LCMXO3D-9400HC-6BG256C

The LCMXO3D-9400HC-6BG256C is a MachXO3D family field programmable gate array (FPGA) in a compact 256-LFBGA package. It integrates 9,400 logic elements and approximately 0.44 Mbits of embedded RAM to deliver reconfigurable logic, embedded memory, and rich I/O for system control, interfacing, and security functions in commercial-temperature designs.

With 206 user I/Os, support for a 2.375 V to 3.465 V supply range, and commercial-grade operation from 0 °C to 85 °C, this device is targeted at applications requiring flexible on-chip resources, embedded security blocks and hardened peripherals as described in the MachXO3D family data sheet.

Key Features

• Logic Capacity — 9,400 logic elements (cells) suitable for complex glue-logic, protocol bridging, and moderate-sized FPGA functions.
• Embedded Memory — Approximately 0.44 Mbits (442,368 bits) of on-chip RAM for FIFOs, buffering and temporary storage.
• High I/O Count — 206 user I/Os to support broad external interfacing and parallel connectivity.
• Flexible I/O and Clocking (Family) — MachXO3D family features cited in the datasheet include pre‑engineered source synchronous I/O, flexible on‑chip clocking and high‑performance I/O buffers to support varied interface requirements.
• Embedded Hardened IP (Family) — The MachXO3D family data sheet references dedicated embedded security blocks and hardened IP such as SPI, I²C and timer/counter primitives to simplify system integration.
• Non-volatile, Reconfigurable Architecture (Family) — Family-level capabilities include non‑volatile reconfiguration and TransFR reconfiguration options as documented in the MachXO3D data sheet.
• Package & Mounting — 256-LFBGA (supplier package: 256-CABGA, 14×14 mm) in a surface-mount form factor for compact board layouts.
• Power and Temperature — Supply range 2.375 V to 3.465 V; commercial-grade operating range from 0 °C to 85 °C.
• Standards & Support (Family) — Family documentation includes system-level support features such as on‑chip oscillators, PLLs, memory modes, and boundary-scan testability described in the MachXO3D data sheet.
• RoHS Compliant — Device is RoHS compliant.

Typical Applications

• Interface Bridging and Protocol Conversion — Use the device’s 206 I/Os and flexible I/O buffering to implement parallel or serial interface bridges and protocol adapters.
• System Glue Logic and Control — 9,400 logic elements and on-chip RAM enable consolidation of discrete glue logic, control state machines, and timing functions into a single programmable device.
• Security and Embedded Key Storage — Family-level embedded security blocks and user flash memory (UFM) support secure configuration, authentication and protected storage tasks referenced in the MachXO3D documentation.
• User Interfaces and Peripheral Management — Combine the device’s logic capacity and abundant I/Os for keypad/LED control, sensor interfacing and local peripheral management.

Unique Advantages

• Balanced Logic and Memory — The combination of 9,400 logic elements and approximately 0.44 Mbits of embedded RAM supports a wide range of mid-density designs without external RAM.
• High I/O Density in a Compact Package — 206 I/Os in a 256-LFBGA (14×14) package enables feature-rich board designs while preserving PCB area.
• Flexible Power Options — Operates across a 2.375 V to 3.465 V supply range to accommodate different system domains and I/O standards handled by the MachXO3D family architecture.
• Commercial-Grade Operation — Rated for 0 °C to 85 °C for use in mainstream commercial applications.
• Family-Level Embedded IP and System Support — MachXO3D family documentation includes hardened IP and system-level features (PLLs, on-chip oscillator, security block, SPI/I²C, UFM) that streamline integration and reduce external component count.
• RoHS Compliance — Meets RoHS requirements for environmentally conscious manufacturing.

Why Choose LCMXO3D-9400HC-6BG256C?

The LCMXO3D-9400HC-6BG256C positions itself as a flexible, mid-density FPGA option within the MachXO3D family, delivering a balanced mix of logic resources, embedded memory, and a large I/O complement in a compact 256-LFBGA package. Its documented family features—such as embedded security blocks, configurable clocking, and hardened peripheral IP—make it suitable for designs that require integrated system functions and configurable hardware without relying on multiple discrete devices.

This device is well suited for engineers and procurement teams building commercial-temperature systems that require on‑chip reconfigurability, moderate embedded memory, and extensive I/O, backed by the MachXO3D family documentation and support materials.

If you’d like pricing or availability, request a quote or submit a quote inquiry today to receive commercial purchasing information for the LCMXO3D-9400HC-6BG256C.