LCMXO3L-2100E-5MG256I

The LCMXO3L-2100E-5MG256I is a MachXO3 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor, offered in a 256‑ball VFBGA/CSPBGA package and specified for industrial use. It provides a compact, non-volatile FPGA fabric with integrated block memory, programmable I/O, and on-chip system features aimed at control, glue-logic and system integration tasks in embedded designs.

This device combines a modest logic capacity with extensive I/O and embedded memory, supporting use cases that require reconfigurable logic, peripheral interfacing, and system-level integration within a low-profile surface-mount package and an operating range suited for industrial environments.

Key Features

• Logic Capacity — 2,112 logic elements and 264 logic blocks give you defined resources for small- to mid-scale programmable logic functions.
• Embedded Memory — Approximately 0.076 Mbits (75,776 bits) of on-chip RAM for FIFOs, small buffers and state storage.
• I/O Density — 206 general-purpose I/O pins to support multiple peripherals, buses and external interfaces from a single device.
• Non-volatile, Multi-time Programmable — MachXO3 family architecture provides non-volatile configuration and multi-time programmability for field updates and reconfiguration.
• Clocking and Timing — Built-in clock resources including PLLs and on-chip oscillator options for flexible clock distribution and timing control.
• Embedded IP and System Functions — Family-level documentation lists embedded hardened IP (I²C, SPI), timers/counters, User Flash Memory (UFM), and peripheral blocks that simplify common system tasks.
• Configuration and Reconfiguration — Supports TransFR reconfiguration and system-level configuration features described in the MachXO3 family datasheet.
• Power and Supply — Primary core supply range from 1.14 V to 1.26 V to match system power domains.
• Package and Mounting — 256‑VFBGA/CSPBGA (256‑CSFBGA 9×9) surface-mount package for space-constrained board designs.
• Industrial Temperature Grade — Specified operating temperature range from -40 °C to 100 °C for industrial applications.
• Standards and Tools — MachXO3 family documentation lists programmable I/O buffer features, source-synchronous I/O options and traceability features to aid system integration and testing.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• Industrial Control — Implement control logic, protocol adaptation and peripheral bridging where industrial temperature range and reconfigurable logic are required.
• Communications and Networking — Use as a protocol bridge, PHY interface controller or I/O concentrator leveraging 206 I/Os and on-chip clocking resources.
• Embedded System Glue Logic — Replace discrete glue components with a single, reconfigurable device to consolidate board area and simplify BOM for mixed-signal and digital systems.
• Sensor and Instrumentation Interfaces — Aggregate sensor inputs, manage timing and buffering with embedded RAM and programmable I/O in compact form factors.

Unique Advantages

• Compact, high-density I/O: 206 available I/Os enable consolidation of multiple external interfaces into one device, reducing external logic and PCB routing complexity.
• Non-volatile configuration: MachXO3 family non-volatile, multi-time programmable architecture removes the need for external configuration PROMs while enabling field updates.
• Industrial-ready thermal range: Rated from -40 °C to 100 °C, suitable for industrial deployments where extended temperature operation is required.
• Integrated memory for control tasks: Approximately 0.076 Mbits of embedded RAM supports FIFOs, small buffers and runtime state without external memory.
• Flexible packaging: 256‑VFBGA/CSPBGA (256‑CSFBGA 9×9) surface-mount package balances pin count and board-area efficiency for compact system designs.
• System-level features: On-chip oscillator, PLLs, embedded IP (I²C/SPI), UFM and power-saving modes from the MachXO3 family simplify system design and reduce external components.

Why Choose LCMXO3L-2100E-5MG256I?

The LCMXO3L-2100E-5MG256I provides a focused combination of reconfigurable logic, embedded memory and a high I/O count in a compact 256‑ball BGA package and an industrial temperature rating. It is well suited to engineers who need non-volatile FPGA functionality for control, interface consolidation and system integration while minimizing external parts.

As part of the MachXO3 family, this device benefits from documented family-level features such as programmable I/O buffering, on-chip clock resources, embedded peripheral IP and reconfiguration options that help shorten design cycles and simplify in-field updates.

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