LCMXO3L-2100E-6MG256I

The LCMXO3L-2100E-6MG256I from Lattice Semiconductor Corporation is a MachXO3 family FPGA offering a compact, non-volatile programmable logic solution. It integrates 2,112 logic elements and approximately 75.8 Kbits of embedded RAM with up to 206 I/O pins in a 256-ball VFBGA/CSPBGA package.

Designed for industrial-temperature environments, this device targets applications that require on-board reprogrammable logic, flexible I/O, and low-voltage operation while benefiting from integrated system features described in the MachXO3 family datasheet.

Key Features

• Logic Fabric  2,112 logic elements provide mid-density programmable logic suitable for glue logic, control tasks, and finite-state implementations.
• On-chip Memory  Total RAM: 75,776 bits (approximately 75.8 Kbits) of embedded sysMEM for RAM/ROM/FIFO modes and small data buffering.
• I/O Capacity & Flexibility  Up to 206 I/O pins with high-performance, flexible I/O buffering and support for source-synchronous interfaces as described for the MachXO3 family.
• Non-volatile, Multi-time Programmable  Built-in non-volatile configuration supports multi-time programming and TransFR reconfiguration capabilities documented in the family datasheet.
• Clocking & Timing  Integrated on-chip oscillator and sysCLOCK PLLs enable flexible on-chip clock generation and distribution.
• Embedded Hardened IP  MachXO3 family includes hardened IP such as I²C and SPI cores and timer/counter functionality for common peripheral interfacing and control tasks.
• Power & Supply  Core supply range from 1.14 V to 1.26 V, enabling low-voltage system integration.
• Package & Mounting  256-VFBGA (CSPBGA) package; supplier device package listed as 256-CSFBGA (9×9). Surface-mount mounting type.
• Industrial Temperature Grade  Rated operating temperature from −40 °C to 100 °C for deployment in industrial environments.
• Standby & Power Saving  Family features include standby mode and power-saving options documented in the MachXO3 datasheet.
• RoHS Compliant  Device is RoHS compliant.

Typical Applications

• Embedded control and glue logic  Use the 2,112 logic elements and on-chip RAM for control sequencing, protocol translation, and system glue where a small non-volatile FPGA is required.
• Interface bridging  Up to 206 I/Os and source-synchronous I/O support enable board-level interface bridging and signal adaptation between subsystems.
• Peripheral and sensor aggregation  Hardened SPI/I²C cores and timer/counter functions simplify connecting and managing multiple sensors or peripherals in industrial systems.

Unique Advantages

• Non-volatile configuration  Multi-time programmable architecture removes the need for an external configuration device while enabling in-field updates.
• Compact, surface-mount packaging  256-ball VFBGA/CSPBGA (256-CSFBGA, 9×9) delivers a high pin count in a small footprint to conserve board area.
• Industrial-grade temperature range  Rated from −40 °C to 100 °C for reliable operation in industrial environments.
• Integrated system functions  On-chip oscillator, PLLs, hardened I/O and peripheral IP reduce external component count and simplify system design.
• Low-voltage core  1.14 V to 1.26 V supply range supports modern low-voltage system rails.
• Power management options  Standby mode and other power-saving features help reduce system power consumption when full logic capacity is not required.

Why Choose LCMXO3L-2100E-6MG256I?

The LCMXO3L-2100E-6MG256I positions itself as a compact, industrial-temperature MachXO3 family FPGA that combines mid-range logic capacity with integrated memory, flexible I/O, and non-volatile configuration. Its package and pin count make it a practical option for designs that need a programmable logic element without external configuration flash.

This device is well suited to embedded-system designers and engineers looking to reduce BOM complexity by leveraging on-chip peripherals and hardened IP while maintaining the ability to reprogram logic in the field. The MachXO3 family documentation provides detailed architecture and system-level features to support robust implementation and integration.

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