LCMXO3L-4300C-5BG400I
| Part Description |
MachXO3 Field Programmable Gate Array (FPGA) IC 335 94208 4320 400-LFBGA |
|---|---|
| Quantity | 2 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 400-CABGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-LFBGA | Number of I/O | 335 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO3L-4300C-5BG400I – MachXO3 Field Programmable Gate Array (FPGA) IC 335 I/O 4320 Logic Elements 400-LFBGA
The LCMXO3L-4300C-5BG400I is a MachXO3 family FPGA from Lattice Semiconductor designed for industrial embedded applications. It combines a flexible FPGA architecture with non-volatile, multi-time programmable configuration, offering on-chip resources for control, glue-logic, and subsystem integration.
With 4,320 logic elements, approximately 94 kbits of embedded RAM, and 335 I/O, this device targets systems requiring moderate logic density, extensive I/O, and reliable operation across a wide industrial temperature range.
Key Features
- Core Logic — 4,320 logic elements for implementing control, glue logic, and custom interfaces.
- Embedded Memory — Approximately 94 kbits (94,208 bits) of on-chip RAM for FIFOs, small buffers, and data storage.
- I/O Density & Flexibility — 335 I/O pins and programmable I/O cells with support for source-synchronous interfaces and flexible I/O buffering.
- Non‑Volatile, Multi‑time Programmable — Built-in non-volatile configuration with multi-time programmability for field updates and in-system reconfiguration.
- Hardened IP Blocks — Embedded hardened functions including I²C IP core, SPI IP core, and timer/counter blocks for common system tasks.
- Clocking & Timing — On-chip oscillators and sysCLOCK PLLs to support flexible clocking and synchronization schemes.
- Package & Mounting — 400-ball LFBGA (400-CABGA, 17 × 17 mm) surface-mount package suitable for compact board designs.
- Power & Operating Range — Operates from 2.375 V to 3.465 V supply and specified for industrial temperatures from −40 °C to 100 °C.
- System Test & Configuration — IEEE 1149.1-compliant boundary-scan testability and documented configuration and testing features.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Industrial Control — Implement PLC glue logic, interface bridging, and supervisory control functions that require reliable operation across −40 °C to 100 °C.
- Interface and Protocol Bridging — Translate between multiple serial and parallel interfaces using the device’s programmable I/O and embedded IP blocks (I²C, SPI).
- Embedded System Glue Logic — Centralize board-level control, reset sequencing, and configuration management with on-chip non-volatile configuration and timers.
- Sensor and I/O Aggregation — Aggregate and preprocess signals from large I/O counts for downstream processing or communication.
Unique Advantages
- High I/O Count for System Integration: 335 I/O pins enable consolidation of multiple peripheral interfaces onto a single device, reducing board complexity.
- Non‑Volatile Configuration: Multi-time programmable, non-volatile configuration simplifies deployment and field updates without external configuration flash.
- Embedded Hardened Functions: On-chip I²C, SPI, and timer/counter blocks reduce the need for external controllers and free logic resources for custom tasks.
- Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports use in temperature-challenging environments.
- Flexible Clocking: Integrated oscillators and PLLs provide the clocking options needed for synchronized interfaces and performance tuning.
- Compact, Surface-Mount Packaging: 400-LFBGA (17 × 17 mm) minimizes PCB footprint while providing high pin count.
Why Choose LCMXO3L-4300C-5BG400I?
The LCMXO3L-4300C-5BG400I delivers a balanced combination of logic density, I/O capacity, and on-chip resources for industrial embedded designs. Its non-volatile configuration, hardened peripheral IP, and flexible clocking options enable designers to implement control, interface bridging, and system supervisory functions with fewer external components.
This device is suited for engineers and procurement teams building industrial control systems, I/O aggregation modules, or embedded platforms that require moderate FPGA logic, a high number of I/O, and reliable operation across a wide temperature range. The MachXO3 family architecture and documented configuration/testing features help support system-level integration and deployment.
Request a quote or submit a request for pricing and availability for LCMXO3L-4300C-5BG400I to begin your design procurement process.