LCMXO3D-9400HC-6BG400I

The LCMXO3D-9400HC-6BG400I is a MachXO3D family FPGA device providing non-volatile, reconfigurable logic in a 400-ball LFBGA package. It combines a mid-density logic fabric with embedded memory and extensive I/O to address board-level integration and system control tasks.

Designed for industrial applications, this device offers up to 335 user I/Os, a wide operating temperature range (−40°C to 100°C), and a broad supply voltage window (2.375 V to 3.465 V), enabling reliable operation in demanding environments.

Key Features

• Logic Capacity — 9,400 logic elements (cells) to implement mid-density FPGA designs and custom glue logic.
• Embedded Memory — Approximately 0.44 Mbits of on-chip RAM (442,368 bits) for data buffering, look-up tables, and small FIFOs.
• I/O and Packaging — 335 user I/Os in a 400-LFBGA (400-CABGA, 17 × 17) surface-mount package for high pin-count board-level integration.
• Power and Thermal — Operates from 2.375 V to 3.465 V and specified for −40°C to 100°C operation suitable for industrial environments.
• Non-volatile, Reconfigurable Architecture — MachXO3D family features non-volatile reconfiguration and TransFR reconfiguration support as part of device family capabilities.
• Clocking and Timing — Flexible on-chip clocking including phase-locked loops (PLLs) for system clocking and timing control as documented in the MachXO3D family data sheet.
• Embedded System IP — Hardened IP functions referenced in the device family include an Embedded Security Block (ESB), hardened I2C and SPI cores, and timers/counters for common system functions.
• System-level Features — On-chip oscillator, user flash memory (UFM), programmable I/O cells and pre-engineered source-synchronous I/O are identified features of the MachXO3D family.
• Industrial Grade — Supplied and specified as an industrial-grade device for deployment in temperature-challenging applications.

Typical Applications

• Industrial Control — Implement control logic, I/O aggregation and protocol bridging where wide temperature range and industrial qualification are required.
• Embedded System Glue Logic — Replace discrete logic and microcontroller peripherals with compact, reconfigurable logic and on-chip memory for board-level integration.
• Communications and I/O Expansion — Use the high I/O count and flexible I/O buffers to implement interface adaptation, buffering, and signal management.

Unique Advantages

• High Integration: 9,400 logic elements and approximately 0.44 Mbits of embedded memory reduce external component count and simplify board design.
• Flexible I/O and Packaging: 335 I/Os in a 400-LFBGA package allow dense routing and extensive peripheral connectivity on compact PCBs.
• Industrial Reliability: Specified operation from −40°C to 100°C and industrial grade classification make it suitable for harsh environments.
• Built-in System IP: Embedded security block, hardened I2C/SPI and timers reduce development time for common system functions.
• Non-volatile Reconfiguration: MachXO3D family non-volatile architecture enables retained configuration without external storage and supports system-level reconfiguration modes.
• Broad Supply Range: 2.375 V to 3.465 V supply flexibility eases power-rail integration across diverse designs.

Why Choose LCMXO3D-9400HC-6BG400I?

The LCMXO3D-9400HC-6BG400I positions itself as a mid-density, industrial-grade FPGA with a blend of logic capacity, embedded memory, and extensive I/O in an advanced 400-LFBGA package. It is well suited to engineers who need reconfigurable logic, on-chip system IP, and reliable operation across a wide temperature and supply range.

Backed by the MachXO3D device family documentation and on-chip features such as embedded security, flexible clocking, and UFM, this device streamlines subsystem integration and shortens development cycles for industrial and embedded applications.

Request a quote or submit an inquiry for LCMXO3D-9400HC-6BG400I to obtain pricing, availability, and lead-time details for your project.