LCMXO3L-4300E-6MG324C
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 268 94208 4320 324-VFBGA |
|---|---|
| Quantity | 1,731 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-CSFBGA (10x10) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-VFBGA | Number of I/O | 268 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO3L-4300E-6MG324C – MachXO3 Field Programmable Gate Array, 4320 logic elements, 268 I/O, 324‑VFBGA
The LCMXO3L-4300E-6MG324C is a MachXO3 family Field Programmable Gate Array (FPGA) in a 324‑VFBGA package designed for commercial applications. It combines programmable logic, embedded memory, and a high I/O count to support system control, interface bridging, and glue‑logic functions in compact, surface‑mount designs.
Built on the MachXO3 architecture, the device provides non‑volatile, multi‑time programmable capability and a range of on‑chip system resources that simplify integration and reduce board-level component count.
Key Features
- Programmable Logic — 4,320 logic elements (cells) for implementing control, glue logic, and custom finite state machines.
- Embedded Memory — 94,208 bits of on‑chip RAM (approximately 0.094 Mbits) to support buffering, FIFOs, and small data structures.
- High I/O Density — 268 I/O pins to interface with peripherals, sensors, and external logic without large external glue circuitry.
- Package & Mounting — 324‑VFBGA package (supplier device package: 324‑CSFBGA, 10×10) with surface‑mount mounting for compact board layouts.
- Power — Core voltage supply range from 1.14 V to 1.26 V to match target system power rails and enable predictable power budgeting.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for mainstream commercial environments.
- Non‑volatile, Multi‑time Programmable — MachXO3 family capability for persistent configuration and field reprogramming without external configuration memory.
- On‑chip System Resources — Family features include flexible on‑chip clocking (PLLs), an on‑chip oscillator, programmable I/O cells, and embedded hardened IP blocks (I²C, SPI, timers) to accelerate system design.
- Power Management & Test — Standby modes and configuration/test features described in the MachXO3 family datasheet support power saving and boundary-scan testability.
- RoHS Compliant — Meets restriction of hazardous substances requirements for environmental compliance.
Typical Applications
- System Control & Glue Logic — Implement board-level control, protocol glue, and custom state machines using the device’s 4,320 logic elements and abundant I/O.
- Interface Bridging — Use the high I/O count and programmable I/O cells to bridge between differing interfaces and peripheral buses.
- Embedded Peripheral Control — Leverage hardened I²C/SPI and timer IP blocks for local device management, sensor interfacing, and peripheral aggregation.
- On‑board Memory Functions — Small FIFO and buffering functions implemented using the ~94 Kbit embedded RAM for data staging and flow control.
Unique Advantages
- Highly integrated, non‑volatile FPGA: Multi‑time programmable MachXO3 architecture provides persistent configuration without external flash, simplifying BOM and board layout.
- Compact, high‑I/O package: 324‑VFBGA in a 10×10 supplier footprint supports dense connectivity in space‑constrained designs.
- Rich system resources on chip: On‑chip PLLs, oscillator, programmable I/O cells, and hardened I/O/IP reduce the need for external components and accelerate development.
- Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream commercial deployments where that operating range is required.
- Predictable power domain: Narrow core supply range (1.14 V–1.26 V) facilitates power budgeting and interface compatibility with common supply rails.
- Environmentally compliant: RoHS compliance supports regulatory and manufacturing requirements.
Why Choose LCMXO3L-4300E-6MG324C?
The LCMXO3L-4300E-6MG324C positions itself as a commercially graded, compact FPGA option for designs that require moderate logic capacity, substantial I/O, and on‑chip memory in a surface‑mount BGA footprint. Its MachXO3 family capabilities—non‑volatile configuration, embedded IP, and flexible clocking—help reduce external components and shorten time to market.
This device is suited to engineers and procurement teams building compact control, interface, and peripheral aggregation solutions who need a reliable, RoHS‑compliant FPGA with clear operating and power parameters. The MachXO3 family datasheet details additional architecture and system features to support implementation and validation.
Request a quote or submit an inquiry to receive pricing, lead‑time information, and support for integrating the LCMXO3L-4300E-6MG324C into your next design.