LCMXO3L-2100E-5MG256C

The LCMXO3L-2100E-5MG256C is a member of the MachXO3 family of non-volatile, multi-time programmable FPGAs. It combines a flexible programmable fabric with hardened peripheral IP, on-chip memory, and a high-density I/O complement to support a wide range of system-control and interface functions.

Designed for commercial applications, this surface-mount 256‑VFBGA (CSPBGA) device offers 2,112 logic elements, 206 I/O pins, and approximately 0.076 Mbits of embedded RAM, operating from a 1.14 V to 1.26 V supply and specified for 0 °C to 85 °C. The device includes family-level features such as programmable I/O, on-chip clocking and PLLs, hardened I2C/SPI/timer IP, and TransFR reconfiguration.

Key Features

• Core Logic  2,112 logic elements (cells) provide a compact programmable fabric for control, glue logic, and protocol adaptation.
• Embedded Memory  75,776 bits of on-chip RAM—approximately 0.076 Mbits—support small FIFOs, state machines, and local buffering.
• High I/O Count  206 I/O pins enable broad interfacing options for buses, peripherals, and multiple domain signals.
• Hardened IP and Peripherals  Includes embedded hardened IP blocks documented in the MachXO3 family datasheet such as I2C, SPI and timer/counter functionality to simplify common system tasks.
• Clocking and Timing  Flexible on-chip clocking with PLLs and on-chip oscillator options for system clock generation and timing control (see family datasheet for details).
• Configuration and Reconfiguration  Non-volatile, multi-time programmable architecture with TransFR reconfiguration support for field updates and flexible deployment scenarios.
• Power and Supply  Low-voltage operation with a recommended supply range of 1.14 V to 1.26 V to match modern low-voltage system rails.
• Package and Mounting  256‑VFBGA (CSPBGA) surface-mount package; supplier device package listed as 256‑CSFBGA (9×9).
• Commercial Grade and Environmental  Specified for commercial operating temperatures from 0 °C to 85 °C and RoHS compliant.

Typical Applications

• System Control and Glue Logic  Use the device’s 2,112 logic elements and on-chip memory to implement control state machines, sequencing, and glue logic between subsystems.
• Interface Bridging  206 I/Os and flexible I/O buffers enable protocol translation and parallel/serial interface aggregation in compact designs.
• Embedded Peripheral Integration  Hardened I2C, SPI and timer/counter IP reduce external component count by consolidating peripheral control and monitoring on-chip.
• Field-Reconfigurable Logic  Non-volatile multi-time programmability and TransFR reconfiguration support iterative development and in-field updates without external configuration memory.

Unique Advantages

• Highly integrated, compact FPGA: Combines 2,112 logic elements, embedded RAM and hardened IP in a single 256‑VFBGA package to reduce BOM and board area.
• Extensive I/O connectivity: 206 I/Os make the device well suited for designs requiring multiple interfaces or dense signal routing.
• Field update capability: Non-volatile, multi-time programmable architecture with TransFR reconfiguration supports safe in-field updates and iterative design changes.
• Flexible clocking and timing: On-chip oscillator and PLL-based clocking options provide a range of timing strategies for embedded systems.
• Low-voltage operation: Narrow supply range (1.14 V–1.26 V) aligns with contemporary low-voltage digital domains.
• RoHS compliant, commercial grade: Surface-mount 256‑VFBGA package and 0 °C to 85 °C rating meet standard commercial manufacturing and environmental requirements.

Why Choose LCMXO3L-2100E-5MG256C?

The LCMXO3L-2100E-5MG256C positions itself as a compact, field-programmable solution for commercial embedded designs that need flexible I/O, built-in peripheral IP, and non-volatile configuration. With 2,112 logic elements, approximately 0.076 Mbits of on-chip RAM, and 206 I/Os in a 256‑VFBGA package, it is tailored for engineers aiming to consolidate control, interfacing, and lightweight buffering into a single, surface-mount component.

This MachXO3 family device is suited to projects that benefit from field reconfiguration, integrated timers and serial peripherals, and flexible clocking—all backed by the documentation and architecture of the MachXO3 family. Its commercial temperature grade and RoHS compliance make it appropriate for mainstream embedded and industrial-adjacent applications that operate within 0 °C to 85 °C.

Request a quote or submit an inquiry today to check pricing and availability for LCMXO3L-2100E-5MG256C and to discuss how it fits your next design.