LCMXO3L-4300E-6MG121I

The LCMXO3L-4300E-6MG121I is a MachXO3 family FPGA IC providing a compact, industrial-grade programmable logic solution. It integrates 4,320 logic elements with approximately 94.2kbits of embedded RAM and up to 100 I/Os in a 121-ball VFBGA (6×6) package.

Designed for applications that require non-volatile, multi-time programmable logic in a small surface-mount package, this device combines configurable logic, on-chip memory, programmable I/O and family-level system features such as PLLs, on-chip oscillator and embedded IP blocks referenced in the MachXO3 datasheet.

Key Features

• Logic Capacity — 4,320 logic elements (cells) suitable for small- to mid-density programmable logic implementations.
• Embedded Memory — 94,208 total RAM bits (approximately 94.2 kbits) of on-chip sysMEM for data buffering and small lookup tables.
• I/O Count & Flexibility — Up to 100 I/Os with programmable I/O cells and high-performance, flexible I/O buffer options described in the MachXO3 family documentation.
• Non‑volatile, Multi‑time Programmable — Family-level support for non-volatile configuration and multi-time programmability for firmware field updates and persistent configuration.
• Clocking & Timing — On-chip clocking features including sysCLOCK PLLs and flexible clock distribution (as documented for the MachXO3 family) to support synchronized designs.
• Embedded IP and Peripherals — MachXO3 family includes hardened IP such as I²C and SPI cores, timers/counters and user flash memory (UFM) for system management and peripheral interfacing.
• Packaging & Mounting — 121-VFBGA / 121-CSFBGA (6×6) surface-mount package for compact board integration.
• Industrial Temperature Grade — Rated for operation from −40°C to 100°C, suitable for industrial environments.
• Supply Voltage — Operates from 1.14 V to 1.26 V for core supply compatibility within defined system rails.
• Reliability & Test — Family features include configuration and testing support such as IEEE 1149.1-compliant boundary scan and device configuration options.
• RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

• Industrial control and interface — Industrial-grade temperature range (−40°C to 100°C) and up to 100 I/Os allow implementation of control logic, protocol bridging and I/O aggregation in industrial systems.
• Embedded system glue logic — 4,320 logic elements and on-chip RAM provide capacity for custom glue logic, state machines and small data-path functions between processors and peripherals.
• Non‑volatile configuration and system management — Multi-time programmable configuration and user flash memory support persistent device configuration and in-field updates for system-level control functions.
• Compact, space-constrained designs — 121-ball VFBGA (6×6) package and surface-mount mounting simplify integration into small PCBs and modules where board area is limited.

Unique Advantages

• Highly integrated, compact package: 121-ball VFBGA (6×6) delivers 4,320 logic elements and up to 100 I/Os in a small form factor, reducing board footprint.
• Industrial operating range: Specified −40°C to 100°C operation supports deployments in harsh or variable temperature environments.
• Persistent configurability: Non-volatile, multi-time programmable architecture and UFM enable in-field updates and retained configuration without external flash.
• On-chip system features: Family-level PLLs, on-chip oscillator, hardened peripheral IP (I²C, SPI, timers) and memory blocks simplify system design and reduce external component count.
• Flexible I/O and clocking: Programmable I/O cells and flexible clock distribution support a range of interface and timing requirements within the device’s documented capabilities.
• RoHS-compliant manufacturing: Conforms to environmental requirements for streamlined compliance in product builds.

Why Choose LCMXO3L-4300E-6MG121I?

The LCMXO3L-4300E-6MG121I positions itself as a compact, industrial-grade MachXO3 FPGA option that balances programmable logic capacity, embedded memory and system-level features in a small 121-VFBGA package. Its combination of 4,320 logic elements, approximately 94.2 kbits of on-chip RAM, up to 100 I/Os and non-volatile multi-time programmability makes it suitable for designers needing persistent configuration and integrated peripheral support without a large footprint.

This device is a fit for engineering teams implementing board-level control, interface bridging, and compact embedded logic where industrial temperature range, package density and family-level IP/clocking resources are important for reducing BOM and simplifying system integration.

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