LCMXO3L-4300E-6MG324C

IC FPGA 268 I/O 324CSFBGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 268 94208 4320 324-VFBGA

Quantity 1,731 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSFBGA (10x10)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-VFBGANumber of I/O268Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3L-4300E-6MG324C – MachXO3 Field Programmable Gate Array, 4320 logic elements, 268 I/O, 324‑VFBGA

The LCMXO3L-4300E-6MG324C is a MachXO3 family Field Programmable Gate Array (FPGA) in a 324‑VFBGA package designed for commercial applications. It combines programmable logic, embedded memory, and a high I/O count to support system control, interface bridging, and glue‑logic functions in compact, surface‑mount designs.

Built on the MachXO3 architecture, the device provides non‑volatile, multi‑time programmable capability and a range of on‑chip system resources that simplify integration and reduce board-level component count.

Key Features

  • Programmable Logic — 4,320 logic elements (cells) for implementing control, glue logic, and custom finite state machines.
  • Embedded Memory — 94,208 bits of on‑chip RAM (approximately 0.094 Mbits) to support buffering, FIFOs, and small data structures.
  • High I/O Density — 268 I/O pins to interface with peripherals, sensors, and external logic without large external glue circuitry.
  • Package & Mounting — 324‑VFBGA package (supplier device package: 324‑CSFBGA, 10×10) with surface‑mount mounting for compact board layouts.
  • Power — Core voltage supply range from 1.14 V to 1.26 V to match target system power rails and enable predictable power budgeting.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for mainstream commercial environments.
  • Non‑volatile, Multi‑time Programmable — MachXO3 family capability for persistent configuration and field reprogramming without external configuration memory.
  • On‑chip System Resources — Family features include flexible on‑chip clocking (PLLs), an on‑chip oscillator, programmable I/O cells, and embedded hardened IP blocks (I²C, SPI, timers) to accelerate system design.
  • Power Management & Test — Standby modes and configuration/test features described in the MachXO3 family datasheet support power saving and boundary-scan testability.
  • RoHS Compliant — Meets restriction of hazardous substances requirements for environmental compliance.

Typical Applications

  • System Control & Glue Logic — Implement board-level control, protocol glue, and custom state machines using the device’s 4,320 logic elements and abundant I/O.
  • Interface Bridging — Use the high I/O count and programmable I/O cells to bridge between differing interfaces and peripheral buses.
  • Embedded Peripheral Control — Leverage hardened I²C/SPI and timer IP blocks for local device management, sensor interfacing, and peripheral aggregation.
  • On‑board Memory Functions — Small FIFO and buffering functions implemented using the ~94 Kbit embedded RAM for data staging and flow control.

Unique Advantages

  • Highly integrated, non‑volatile FPGA: Multi‑time programmable MachXO3 architecture provides persistent configuration without external flash, simplifying BOM and board layout.
  • Compact, high‑I/O package: 324‑VFBGA in a 10×10 supplier footprint supports dense connectivity in space‑constrained designs.
  • Rich system resources on chip: On‑chip PLLs, oscillator, programmable I/O cells, and hardened I/O/IP reduce the need for external components and accelerate development.
  • Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream commercial deployments where that operating range is required.
  • Predictable power domain: Narrow core supply range (1.14 V–1.26 V) facilitates power budgeting and interface compatibility with common supply rails.
  • Environmentally compliant: RoHS compliance supports regulatory and manufacturing requirements.

Why Choose LCMXO3L-4300E-6MG324C?

The LCMXO3L-4300E-6MG324C positions itself as a commercially graded, compact FPGA option for designs that require moderate logic capacity, substantial I/O, and on‑chip memory in a surface‑mount BGA footprint. Its MachXO3 family capabilities—non‑volatile configuration, embedded IP, and flexible clocking—help reduce external components and shorten time to market.

This device is suited to engineers and procurement teams building compact control, interface, and peripheral aggregation solutions who need a reliable, RoHS‑compliant FPGA with clear operating and power parameters. The MachXO3 family datasheet details additional architecture and system features to support implementation and validation.

Request a quote or submit an inquiry to receive pricing, lead‑time information, and support for integrating the LCMXO3L-4300E-6MG324C into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up