LCMXO3L-2100E-6MG256C

The LCMXO3L-2100E-6MG256C is a member of the MachXO3 family of non-volatile, multi-time programmable FPGAs from Lattice Semiconductor Corporation. It provides a low-to-mid density programmable logic fabric with flexible I/O and embedded memory for commercial electronic designs.

Built for board-level control, interface customization and system integration, this device combines 2,112 logic elements with on-chip RAM and a broad I/O count in a compact 256-VFBGA package, operating over a commercial temperature range.

Key Features

• Core Logic  2,112 logic elements (LEs) for implementing combinational and sequential logic functions suitable for glue logic, control and interface functions.
• Embedded Memory  Approximately 0.076 Mbits of embedded memory (75,776 bits) for small LUT-based RAM, FIFOs or buffering requirements.
• I/O Capacity  206 programmable I/Os providing broad interface options for signal routing and peripheral connectivity.
• Voltage and Power  Core voltage supply range of 1.14 V to 1.26 V to match platform power rails.
• Package & Mounting  256‑VFBGA (supplier device package: 256‑CSFBGA, 9×9) in a surface-mount form factor to save PCB area.
• Operating Range & Grade  Commercial grade device specified for 0 °C to 85 °C operation.
• Non‑volatile, Multi‑time Programmability  MachXO3 family architecture provides non-volatile configuration that is multi-time programmable, enabling persistent designs without external configuration memory.
• On-chip System Features  Family-level documentation highlights integrated functionality such as sysCLOCK PLLs, an on-chip oscillator, user flash memory (UFM), and embedded hardened IP (including I²C and SPI cores).
• System Test & Configuration  Supports documented configuration and test features including IEEE 1149.1-compliant boundary scan and reconfiguration mechanisms described in the MachXO3 family datasheet.
• RoHS Compliant  Device is RoHS compliant for environmental regulatory requirements.

Typical Applications

• Commercial Embedded Systems  Use as board-level glue logic, control sequencing or small-scale glue between processors and peripherals where non-volatile programmable logic is required.
• Interface Bridging  Ideal for implementing custom I/O translation, bus adaptation and protocol bridging leveraging the device’s 206 I/Os and programmable I/O buffers.
• User Interface Control  Well suited for managing displays, buttons, LEDs and other human-machine interface elements in commercial equipment.
• Prototyping & Development  A compact, reprogrammable platform for validating low-to-mid density logic designs prior to production in commercial products.

Unique Advantages

• Non-volatile configuration  Removes the need for an external configuration ROM by storing configuration on-chip, simplifying BOM and startup behavior.
• High I/O density  206 I/Os provide flexibility for connecting multiple peripherals and interfaces without large external glue logic.
• Compact packaging  256‑VFBGA (256‑CSFBGA, 9×9) enables a small PCB footprint while maintaining ample I/O and routing resources.
• Integrated system features  On-chip PLLs, oscillator, UFM and hardened I²C/SPI IP reduce the need for some external components and speed system integration.
• Commercial temperature rating  Specified 0 °C to 85 °C operation for mainstream commercial product deployment.
• Clear documentation  MachXO3 family datasheet provides architecture-level details (clocking, memory modes, I/O behavior and configuration/test features) to support engineering evaluation and design-in.

Why Choose LCMXO3L-2100E-6MG256C?

The LCMXO3L-2100E-6MG256C positions itself as a practical, non-volatile FPGA option for commercial designs that need modest programmable logic capacity, significant I/O count and compact packaging. Its MachXO3 family architecture combines configurable logic, on-chip RAM and integrated system features to simplify board-level integration and reduce external component count.

Designers seeking a documented, commercially rated FPGA for interface customization, control logic or prototype-to-production transitions will find this device delivers the documented building blocks—logic elements, embedded memory, PLLs, hardened IP and configuration/test capabilities—needed to accelerate development and deployment.

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