LCMXO3L-4300C-6BG324C

The LCMXO3L-4300C-6BG324C is a MachXO3 family Field Programmable Gate Array (FPGA) device offering a compact, surface-mount solution for mid-density programmable logic. It provides 4,320 logic elements, 279 user I/Os and 94,208 bits of on-chip RAM in a 324‑LFBGA (15×15) package, making it suitable for designs that require significant I/O capacity and on-chip memory in a commercial-grade device.

As a member of the MachXO3 family, the device supports family-level capabilities such as non-volatile, multi-time programmable configuration, embedded peripherals and flexible on-chip clocking and I/O resources described in the MachXO3 datasheet.

Key Features

• Logic Capacity — 4,320 logic elements (cells) to implement glue logic, state machines and mid-density FPGA functions.
• On‑chip Memory — 94,208 bits of total RAM for buffering, FIFOs and small data-store requirements.
• I/O and Packaging — 279 user I/Os in a 324‑LFBGA (15×15) package; surface-mount mounting type for board-level integration.
• Power and Temperature — Recommended supply range 2.375 V to 3.465 V and operating temperature range 0 °C to 85 °C (commercial grade).
• Non‑volatile Configuration — MachXO3 family supports non-volatile, multi-time programmable configuration and TransFR reconfiguration (family feature).
• Embedded IP and Peripherals — MachXO3 family includes hardened IP functions such as I²C and SPI cores, timers/counters, on‑chip oscillator and user flash memory (UFM), as referenced in the family datasheet.
• Clocking and I/O Flexibility — Family-level features include flexible on-chip clocking (PLLs) and high-performance, flexible I/O buffer structures for diverse signal standards (see MachXO3 family documentation).
• Regulatory and Mounting — Commercial grade device with RoHS compliance and surface-mount packaging for standard PCB assembly.

Typical Applications

• Interface bridging and board glue logic — Use the device’s 279 I/Os and 4,320 logic elements to implement protocol conversion, bus bridging and board-level control functions.
• Embedded control and peripheral offload — Leverage on-chip logic, 94,208 bits of RAM and MachXO3 family hardened peripherals (I²C, SPI, timers) to offload simple control and sensor aggregation tasks from a host MCU.
• Customizable I/O subsystems and HMI — Implement configurable I/O and user-interface control in a compact 324‑LFBGA package for commercial equipment and instrumentation.

Unique Advantages

• Highly integrated I/O and logic: 279 I/Os combined with 4,320 logic elements reduce external glue logic and simplify board design.
• On‑chip memory for buffering: 94,208 bits of embedded RAM support FIFOs, small data buffers and local state storage without external memory.
• Non‑volatile programmability: MachXO3 family non-volatile, multi-time programmable configuration enables field updates and simplified system boot.
• Compact surface-mount package: 324‑LFBGA (15×15) provides high pin count in a compact footprint suited to space-constrained PCBs.
• Flexible power range: Operates across 2.375 V to 3.465 V supply range to support diverse board power architectures.
• Commercial-grade compliance: Device is specified for 0 °C to 85 °C operation and is RoHS compliant for standard commercial applications.

Why Choose LCMXO3L-4300C-6BG324C?

The LCMXO3L-4300C-6BG324C delivers a balanced combination of logic density, extensive I/O and on-chip memory in a compact 324‑LFBGA surface-mount package. It is well suited to commercial designs that require flexible, non-volatile programmable logic, substantial I/O count and embedded peripherals as outlined in the MachXO3 family documentation.

Choose this device for mid-density FPGA tasks where board-level integration, configurable I/O and local memory are required, and where commercial temperature range and RoHS compliance meet project needs.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the LCMXO3L-4300C-6BG324C.