LCMXO3L-4300C-5BG400I

IC FPGA 335 I/O 400CABGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 335 94208 4320 400-LFBGA

Quantity 2 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package400-CABGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case400-LFBGANumber of I/O335Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO3L-4300C-5BG400I – MachXO3 Field Programmable Gate Array (FPGA) IC 335 I/O 4320 Logic Elements 400-LFBGA

The LCMXO3L-4300C-5BG400I is a MachXO3 family FPGA from Lattice Semiconductor designed for industrial embedded applications. It combines a flexible FPGA architecture with non-volatile, multi-time programmable configuration, offering on-chip resources for control, glue-logic, and subsystem integration.

With 4,320 logic elements, approximately 94 kbits of embedded RAM, and 335 I/O, this device targets systems requiring moderate logic density, extensive I/O, and reliable operation across a wide industrial temperature range.

Key Features

  • Core Logic — 4,320 logic elements for implementing control, glue logic, and custom interfaces.
  • Embedded Memory — Approximately 94 kbits (94,208 bits) of on-chip RAM for FIFOs, small buffers, and data storage.
  • I/O Density & Flexibility — 335 I/O pins and programmable I/O cells with support for source-synchronous interfaces and flexible I/O buffering.
  • Non‑Volatile, Multi‑time Programmable — Built-in non-volatile configuration with multi-time programmability for field updates and in-system reconfiguration.
  • Hardened IP Blocks — Embedded hardened functions including I²C IP core, SPI IP core, and timer/counter blocks for common system tasks.
  • Clocking & Timing — On-chip oscillators and sysCLOCK PLLs to support flexible clocking and synchronization schemes.
  • Package & Mounting — 400-ball LFBGA (400-CABGA, 17 × 17 mm) surface-mount package suitable for compact board designs.
  • Power & Operating Range — Operates from 2.375 V to 3.465 V supply and specified for industrial temperatures from −40 °C to 100 °C.
  • System Test & Configuration — IEEE 1149.1-compliant boundary-scan testability and documented configuration and testing features.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Industrial Control — Implement PLC glue logic, interface bridging, and supervisory control functions that require reliable operation across −40 °C to 100 °C.
  • Interface and Protocol Bridging — Translate between multiple serial and parallel interfaces using the device’s programmable I/O and embedded IP blocks (I²C, SPI).
  • Embedded System Glue Logic — Centralize board-level control, reset sequencing, and configuration management with on-chip non-volatile configuration and timers.
  • Sensor and I/O Aggregation — Aggregate and preprocess signals from large I/O counts for downstream processing or communication.

Unique Advantages

  • High I/O Count for System Integration: 335 I/O pins enable consolidation of multiple peripheral interfaces onto a single device, reducing board complexity.
  • Non‑Volatile Configuration: Multi-time programmable, non-volatile configuration simplifies deployment and field updates without external configuration flash.
  • Embedded Hardened Functions: On-chip I²C, SPI, and timer/counter blocks reduce the need for external controllers and free logic resources for custom tasks.
  • Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports use in temperature-challenging environments.
  • Flexible Clocking: Integrated oscillators and PLLs provide the clocking options needed for synchronized interfaces and performance tuning.
  • Compact, Surface-Mount Packaging: 400-LFBGA (17 × 17 mm) minimizes PCB footprint while providing high pin count.

Why Choose LCMXO3L-4300C-5BG400I?

The LCMXO3L-4300C-5BG400I delivers a balanced combination of logic density, I/O capacity, and on-chip resources for industrial embedded designs. Its non-volatile configuration, hardened peripheral IP, and flexible clocking options enable designers to implement control, interface bridging, and system supervisory functions with fewer external components.

This device is suited for engineers and procurement teams building industrial control systems, I/O aggregation modules, or embedded platforms that require moderate FPGA logic, a high number of I/O, and reliable operation across a wide temperature range. The MachXO3 family architecture and documented configuration/testing features help support system-level integration and deployment.

Request a quote or submit a request for pricing and availability for LCMXO3L-4300C-5BG400I to begin your design procurement process.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up