LCMXO3L-4300E-5MG256I

The LCMXO3L-4300E-5MG256I is a MachXO3 family FPGA optimized for industrial and I/O-centric embedded systems. It delivers 4,320 logic elements with on-chip, multi-time programmable non-volatile configuration and embedded memory, packaged in a compact 256-pin VFBGA (CSPBGA) footprint.

Designed for applications that require flexible I/O, integrated memory and hardened system functions, this device combines configurable logic with features such as on-chip PLLs, embedded peripherals and reconfiguration options suitable for industrial temperature ranges.

Key Features

• Logic Capacity  4,320 logic elements for implementing combinational and sequential logic, state machines and glue logic.
• Embedded Memory  Approximately 94 kbits of on-chip RAM (94,208 total RAM bits) for FIFOs, buffers and small data stores.
• I/O Density  206 I/O pins to support broad peripheral connectivity and interface bridging in a single device.
• Non-volatile, Multi-time Programmable Configuration  On-device non-volatile configuration allows multiple reprogramming cycles without external configuration memory.
• Clocking and Timing  Built-in PLLs and flexible on-chip clock resources (sysCLOCK PLLs) for system clock management and source-synchronous I/O.
• Hardened Peripheral IP  Embedded hardened IP including I²C, SPI and timer/counter functions for common system interfaces and control tasks.
• Package & Mounting  256-VFBGA (CSPBGA) package, supplier device package 256-CSFBGA (9×9); surface-mount ready for compact board designs.
• Power Supply  Core voltage range 1.14 V to 1.26 V to match system power rails.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Standards & Testability  Support for boundary-scan testability and on-chip configuration and testing facilities, as described in the MachXO3 family documentation.
• Compliance  RoHS-compliant for global manufacturing requirements.

Typical Applications

• Industrial Control  Use as system glue logic, I/O aggregation and control functions in industrial automation and control equipment where extended temperature range and robust I/O are required.
• Interface Bridging & Protocol Conversion  Implement bridge logic and protocol adapters leveraging the device’s high I/O count and hardened I²C/SPI IP.
• Embedded System Supervisory  On-chip timers, non-volatile configuration and embedded RAM make the device suitable for supervisory, configuration and small-data buffering tasks in embedded systems.
• Sensor and Peripheral Aggregation  Aggregate signals from multiple sensors or peripherals and perform local preprocessing using the available logic and memory resources.

Unique Advantages

• High I/O in a compact BGA  206 I/O in a 256-pin VFBGA provides extensive connectivity without a large PCB footprint.
• Non-volatile, reprogrammable configuration  Multi-time programmable on-chip configuration eliminates the need for an external configuration flash for many designs.
• Integrated clocking and hardened IP  On-chip PLLs plus embedded I²C, SPI and timer/counter IP reduce external component count and simplify firmware.
• Industrial temperature rating  Rated from −40 °C to 100 °C to meet industrial environmental requirements.
• Compact embedded memory  Approximately 94 kbits of on-chip RAM for local buffering, FIFOs and small data structures.
• Low-voltage core compatibility  Core supply operating range of 1.14 V to 1.26 V aligns with modern low-voltage system power rails.

Why Choose LCMXO3L-4300E-5MG256I?

The LCMXO3L-4300E-5MG256I delivers a balanced combination of moderate logic capacity, high I/O density and non-volatile, multi-time programmable configuration in a compact VFBGA package. As a member of the MachXO3 family, it provides design-level features such as embedded memory, PLL-based clocking and hardened peripheral IP that simplify system design and reduce bill-of-materials for industrial and I/O-focused applications.

This device is well suited for engineers building industrial controllers, interface bridges and embedded supervisory logic who require robust operating temperature support, flexible clocking and on-chip resources to consolidate functionality into a single programmable device.

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