counter blocks speed integration of peripheral control and reduce RTL development effort.
• Test and manufacturing readiness: IEEE 1149.1 boundary-scan support and comprehensive configuration/testing features ease board bring-up and production testing.

Why Choose LCMXO3L-4300E-6MG256I?

The LCMXO3L-4300E-6MG256I positions itself as a flexible, industrial-grade FPGA that combines non-volatile configuration, a balanced mix of logic and embedded memory, and a high I/O count in a compact 256-ball package. It fits designs that require reliable system integration, in-field configurability and a predictable power and temperature specification.

Designers and procurement teams seeking a mid-density, reconfigurable device with hardened IP blocks and industrial temperature capability will find this MachXO3 family member suited to board-level control, interface bridging and embedded system management tasks while simplifying BOM and supporting field updates.

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