LCMXO3L-2100E-5MG324I

IC FPGA 268 I/O 324CSFBGA
Part Description

MachXO3 Field Programmable Gate Array (FPGA) IC 268 75776 2112 324-VFBGA

Quantity 1,782 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSFBGA (10x10)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-VFBGANumber of I/O268Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO3L-2100E-5MG324I – MachXO3 Field Programmable Gate Array (FPGA), 2112 logic elements, 324‑VFBGA

The LCMXO3L-2100E-5MG324I is a MachXO3-family FPGA IC designed for industrial applications that need reconfigurable logic, abundant I/O and on-chip resources in a compact surface-mount package. As part of the MachXO3 family, this device provides non-volatile, multi-time programmable logic with embedded memory and hardened peripheral IP suitable for control, interface and glue‑logic roles in industrial systems.

Key hardware characteristics include 2,112 logic elements, approximately 0.076 Mbits of embedded RAM, 268 user I/Os and a 324‑VFBGA (10×10) package, with supply and environmental ranges tailored for industrial deployments.

Key Features

  • Logic Density — 2,112 logic elements for implementing moderate-complexity programmable logic and control functions.
  • Embedded Memory — Approximately 0.076 Mbits (75,776 bits) of on-chip RAM to support FIFOs, buffers and small data stores.
  • High I/O Count — 268 user I/Os and programmable I/O cells that enable flexible interfacing and signal routing for complex systems.
  • Programmable I/O and Clocking — Family-level features include programmable I/O buffer options, on-chip oscillator and PLL-based clocking (as documented for the MachXO3 family) for system timing and serial/parallel interface support.
  • Hardened Peripheral IP — MachXO3 family includes hardened I²C and SPI IP cores and timer/counter functions, providing common peripheral interfaces without consuming general-purpose logic.
  • Non-volatile, Multi-time Programmable — MachXO3 family architecture provides non-volatile configuration storage with multi-time programmability for field updates and secure boot options.
  • Power and Temperature — Operates from a core supply range of 1.14 V to 1.26 V and rated for industrial temperatures from -40 °C to 100 °C.
  • Package and Mounting — 324‑VFBGA (324‑CSFBGA, 10×10) surface-mount package for compact board-level integration; RoHS compliant.
  • System Reliability and Testability — MachXO3 family documentation references features such as configuration and boundary-scan testability to support production testing and system diagnostics.

Typical Applications

  • Industrial Control — Implement control logic, I/O aggregation and timing functions in systems operating across an industrial temperature range (-40 °C to 100 °C).
  • Interface Bridging & Glue Logic — High I/O count and programmable I/O cells make the device well suited for protocol bridging, bus interfacing and glue logic between subsystems.
  • Embedded Timing and Peripheral Offload — On-chip oscillator, PLLs and hardened IP (I²C, SPI, timers) allow offloading common peripheral and timing tasks from the main processor.
  • Configuration-Critical Systems — Non-volatile, multi-time programmable configuration supports persistent logic and field reconfiguration for evolving system requirements.

Unique Advantages

  • High I/O density: 268 available I/Os enable complex interfacing without external I/O expanders, reducing BOM and board complexity.
  • Industrial temperature rating: Specified operation from -40 °C to 100 °C supports deployments in demanding thermal environments.
  • Compact, manufacturable package: 324‑VFBGA (10×10) surface-mount package delivers a small footprint for space-constrained PCBs while supporting automated assembly.
  • Integrated peripheral IP: Hardened I²C, SPI and timer/counter functions free up logic resources and simplify common system tasks.
  • Non-volatile configuration: Multi-time programmable, non-volatile configuration enables persistent logic without external configuration memory.
  • Optimized for system timing: On-chip clocking resources (oscillator and PLLs described in the family datasheet) support local clock generation and synchronization needs.

Why Choose LCMXO3L-2100E-5MG324I?

The LCMXO3L-2100E-5MG324I positions itself as a practical, industrial-grade FPGA option within the MachXO3 family for designs that require a balance of logic capacity, substantial I/O and embedded resources in a compact package. Its combination of 2,112 logic elements, abundant I/O, on-chip RAM and hardened peripheral IP makes it suitable for control, interface and timing-centric subsystems.

Engineers and procurement teams can rely on the device’s specified supply and temperature ranges, RoHS compliance, and the MachXO3 family’s documented architecture and on-chip features to build scalable, reconfigurable solutions that simplify board-level design and support field updates.

Request a quote or submit a pricing and availability inquiry to evaluate the LCMXO3L-2100E-5MG324I for your next design.

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