LCMXO3L-4300E-5UWG81ITR50
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 63 94208 4320 81-UFBGA, WLCSP |
|---|---|
| Quantity | 999 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 81-WLCSP (3.80x3.69) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 81-UFBGA, WLCSP | Number of I/O | 63 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO3L-4300E-5UWG81ITR50 – MachXO3 FPGA, 63 I/O, 81-WLCSP (3.80×3.69)
The LCMXO3L-4300E-5UWG81ITR50 is a MachXO3 family Field Programmable Gate Array (FPGA) IC in an 81-WLCSP package. It combines reprogrammable logic, embedded memory and flexible I/O to address industrial embedded designs that require non-volatile configuration and system-level integration.
With 4,320 logic elements, approximately 0.094 Mbits of embedded RAM and 63 general-purpose I/O, this device targets applications where compact packaging, low-voltage operation and temperature-tolerant performance are important.
Key Features
- Core Logic 4,320 logic elements and 540 logic blocks provide reprogrammable logic capacity for control, glue logic and finite-state implementations.
- Embedded Memory Approximately 0.094 Mbits (94,208 bits) of on-chip RAM for small data buffers, FIFOs and state storage.
- I/O and Interface 63 I/O pins with MachXO3 family I/O architecture including pre‑engineered source-synchronous I/O and flexible I/O buffer options documented in the family datasheet.
- Configuration and Reconfiguration Non-volatile, multi‑time programmable configuration with TransFR reconfiguration and user flash memory (UFM) options for field updates and design flexibility (MachXO3 family features).
- On-chip System Functions Hardened on-chip IP functions referenced in the family documentation such as I²C, SPI and timer/counter primitives, plus on‑chip oscillator and PLLs for flexible clocking.
- Power and Supply Low-voltage core operation with a specified supply range of 1.14 V to 1.26 V for efficient, modern system integration.
- Package and Mounting 81‑ball WLCSP (81-UFBGA) in a 3.80 × 3.69 mm footprint, surface-mount package suited for space-constrained board designs.
- Operating Conditions Industrial-grade operating range from −40 °C to 100 °C and RoHS compliance for deployment in temperature-challenging environments.
- System-Level Support Family documentation highlights routing, clock/control distribution, memory modes, hot‑socketing behavior and power-saving modes to support robust system integration.
Typical Applications
- Industrial Control — Reprogrammable logic and industrial temperature rating enable integration into factory automation, PLC auxiliary functions and control interfaces.
- Interface Bridging — Flexible I/O and on-chip IP (I²C, SPI) make the device suitable for protocol bridging, sensor aggregation and peripheral interface tasks.
- Embedded System Glue Logic — Compact WLCSP package and moderate logic density support board-level glue logic, state machines and configuration management in space-constrained designs.
- Field-Updatable Functions — Non-volatile multi-time programmable configuration and UFM support firmware-like updates and in-field reconfiguration workflows.
Unique Advantages
- Highly integrated, compact solution: Combines thousands of logic elements, embedded RAM and hardened IP in an 81‑ball WLCSP to reduce board area and BOM complexity.
- Low-voltage operation: 1.14–1.26 V core supply supports modern low-voltage system designs and efficient power architectures.
- Industrial temperature range: Specified operation from −40 °C to 100 °C for deployment in thermally demanding environments.
- Field reconfiguration and persistent storage: Non-volatile, multi-time programmable configuration and UFM enable in-field updates and flexible product lifecycles.
- System-level building blocks: Family-level features such as PLLs, on-chip oscillator, and hardened I²C/SPI provide ready-to-use primitives that simplify common embedded functions.
- RoHS compliant package: Surface-mount WLCSP in a small footprint suitable for compact, lead-free assemblies.
Why Choose LCMXO3L-4300E-5UWG81ITR50?
This MachXO3 device balances reprogrammable logic capacity, embedded memory and system-level IP in a compact WLCSP package engineered for industrial operating conditions. It is well suited to designers who need a low-voltage, field-updatable FPGA with flexible I/O and integrated support for common interface primitives.
Choose the LCMXO3L-4300E-5UWG81ITR50 when your design requires a small-footprint, RoHS-compliant FPGA that supports reconfiguration, embedded memory and resilient operation across −40 °C to 100 °C.
Request a quote or submit an inquiry to receive pricing and availability information for the LCMXO3L-4300E-5UWG81ITR50. Technical sales and product support can provide additional deployment details and supply options.
