LCMXO3L-4300E-5UWG81CTR50

IC FPGA 63 I/O 81WLCSP
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 63 94208 4320 81-UFBGA, WLCSP

Quantity 1,099 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package81-WLCSP (3.80x3.69)GradeCommercialOperating Temperature0°C – 85°C
Package / Case81-UFBGA, WLCSPNumber of I/O63Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3L-4300E-5UWG81CTR50 – MachXO3 FPGA, 4,320 logic elements, 63 I/Os, 81-WLCSP

The LCMXO3L-4300E-5UWG81CTR50 is a MachXO3 family field-programmable gate array (FPGA) from Lattice Semiconductor Corporation. It integrates approximately 4,320 logic elements, approximately 94 kbits of embedded RAM (94,208 bits), and 63 general-purpose I/Os in an 81-WLCSP package.

Designed for commercial-grade applications, this surface-mount device offers non-volatile, multi-time programmable configuration and family-level features such as flexible on-chip clocking, programmable I/O, hardened peripheral IP, and configurable memory modes—making it suitable for compact system control, I/O bridging, and in-field reconfiguration tasks.

Key Features

  • Core Logic  Approximately 4,320 logic elements to implement glue logic, control functions, and small to moderate FPGA designs.
  • Embedded Memory  Total RAM bits: 94,208 (approximately 94 kbits) with sysMEM capabilities including single/dual-port and FIFO modes as described in the MachXO3 family documentation.
  • I/O and Interface  63 I/O pins with family-level support for pre-engineered source synchronous I/O and flexible I/O buffering for a variety of interface roles.
  • Clocking  Flexible on-chip clocking including sysCLOCK PLLs for common clocking and timing requirements (MachXO3 family features).
  • On-chip Functions and Hardened IP  Family-level hardened IP options referenced in the datasheet include I2C, SPI, timer/counter, on-chip oscillator and user flash memory (UFM) for configuration and small data storage.
  • Configuration and Reconfiguration  Non-volatile, multi-time programmable configuration and TransFR reconfiguration support as part of the MachXO3 family feature set.
  • Package and Mounting  81-WLCSP package (supplier device package: 81-WLCSP (3.80x3.69)), surface-mount mounting type, optimized for space-constrained boards.
  • Power  Nominal supply voltage range: 1.14 V to 1.26 V, enabling low-voltage system designs aligned with the device’s recommended operating conditions.
  • Temperature and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant for modern manufacturing and environmental requirements.
  • Production-Test and System Integration  Family datasheet references IEEE 1149.1-compliant boundary scan testability, hot-socketing support, and TraceID for device traceability and system integration.

Typical Applications

  • System Control and Glue Logic  Implement control state machines, protocol adaptation, and peripheral glue logic using the device’s 4,320 logic elements and 63 I/Os.
  • I/O Bridging and Interface Adaptation  Use pre-engineered source synchronous I/O and flexible I/O buffering to bridge differing peripheral interfaces and provide timing-aligned data paths.
  • Embedded Memory Functions  Leverage approximately 94 kbits of embedded RAM for FIFOs, small buffers, and on-chip data staging in communication or control applications.
  • Field-Updatable Logic  Take advantage of non-volatile, multi-time programmable configuration and TransFR reconfiguration for in-field updates and iterative feature development.

Unique Advantages

  • Compact, low-profile packaging: The 81-WLCSP footprint provides a small board area solution for space-constrained designs.
  • Low-voltage operation: 1.14 V to 1.26 V supply range supports integration into modern low-voltage power rails.
  • Integrated memory and I/O: Built-in RAM (94,208 bits) and 63 I/Os reduce external component count for buffering and interfacing tasks.
  • Non-volatile configuration: Multi-time programmable, non-volatile configuration removes the need for external configuration memory in many designs.
  • Family-level hardened IP: On-chip I2C, SPI, timers, and oscillator options lower BOM and accelerate system integration where these functions are required.
  • Commercial-grade readiness: Operates across a 0 °C to 85 °C range and is RoHS compliant for standard commercial product lines.

Why Choose LCMXO3L-4300E-5UWG81CTR50?

The LCMXO3L-4300E-5UWG81CTR50 provides a balanced combination of logic density, embedded memory, and flexible I/O in a compact 81-WLCSP package. Its MachXO3 family capabilities—such as non-volatile configuration, flexible clocking, hardened peripheral IP, and on-chip memory modes—make it well suited for commercial designs that require compact, reconfigurable logic, interface adaptation, or system control without large external BOM additions.

This part is ideal for engineers designing space- and power-constrained systems who need a commercial-grade FPGA with on-chip configuration options and a broad set of family-level features to accelerate development and simplify board-level integration.

Request a quote or submit a pricing inquiry to evaluate LCMXO3L-4300E-5UWG81CTR50 for your next design.

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