LCMXO3L-2100E-5MG121I

The LCMXO3L-2100E-5MG121I is a MachXO3 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. This compact, surface-mount FPGA combines 2,112 logic elements with approximately 75,776 bits of embedded RAM and 100 user I/Os, delivering flexible programmable logic and on-chip memory for control, interfacing, and glue-logic functions.

Designed for industrial-grade applications, the device operates from a 1.14 V to 1.26 V supply and across an operating temperature range of −40 °C to 100 °C, in a 121-ball VFBGA/CSPBGA (121-CSFBGA, 6×6) package suitable for space-constrained PCBs.

Key Features

• FPGA Core  2,112 logic elements (cells) providing programmable fabric for state machines, control logic and custom peripheral functions.
• Embedded Memory  Approximately 75,776 bits of on-chip RAM (about 0.076 Mbits) for local data buffering, small FIFOs or code storage.
• I/O Capacity and Flexibility  100 user I/Os with series-level support for pre-engineered source-synchronous I/O and flexible I/O buffer options as described in the MachXO3 family documentation.
• On-chip System Functionality  MachXO3 family features include flexible on-chip clocking and embedded system-level IP (as described in the family datasheet) to simplify design integration.
• Power Supply  Low-voltage core operation with recommended supply range of 1.14 V to 1.26 V.
• Package and Mounting  121-ball VFBGA / CSPBGA package (supplier package: 121-CSFBGA, 6×6) in a surface-mount form factor for compact board layouts.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C and specified as industrial grade.
• RoHS Compliant  Device is RoHS compliant for environmental compatibility.

Typical Applications

• Industrial Control  Industrial-temperature rating and flexible programmable logic make this FPGA suitable for control, sequencing and interface tasks in industrial equipment.
• Interface Bridging  100 I/Os and family-level support for source-synchronous I/O enable board-level protocol bridging and peripheral interface consolidation.
• Compact Embedded Systems  Small 6×6 CSPBGA package and surface-mount mounting work well where PCB space is limited and moderate logic plus local memory are required.
• Peripheral and Glue Logic  On-chip memory and 2,112 logic elements allow implementation of glue logic, small state machines and peripheral aggregation without external components.

Unique Advantages

• Balanced Logic and Memory  2,112 logic elements paired with approximately 75,776 bits of embedded RAM provide an integrated solution for many mid-density control and interfacing tasks.
• High I/O Count in a Small Footprint  100 user I/Os in a 121-ball (6×6) CSPBGA package enable rich connectivity while preserving board area.
• Industrial Temperature Performance  −40 °C to 100 °C operating range supports deployment in a wide range of industrial environments.
• Low-Voltage Core  1.14 V to 1.26 V supply operation reduces core power and aligns with modern low-voltage system rails.
• Series-Level System Support  MachXO3 family documentation details features such as flexible on-chip clocking, embedded IP and reconfiguration options that simplify system-level design (see family datasheet for full details).
• Regulatory Compatibility  RoHS compliance supports environmental regulatory requirements for electronic assemblies.

Why Choose LCMXO3L-2100E-5MG121I?

The LCMXO3L-2100E-5MG121I positions itself as a compact, industrial-grade FPGA option for designs needing moderate programmable logic, on-chip memory and a substantial I/O complement in a small BGA package. Its combination of 2,112 logic elements, approximately 75,776 bits of embedded RAM and 100 I/Os enables designers to consolidate glue logic, interface bridging and peripheral control into a single device.

Backed by the MachXO3 family documentation, this device is suitable for developers and procurement teams targeting robust, space-efficient FPGA solutions with defined voltage and temperature characteristics and RoHS compliance.

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