LCMXO3L-2100E-5UWG49CTR1K

The LCMXO3L-2100E-5UWG49CTR1K is a MachXO3 family FPGA in a compact 49-WLCSP (3.11 × 3.19 mm) package designed for commercial embedded applications. It provides 2,112 logic elements, approximately 75.8 kbits of on‑chip RAM, and 38 user I/O pins, enabling small-footprint logic integration, interface glue functions, and control logic in space-constrained designs.

Built on the MachXO3 architecture, the device includes non-volatile, multi-time programmable configuration and on-chip system features such as PLLs, embedded memory modes, and power-saving options to support a range of commercial embedded use cases.

Key Features

• Core Logic  2,112 logic elements (cells) organized for flexible PFU/slice-based implementation as provided by the MachXO3 family architecture.
• Embedded Memory  Approximately 0.076 Mbits (75,776 bits) of total embedded RAM with support for single, dual, pseudo-dual port and FIFO modes.
• Programmable I/O  38 user I/O pins with advanced programmable I/O cell support and flexible I/O buffer options described in the MachXO3 family documentation.
• Configuration & Non‑volatile Storage  Non-volatile, multi-time programmable configuration with TransFR reconfiguration capability as part of MachXO3 family features.
• Clocking & Timing  On-chip clocking options including system PLLs and clock distribution networks documented for MachXO3 devices.
• Power & Voltage  Operates from a supply range of 1.14 V to 1.26 V and includes standby mode and power-saving options referenced in the device family data.
• Package & Mounting  49-UFBGA / 49-WLCSP supplier device package (3.11 × 3.19 mm); surface-mount mounting type for compact PCB designs.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature and specified as a commercial-grade device.
• Standards & Compliance  RoHS compliant per product environmental information.

Typical Applications

• Interface Bridging  Use the device’s 38 I/O pins and flexible I/O buffer support to implement GPIO expansion, protocol bridging, and board-level glue logic in compact designs.
• Embedded Control  Leverage 2,112 logic elements and on-chip RAM for state machines, configuration control, and small control subsystems where non-volatile, reprogrammable logic is required.
• Space-Constrained Modules  The 49-WLCSP (3.11 × 3.19 mm) package suits small modules and tightly packed PCBs that need programmable logic in a minimal area.

Unique Advantages

• Compact WLCSP Package: Minimizes board area while providing a full MachXO3 feature set in a 49-WLCSP (3.11 × 3.19 mm) form factor.
• Non‑volatile, Reprogrammable Configuration: Multi-time programmable on-chip configuration removes the need for external configuration memories for many applications.
• Balanced Integration: Combines ~2.1k logic elements, ~75.8 kbits of embedded RAM, and 38 I/O pins for efficient implementation of glue logic and small embedded systems.
• Low-Voltage Operation: Designed to operate from 1.14 V to 1.26 V, compatible with modern low-voltage power rails.
• Commercial Temperature Range: Rated for 0 °C to 85 °C to meet the needs of standard commercial electronic products.
• RoHS Compliant: Environmentally compliant for markets and supply chains requiring RoHS adherence.

Why Choose LCMXO3L-2100E-5UWG49CTR1K?

This MachXO3 family device offers a compact, integrated FPGA solution for commercial embedded designs that require reprogrammable non-volatile logic, modest embedded memory, and a moderate number of I/O in a very small package. Its configuration flexibility and on-chip features documented in the MachXO3 data provide a solid platform for reducing external components and simplifying board-level design.

The LCMXO3L-2100E-5UWG49CTR1K is well suited to engineers developing space-constrained modules, interface logic, or small control systems that benefit from on-device configurability and the MachXO3 architectural features.

If you need pricing, availability, or a formal quote for the LCMXO3L-2100E-5UWG49CTR1K, request a quote or submit an inquiry and our team will respond with the next steps.