LCMXO3L-2100E-6MG121I

The LCMXO3L-2100E-6MG121I is a MachXO3 family FPGA providing a compact, non-volatile programmable fabric for system-level control and flexible I/O implementations. It integrates on-chip memory, configurable I/O, and hardened IP blocks to address a range of embedded and industrial system functions.

This device combines 2,112 logic elements with approximately 0.076 Mbits of embedded RAM and 100 I/O pins in a 121-ball VFBGA (6×6) surface-mount package, delivering a low-voltage (1.14 V to 1.26 V) solution rated for industrial temperature operation from −40 °C to 100 °C.

Key Features

• Programmable Logic 2,112 logic elements provide configurable digital logic resources based on the MachXO3 family architecture.
• Embedded Memory (sysMEM) Approximately 0.076 Mbits (75,776 bits) of on-chip RAM with support for single, dual, pseudo-dual port and FIFO modes as described in the MachXO3 datasheet.
• I/O Capacity and Flexibility 100 general-purpose I/O pins with pre‑engineered source synchronous I/O and a flexible on-chip I/O buffer supporting multiple standards and bank configurations.
• On-chip Clocking and Timing Integrated clocking resources including sysCLOCK PLLs and flexible clock distribution for on-chip timing management.
• Hardened IP and Peripherals Embedded hardened IP such as I²C, SPI, timer/counter, and an on-chip oscillator, enabling common system functions without external components.
• Non-volatile, Multi-time Programmable Configuration Built-in non-volatile configuration and TransFR reconfiguration support for field updates and system-level reprogramming.
• Package and Mounting 121-ball VFBGA (CSPBGA) surface-mount package, listed as 121-CSFBGA (6×6), for compact board integration.
• Power and Environmental Narrow supply window (1.14 V to 1.26 V) and industrial-grade operating temperature range from −40 °C to 100 °C. RoHS compliant.

Unique Advantages

• Highly integrated on-chip resources: 2,112 logic elements, embedded RAM, hardened IP cores and clocking resources reduce external component count and simplify board design.
• Compact package density: 121-ball VFBGA (6×6) enables dense placement in space-constrained designs while retaining 100 I/O pins.
• Industrial temperature capability: Rated from −40 °C to 100 °C for use in temperature-challenging environments where industrial-grade operation is required.
• Non-volatile configuration and field reprogramming: Multi-time programmable configuration and TransFR reconfiguration enable in-field updates and design iteration without external configuration memory.
• Low-voltage operation: Narrow 1.14 V to 1.26 V supply range supports designs targeting low-voltage domains and consistent power rails.
• Built-in system IP: Hardened I²C, SPI, timer/counter and oscillator functions reduce software and hardware integration effort for common system tasks.

Why Choose LCMXO3L-2100E-6MG121I?

The LCMXO3L-2100E-6MG121I positions itself as a compact, industrial-grade MachXO3 FPGA option for designs that require a balance of programmable logic, embedded memory, and flexible I/O in a small surface-mount package. Its non-volatile configuration, hardened peripherals, and integrated clocking make it suitable for system-level roles where in-field reconfiguration and consolidated functionality are valuable.

Designers seeking a single-device solution that combines logic density, on-chip memory, and a broad set of embedded features will find this part appropriate for a wide range of embedded and industrial applications, with the long-term value of firmware updateability and RoHS compliance.

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